专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP2624310A1 SOLAR CELL MODULE 审中-公开
标题翻译：太阳能电池模块
公开(公告)号：EP2624310A1
公开(公告)日：2013-08-07
申请号：EP11829045.1
申请日：2011-09-26
申请人： Hitachi Chemical Company, Ltd.
发明人： HAYASHI Hiroki , KATOGI Shigeki , NATORI Michiko , SUKATA Shinichirou , MOMOZAKI Aya
IPC分类号： H01L31/042
CPC分类号： H01L31/0512 , H01L31/022425 , Y02E10/50
摘要： It is an object of the present invention to provide a solar cell module excellent in reliability that can prevent yield decrease in the manufacture of a solar cell module, and, in addition, sufficiently maintain the characteristics of the solar battery even after a temperature cycle test. The present invention provides a solar cell module comprising a connection structure in which a plurality of solar cells each having electrodes on both surfaces are electrically connected to each other by a wiring member, wherein the connection structure includes a metal portion prepared by melting of a metal having a melting temperature of 200°C or less, electrically connecting the electrode to the wiring member, and a resin portion adhering the electrode to the wiring member.
摘要翻译：本发明的目的在于提供一种太阳能电池组件，其可靠性优异，能够防止太阳能电池组件的制造中的成品率降低，并且即使在温度循环试验后也能够充分保持太阳能电池的特性。本发明提供一种太阳能电池模块，其具有连接结构，在该连接结构中，两个表面上具有电极的多个太阳能电池通过布线构件彼此电连接，其中，所述连接结构包括通过熔化金属具有200℃或更低的熔化温度，将电极电连接到布线构件，以及将电极粘附到布线构件的树脂部分。

2. 发明公开

EP2490265A1 CONDUCTIVE ADHESIVE, SOLAR CELL, METHOD FOR MANUFACTURING SOLAR CELL, AND SOLAR CELL MODULE 审中-公开
标题翻译：导电性粘接材料，太阳能电池制造方法太阳能电池和太阳能电池模块
公开(公告)号：EP2490265A1
公开(公告)日：2012-08-22
申请号：EP10823444.4
申请日：2010-10-14
申请人： Hitachi Chemical Company, Ltd.
发明人： HAYASHI Hiroki , KATOGI Shigeki , SUKATA Shinichirou , NATORI Michiko , MOMOZAKI Aya
IPC分类号： H01L31/042 , C09J9/02 , C09J201/00 , H01B1/22
CPC分类号： H01B1/22 , C09J9/02 , H01L31/022425 , H01L31/048 , H01L31/0512 , Y02E10/50
摘要： A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220°C or lower. The conductive adhesive is used for electrically connecting and adhering wiring members 4a, 4b to electrodes 3a, 3b connected to a solar battery cell 6.
摘要翻译：本发明提供一种导电性粘合剂，其包含导电性粒子包括金属，热固性树脂，焊剂活性剂，并且优选的流变控制剂。导电性粒子的熔点优选为220℃或更低。导电性粘接剂用于电连接和布线秉承件4a，4b到电极3a，3b连接到太阳能电池单元6

4. 发明公开

EP2894641A1 SILVER PASTE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME 有权转让
标题翻译： SILBERPASTENZUSAMMENSETZUNG UND HALBLEITERBAUELEMENT DAMIT
公开(公告)号：EP2894641A1
公开(公告)日：2015-07-15
申请号：EP13835695.1
申请日：2013-08-05
申请人： Hitachi Chemical Company, Ltd.
发明人： ISHIKAWA Dai , MATSUMOTO Hiroshi , NATORI Michiko , NAKAKO Hideo , TANAKA Toshiaki
IPC分类号： H01B1/22 , H01L21/52
CPC分类号： B23K35/3006 , B23K35/025 , B23K35/362 , C22C5/06 , H01B1/22 , H01L23/3107 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/2732 , H01L2224/29139 , H01L2224/2929 , H01L2224/29339 , H01L2224/32221 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/8384 , H01L2224/92247 , H01L2924/014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/203 , H01L2924/2064 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2924/0002
摘要： A silver paste composition comprising silver particles having a particle diameter of 0.1 µm to 20 µm, and a solvent, wherein the above-described solvent comprises a solvent having a boiling point of 300°C or more.
摘要翻译：一种银膏组合物，其包含粒径为0.1μm至20μm的银颗粒和溶剂，其中上述溶剂包括沸点为300℃或更高的溶剂。

5. 发明授权

EP2862910B1 ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME 有权转让
标题翻译：粘合剂组合物和半导体器件
公开(公告)号：EP2862910B1
公开(公告)日：2017-03-15
申请号：EP13803841.9
申请日：2013-06-14
申请人： Hitachi Chemical Company, Ltd.
发明人： NAKAKO Hideo , TANAKA Toshiaki , NATORI Michiko , ISHIKAWA Dai , MATSUMOTO Hiroshi
IPC分类号： C08K3/08 , C09J11/04 , C08K7/00 , H01L23/495 , H01L23/00 , C09J11/00 , C09J9/02 , H01B1/22 , C09J1/00
CPC分类号： C09J11/04 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2003/0893 , C08K2201/001 , C09J1/00 , C09J9/02 , H01B1/22 , H01L23/49579 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83203 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass% or greater and the zinc atom content is from 0.01 mass% to 0.6 mass%, with respect to the total transition metal atoms in the solid portion of the adhesive composition.

6. 发明公开

EP2862910A1 ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME 有权转让
标题翻译： KLEBSTOFFZUSAMMENSETZUNG UND HALBLEITERVORRICHTUNG DAMIT
公开(公告)号：EP2862910A1
公开(公告)日：2015-04-22
申请号：EP13803841.9
申请日：2013-06-14
申请人： Hitachi Chemical Company, Ltd.
发明人： NAKAKO Hideo , TANAKA Toshiaki , NATORI Michiko , ISHIKAWA Dai , MATSUMOTO Hiroshi
IPC分类号： C09J1/00 , H01B1/00 , H01B1/22 , H01L21/52
CPC分类号： C09J11/04 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2003/0893 , C08K2201/001 , C09J1/00 , C09J9/02 , H01B1/22 , H01L23/49579 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83203 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass% or greater and the zinc atom content is from 0.01 mass% to 0.6 mass%, with respect to the total transition metal atoms in the solid portion of the adhesive composition.
摘要翻译：含有银原子的银粒子和含有金属锌的锌粒子的粘合剂组合物，其中银原子含量为90质量％以上，锌原子含量为0.01质量％〜0.6质量％，相对于总过渡金属原子在粘合剂组合物的固体部分。

7. 发明公开

EP2669955A1 SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：太阳能电池组件及其制造方法
公开(公告)号：EP2669955A1
公开(公告)日：2013-12-04
申请号：EP12739519.2
申请日：2012-01-11
申请人： Hitachi Chemical Company, Ltd.
发明人： MOMOZAKI Aya , KATOGI Shigeki , HAYASHI Hiroki , NATORI Michiko , SUKATA Shinichirou
IPC分类号： H01L31/04 , H01L31/042
CPC分类号： H01L31/18 , B32B17/10018 , B32B17/10091 , B32B17/10788 , B32B17/10807 , H01B1/02 , H01B1/026 , H01B1/22 , H01L24/26 , H01L24/28 , H01L24/29 , H01L24/30 , H01L31/022425 , H01L31/048 , H01L31/0512 , Y02E10/50
摘要： Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).
摘要翻译：提供一种太阳能电池模块的制造方法，其包括：涂布包含具有金属的导电性粒子等的导电性粘接剂组合物的工序（A）步骤（B），布置布线构件以便与所述太阳能电池单元的电极面对，其间插入所述导电粘合剂组合物; 步骤（C），用步骤（B）中获得的布线构件加热太阳能电池单元; （C）中得到的配线部件将太阳能电池单元的两面密封树脂层叠于太阳能电池单元的受光面上的保护玻璃和保护膜而形成的工序（D）在所述工序（C）中，使所述导电性粒子中的所述金属的熔点为所述加热温度以下，进行加热。

8. 发明公开

EP2669344A1 ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME 审中-公开
标题翻译： KLEBSTOFFZUSAMMENSETZUNG UND HALBLEITERVORRICHTUNG DAMIT
公开(公告)号：EP2669344A1
公开(公告)日：2013-12-04
申请号：EP12739920.2
申请日：2012-01-24
申请人： Hitachi Chemical Company, Ltd.
发明人： KONNO Kaoru , HAYASHI Hiroki , NATORI Michiko
IPC分类号： C09J1/00 , C09J9/02 , C09J11/06 , H01B1/22 , H01L21/52
CPC分类号： H01L24/28 , C08K3/08 , C08K5/04 , C08K7/06 , C08K2003/0806 , C09J9/00 , C09J11/04 , H01B1/02 , H01B1/22 , H01L23/49513 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/04026 , H01L2224/05147 , H01L2224/05655 , H01L2224/2731 , H01L2224/27318 , H01L2224/2732 , H01L2224/29294 , H01L2224/29339 , H01L2224/2939 , H01L2224/2949 , H01L2224/32227 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/8384 , H01L2224/85 , H01L2224/92147 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , Y10T428/2848 , H01L2924/00 , H01L2224/32225 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The adhesive composition of the present invention includes (A) flake silver particles wherein an oxygen state ratio derived from silver oxide measured by X-ray photoelectron spectroscopy is less than 15% and (B) an alcohol or carboxylic acid having a boiling point of 300°C or more.
摘要翻译：本发明的粘合剂组合物包括：（A）通过X射线光电子能谱测定的氧化银衍生的氧状态比小于15％的片状银粒子，（B）沸点为300的醇或羧酸 ℃以上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式