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    • 63. 发明公开
    • Synchronous dynamic random access memory
    • 同步电动机Dichtzugriffspeicher。
    • EP0646928A3
    • 1996-04-24
    • EP94115367.8
    • 1994-09-29
    • KABUSHIKI KAISHA TOSHIBA
    • Toda, Haruki
    • G11C11/409
    • G11C7/10G11C7/103G11C7/1072G11C11/4096
    • A synchronous DRAM has cell arrays arranged in matrix, divided into banks accessed asynchronously, and n bit I/O buses for transferring data among the cell arrays. In the DRAM, the banks are divided into m blocks, the n-bit I/O buses located between adjacent banks, is used for time sharing between adjacent banks in common, the n bit I/O buses, used for time sharing between adjacent banks in common, are grouped into n/m-bit I/O buses, every n/m bits for each block of m blocks of bank, and in each block in each bank, data input/output are carried out between the n/m-bit I/O buses and data bus lines in each block. A synchronous DRAM includes a first and second internal clock systems for controlling a burst data transfer in which a string of burst data being transferred in synchronism with an external clock signal, when one of the internal clock systems is driven, the burst data transfer is commenced immediately by the selected internal clock system.
    • 同步DRAM具有排列成矩阵的单元阵列,被划分为异步访问的单元,以及用于在单元阵列之间传送数据的n位I / O总线。 在DRAM中,银行分为m个块,位于相邻bank之间的n位I / O总线用于相邻bank之间的时间共享,n位I / O总线用于在相邻bank之间进行时间共享 共同组合被分组为n / m位I / O总线,每个m个块的每个块的每n / m位,并且在每个存储体的每个块中,数据输入/输出在n / 每个块中的m位I / O总线和数据总线。 同步DRAM包括用于控制突发数据传输的第一和第二内部时钟系统,其中当内部时钟系统中的一个被驱动时,突发数据传输开始,其中一串突发数据正在与外部时钟信号同步传输 立即由选定的内部时钟系统。
    • 65. 发明公开
    • Semiconductor memory device having split transfer function
    • Halbleiterspeicheranordnung mit geteiltemÜbertragungsbetrieb。
    • EP0673036A2
    • 1995-09-20
    • EP95103850.4
    • 1995-03-16
    • KABUSHIKI KAISHA TOSHIBA
    • Nagasaka, Shigeki
    • G11C7/00
    • G11C11/4096G11C7/1075
    • A semiconductor memory device including a serial I/O buffer (19); DRAM cells (1); and SAM cells (4,5) arranged in line, the SAM cells corresponding to the DRAM cells in one row. In the device in a first mode, the SAM cells (4,5) are divided into N first portions each having boundaries, data stored in the SAM cells being transferred to the serial I/O buffer (19) sequentially until the SAM cells in the boundaries of the first portions are transferred to the serial I/O buffer. In a second mode, the SAM cells (4,5) are divided into M (N>M) second portions each having boundaries, data stored in the SAM cells being transferred to the serial I/O buffer (19) sequentially until the SAM cells in the boundaries of the second portions are transferred to the serial input output buffer. The semiconductor memory device further includes a circuit for detecting changes from the first mode to the second mode and from the second mode to the first mode. The semiconductor memory device further includes a circuit for generating a first and a second signals. When a mode is changed from the first mode to the second mode, the circuit generates the first signal. When the mode is changed from the second mode to the first mode the circuit generates the second signal.
    • 一种包括串行I / O缓冲器(19)的半导体存储器件; DRAM单元(1); 和SAM单元(4,5),SAM单元对应于一行中的DRAM单元。 在第一模式的装置中,SAM单元(4,5)被划分为每个具有边界的N个第一部分,存储在SAM单元中的数据被依次传送到串行I / O缓冲器(19),直到SAM单元 第一部分的边界被传送到串行I / O缓冲器。 在第二模式中,SAM单元(4,5)被分成具有边界的M(N> M)个第二部分,存储在SAM单元中的数据被依次传送到串行I / O缓冲器(19),直到SAM 第二部分边界的单元被传送到串行输入输出缓冲器。 半导体存储器件还包括用于检测从第一模式到第二模式以及从第二模式到第一模式的变化的电路。 半导体存储器件还包括用于产生第一和第二信号的电路。 当模式从第一模式改变到第二模式时,电路产生第一信号。 当模式从第二模式改变到第一模式时,电路产生第二信号。