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41. 发明授权

EP1215722B1 Method of protecting a semiconductor wafer during a wafer-thinning step 有权
标题翻译：一种用于晶片的薄膜化期间保护半导体晶片的方法
公开(公告)号：EP1215722B1
公开(公告)日：2016-05-04
申请号：EP01129623.3
申请日：2001-12-12
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： Saimoto, Yoshihisa , Fujii, Yasuhisa , Kataoka, Makoto , Hirai, Kentaro , Fukumoto, Hideki , Koshimizu, Takanobu
IPC分类号： H01L21/68 , H01L21/58 , C09J7/02 , H01L23/00
CPC分类号： H01L21/6835 , C09J7/22 , C09J7/38 , C09J2203/326 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2224/274 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01056 , H01L2924/01075 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/00 , H01L2924/3512
摘要： This invention aims to provide a protecting method for a semiconductor wafer which can prevent breakage of a semiconductor wafer even when a semiconductor wafer is thinned to a thickness of 200 µm or less, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method. According to this invention, there is provided a protecting method for a semiconductor wafer comprising a first step of adhering a surface protecting adhesive film for a semiconductor wafer to a circuit-formed surface of the semiconductor wafer, a second step of processing a non-circuit-formed surface of the semiconductor wafer and a third step of adhering a bonding film for die bonding to the non-circuit-formed surface of the semiconductor wafer, characterized in that the third step is performed without peeling the surface protecting adhesive film for the semiconductor wafer, and an adhesive film in which an adhesive layer is formed on one surface of a substrate film at least one layer of which is made of a resin having a melting point of 200°C or more is used, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method.

42. 发明公开

EP3009486A1 ADHESIVE SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, METHOD FOR MANUFACTURING THERMAL AIRFLOW SENSOR USING SAME, AND THERMAL AIRFLOW SENSOR 有权转让
标题翻译： KLEBEFOLIE，方法用于制造半导体组件，用于生产热线式空气流量传感器和热空气流量传感器
公开(公告)号：EP3009486A1
公开(公告)日：2016-04-20
申请号：EP14810749.3
申请日：2014-04-18
申请人： Hitachi Automotive Systems, Ltd.
发明人： IKEO, Satoshi , SAGAWA, Toshifumi , DOI, Ryosuke , KIKUCHI, Hiroshi , MUKUNO, Hideki
IPC分类号： C09J7/00 , C09J11/04 , C09J201/00 , G01F1/692 , H01L21/02 , H01L21/301 , H01L21/52
CPC分类号： H01L21/6836 , C09J7/00 , C09J7/20 , C09J201/00 , C09J2203/326 , G01F1/6845 , G01F1/692 , G01F5/00 , G01F15/10 , H01L21/565 , H01L21/78 , H01L23/3107 , H01L2221/68327 , H01L2221/68377 , H01L2224/05554 , H01L2224/27436 , H01L2224/298 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2924/10155 , H01L2924/10158 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.

43. 发明公开

EP3007212A1 SEMICONDUCTOR WAFER PROTECTION FILM AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE 有权
标题翻译： HERBLEITER-WAFER-SCHUTZFOLIE UND HERSTELLUNGSVERFAHRENFÜRHALBLEITERBAUELEMENT
公开(公告)号：EP3007212A1
公开(公告)日：2016-04-13
申请号：EP14805148.5
申请日：2014-05-22
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： MORIMOTO Akimitsu , KATAOKA Makoto , FUKUMOTO Hideki
IPC分类号： H01L21/304 , B32B27/30 , C09J7/02 , C09J133/00 , H01L21/301
CPC分类号： H01L21/6836 , B32B27/06 , B32B27/08 , B32B27/30 , B32B2457/14 , C08F222/1006 , C09J7/29 , C09J133/10 , C09J2201/162 , C09J2203/326 , C09J2433/006 , H01L21/02057 , H01L21/6835 , H01L21/78 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2221/68381 , C08F2220/1858 , C08F2220/1808 , C08F2220/325 , C08F220/14
摘要： According to the present invention, there is provided a semiconductor wafer protective film including a substrate layer (A) and an adhesive layer (C) formed on the substrate layer (A) , in which the substrate layer (A) includes polymer, and a solubility parameter of the polymer determined by a Van Krevelen method is equal to or greater than 9.
摘要翻译：根据本发明，提供一种半导体晶片保护膜，其包括基板层（A）和形成在基板层（A）上的粘合层（C），其中基板层（A）包括聚合物，并且通过Van Krevelen方法测定的聚合物的溶度参数等于或大于9。

44. 发明公开

EP3007211A1 ELECTRONIC MEMBER PEELING METHOD AND LAMINATED BODY 审中-公开
标题翻译：电子元件剥离方法和层压体
公开(公告)号：EP3007211A1
公开(公告)日：2016-04-13
申请号：EP14803829.2
申请日：2014-05-22
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： USUGI Shinichi , IGARASHI Kouji , MORIMOTO Akimitsu
IPC分类号： H01L21/304
CPC分类号： H01L21/6835 , B32B43/006 , C09J5/00 , C09J2203/326 , C09J2205/302 , C09J2205/31 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386
摘要： Provided is a method of peeling an electronic member (16) from a laminate (10) composed of the electronic member (16) adhered to a supporting substrate (12) via an adhesive film (14), the adhesive film (14) having a self-peeling adhesive layer (17) on a surface located on the side of the supporting substrate (12) and an exposed region A in at least one part of a surface (14a) which is located on the side of the electronic member (16). The method includes: a step of reducing adhesive strength between the supporting substrate (12) and the self-peeling adhesive layer (17) in the region A by applying energy on the region A; a step of removing the supporting substrate (a) from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate (a) and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate (a) and the self-peeling adhesive layer; and a step of peeling the electronic member (16) from the laminate by removing the adhesive film (14) from the electronic member (16).
摘要翻译：本发明提供一种从经由粘接膜（14）粘接于支撑基板（12）的电子部件（16）构成的层叠体（10）上剥离电子部件（16）的方法，该粘接膜（14）在位于支撑基板（12）一侧的表面上的自剥离粘合剂层（17）和位于电子部件（16）侧的表面（14a）的至少一部分中的暴露区域A ）。该方法包括：通过在区域A上施加能量来降低区域A中的支撑基板（12）和自剥离粘合剂层（17）之间的粘合强度的步骤; 通过在该区域上进一步施加能量而从层压体去除支撑基材（a）的步骤，并且因此进一步降低在支撑基材（a）和自剥离粘合剂层之间的先前步骤中从开始点降低的粘合强度支撑基板（a）和自剥离粘合剂层之间的界面; 以及通过从电子部件（16）去除粘合膜（14）而从层压体上剥离电子部件（16）的步骤。

45. 发明公开

EP2991079A1 Electrically conductive composition 有权
标题翻译： ElektrischleitfähigeZusammensetzung
公开(公告)号：EP2991079A1
公开(公告)日：2016-03-02
申请号：EP14196871.9
申请日：2014-12-09
申请人： Heraeus Deutschland GmbH & Co. KG
发明人： Dickel, Tanja , Fritzsche, Sebastian , Hanselmann, Daniel , Stenger, Katja
IPC分类号： H01B1/22
CPC分类号： C09J9/02 , C08K3/042 , C08K3/08 , C08K2003/0806 , C08K2201/001 , C08K2201/005 , C09J163/00 , C09J2203/326 , C09J2205/102 , H01B1/124 , H01B1/22
摘要： An electrically conductive composition comprising
(A) 2 to 35 vol.-% of electrically conductive particles having an average particle size in the range of 1 to 25 µm and exhibiting an aspect ratio in the range of 5 to 30 : 1,
(B) 10 to 70 vol.-% of non-metallic particles having an average particle size in the range of 1 to 25 µm, exhibiting an aspect ratio in the range of 1 to 3 : 1,
(C) 30 to 80 vol.-% of a curable resin system, and
(D) 0 to 10 vol.-% of at least one additive,

wherein the sum of the vol.-% of particles (A) and (B) totals 25 to 65 vol.-%.
摘要翻译：一种导电性组合物，其包含（A）2〜35体积％的平均粒径为1〜25μm，纵横比为5〜30:1的导电性粒子，（B） 10〜70体积％的平均粒径为1〜25μm的非金属粒子，纵横比为1〜3:1，（C）为30〜80体积％的（D）0至10体积％的至少一种添加剂，其中颗粒（A）和（B）的体积％的总和为25至65体积％。

46. 发明公开

EP2982727A1 CONDUCTIVE ADHESIVE, ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICES USING BOTH 有权转让
标题翻译： LEITFÄHIGERKLEBSTOFF，ANISOTROPELEITFÄHIGEFOLIE UND ELEKTRONISCHE VORRICHTUNGEN MIT
公开(公告)号：EP2982727A1
公开(公告)日：2016-02-10
申请号：EP14778798.0
申请日：2014-03-27
申请人： Showa Denko K.K.
发明人： UCHIDA Hiroshi , ISHIBASHI Yoshitaka
IPC分类号： C09J163/10 , C08F299/02 , C09J7/02 , C09J9/02 , C09J133/14 , H01B1/00 , H01B1/22 , H01B1/24 , H01B5/00
CPC分类号： C09J9/02 , C08K3/08 , C08K7/18 , C08K2003/0806 , C08K2003/0831 , C08K2003/085 , C08K2003/0862 , C09D133/068 , C09J7/00 , C09J7/10 , C09J133/14 , C09J163/10 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2433/00 , C09J2463/00 , H01B1/22
摘要： Provided are a conductive adhesive and an anisotropic conductive film capable of suppressing deterioration by halogen at an adhesion portion, and using an epoxy (meth) acrylate resin, and further provided is an electronic device using such a conductive adhesive and an anisotropic conductive film. In a conductive adhesive and an anisotropic conductive film comprising conductive fillers and a binder resin, an epoxy (meth)acrylate resin contained in the binder resin is formed by adding a (meth) acrylic acid to an epoxy compound having the sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, and preferably 50 mass ppm or less, and the conductive fillers are dispersed in the binder resin containing the epoxy (meth)acrylate resin. The epoxy (meth) acrylate resin can be obtained by using raw material compound (substrate) having a carbon-carbon double bond, epoxidizing the carbon-carbon double bond preferably using hydrogen peroxide as an oxidant, and further adding a (meth)acrylic acid thereto.
摘要翻译：提供能够抑制粘附部分的卤素劣化的导电粘合剂和各向异性导电膜，并且使用环氧（甲基）丙烯酸酯树脂，并且还提供使用这种导电粘合剂和各向异性导电膜的电子器件。在包含导电填料和粘合剂树脂的导电粘合剂和各向异性导电膜中，粘合剂树脂中包含的环氧（甲基）丙烯酸酯树脂通过将（甲基）丙烯酸加入具有总氯原子总和的环氧化合物浓度和总溴原子浓度为300质量ppm以下，优选为50质量ppm以下，导电性填料分散在含有环氧（甲基）丙烯酸酯树脂的粘合剂树脂中。环氧（甲基）丙烯酸酯树脂可以通过使用具有碳 - 碳双键的原料化合物（基材），优选使用过氧化氢作为氧化剂环氧化碳 - 碳双键，并进一步加入（甲基）丙烯酸于此。

47. 发明公开

EP2966136A1 ADHESIVE FILM AND METHOD FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE USING SAME 有权
标题翻译：用于制造有机电子器件的粘合膜和方法
公开(公告)号：EP2966136A1
公开(公告)日：2016-01-13
申请号：EP14833859.3
申请日：2014-08-05
申请人： LG Chem, Ltd.
发明人： CHO, Yoon Gyung , BAE, Kyung Yul , YOO, Hyun Jee
IPC分类号： C09J7/00 , C09J9/00 , C09J121/00
CPC分类号： C09J109/00 , C09J4/00 , C09J7/00 , C09J7/10 , C09J7/20 , C09J9/00 , C09J123/22 , C09J133/08 , C09J145/00 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2205/114 , C09J2409/00 , C09J2415/003 , C09J2423/00 , C09J2423/003 , C09J2433/003 , H01L51/0001 , H01L51/0026 , H01L51/004 , H01L51/0043 , H01L51/0094 , H01L51/5237 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , Y10T428/2883
摘要： Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.
摘要翻译：提供一种压敏粘合剂膜及使用其的有机电子装置的制造方法。本发明提供可以有效地阻挡从外部环境侵入到有机电子器件中的水分或氧气，在高温高湿等苛刻的条件下显示可靠性并且具有优异的光学特性的粘合膜。

48. 发明公开

EP2833394A4 CIRCUIT CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING SAME 审中-公开
标题翻译：电路连接材料和用于半导体器件这种方法
公开(公告)号：EP2833394A4
公开(公告)日：2015-12-02
申请号：EP13767783
申请日：2013-03-06
申请人： DEXERIALS CORP
发明人： MORIYAMA HIRONOBU
IPC分类号： H01L21/58 , C09J7/00 , H01L21/60
CPC分类号： H01L21/78 , C09J7/00 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2203/326 , H01L21/563 , H01L21/6836 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/91 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/11002 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16057 , H01L2224/16145 , H01L2224/16225 , H01L2224/27002 , H01L2224/27436 , H01L2224/29005 , H01L2224/29082 , H01L2224/2929 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81805 , H01L2224/81815 , H01L2224/81855 , H01L2224/83191 , H01L2224/83203 , H01L2224/83204 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2225/06513 , H01L2924/01322 , H01L2924/14 , Y10T403/479 , H01L2924/00 , H01L2224/11 , H01L2224/27 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01051 , H01L2924/0665 , H01L2924/207 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2924/05341 , H01L2924/0532
摘要： Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material (20), in which a first adhesive layer (21) to be adhered to the semiconductor chip (10) side, and a second adhesive layer (22) having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer (21) are laminated. When the semiconductor chip (10) on which the circuit connecting material (20) is stuck is mounted on a circuit board (30), a thickness (Hb1) of the first adhesive layer (21) is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.

49. 发明公开

EP2940716A1 DICING-SHEET SUBSTRATE FILM AND DICING SHEET 审中-公开
标题翻译： SCHNEIDEFOLIENSUBSTRATFILM UND SCHNEIDEFOLIE
公开(公告)号：EP2940716A1
公开(公告)日：2015-11-04
申请号：EP13867972.5
申请日：2013-10-09
申请人： LINTEC Corporation
发明人： TAYA Naoki , UEDA Masashi , ITO Masaharu
IPC分类号： H01L21/301
CPC分类号： H01L21/6836 , B32B27/08 , B32B27/308 , B32B27/32 , B32B2405/00 , C08J5/18 , C08J2309/06 , C08J2323/06 , C09J7/29 , C09J2201/162 , C09J2201/606 , C09J2203/326 , C09J2205/114 , C09J2423/046 , C09J2425/006 , C09J2433/006 , H01L21/683 , Y10T428/31913
摘要： A dicing sheet base film (2) includes a resin layer (A). The resin layer (A) contains: a polyethylene (a1) that has a density of 0.900 g/cm 3 or more; and a styrene-based elastomer (a2). The polyethylene (a1) has a content of 50 mass% or more and 90 mass% or less to a total resin component contained in the resin layer (A), while the styrene-based elastomer (a2) has a content of 10 mass% or more and 50 mass% or less to the total resin component. The dicing sheet base film (2) suppresses the occurrence of dicing debris during the dicing of a cut object without imparting physical energy such as electron rays and γ rays, and has sufficient expandability in the expanding process.
摘要翻译：切割片基材膜（2）包括树脂层（A）。树脂层（A）含有：密度为0.900g / cm 3以上的聚乙烯（a1）和苯乙烯系弹性体（a2）。聚乙烯（a1）的含量相对于树脂层（A）中含有的树脂成分总量为50质量％以上且90质量％以下，苯乙烯系弹性体（a2）的含量为10质量％以上且50质量％以下。切割片基材薄膜（2）在切割物体的切割时抑制切割碎屑的发生，而不会施加诸如电子射线和³射线的物理能量，并且在膨胀过程中具有足够的可扩展性。

50. 发明公开

EP2900779A1 ADHESIVE COMPOSITION AND ADHESIVE TAPE 失效
标题翻译： HAFTZUSAMMENSETZUNG UND HAFTBAND
公开(公告)号：EP2900779A1
公开(公告)日：2015-08-05
申请号：EP12885253.0
申请日：2012-09-29
申请人： 3M Innovative Properties Company
发明人： WAN, Hongmei , WU, Qing , LI, Zhou , QIN, Liang , KONG, Fanwang
IPC分类号： C09J163/00 , C09J9/02 , C09J7/02
CPC分类号： C09J163/00 , C08K3/016 , C08K3/22 , C08K3/38 , C08K2201/001 , C08L31/04 , C08L33/08 , C08L71/00 , C09J7/38 , C09J2201/128 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2400/263 , C09J2463/00 , C09J2467/006 , C09J2479/086 , Y10T428/1476 , Y10T428/287
摘要： The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.
摘要翻译：本发明提供基于组合物总重量的导热粘合剂组合物，其包含：（a）5-70重量％的环氧组分; （b）5-60重量％的导热材料; （c）0.001-10重量％的光引发剂; （d）0-40重量％的热塑性聚合物; （e）0-50重量％的羟基官能组分; 和（f）0-50重量％的无卤阻燃剂。本发明还提供一种包含粘合剂组合物的导热胶带。

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