专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP2940716A1 DICING-SHEET SUBSTRATE FILM AND DICING SHEET 审中-公开
标题翻译： SCHNEIDEFOLIENSUBSTRATFILM UND SCHNEIDEFOLIE
公开(公告)号：EP2940716A1
公开(公告)日：2015-11-04
申请号：EP13867972.5
申请日：2013-10-09
申请人： LINTEC Corporation
发明人： TAYA Naoki , UEDA Masashi , ITO Masaharu
IPC分类号： H01L21/301
CPC分类号： H01L21/6836 , B32B27/08 , B32B27/308 , B32B27/32 , B32B2405/00 , C08J5/18 , C08J2309/06 , C08J2323/06 , C09J7/29 , C09J2201/162 , C09J2201/606 , C09J2203/326 , C09J2205/114 , C09J2423/046 , C09J2425/006 , C09J2433/006 , H01L21/683 , Y10T428/31913
摘要： A dicing sheet base film (2) includes a resin layer (A). The resin layer (A) contains: a polyethylene (a1) that has a density of 0.900 g/cm 3 or more; and a styrene-based elastomer (a2). The polyethylene (a1) has a content of 50 mass% or more and 90 mass% or less to a total resin component contained in the resin layer (A), while the styrene-based elastomer (a2) has a content of 10 mass% or more and 50 mass% or less to the total resin component. The dicing sheet base film (2) suppresses the occurrence of dicing debris during the dicing of a cut object without imparting physical energy such as electron rays and γ rays, and has sufficient expandability in the expanding process.
摘要翻译：切割片基材膜（2）包括树脂层（A）。树脂层（A）含有：密度为0.900g / cm 3以上的聚乙烯（a1）和苯乙烯系弹性体（a2）。聚乙烯（a1）的含量相对于树脂层（A）中含有的树脂成分总量为50质量％以上且90质量％以下，苯乙烯系弹性体（a2）的含量为10质量％以上且50质量％以下。切割片基材薄膜（2）在切割物体的切割时抑制切割碎屑的发生，而不会施加诸如电子射线和³射线的物理能量，并且在膨胀过程中具有足够的可扩展性。

2. 发明公开

EP2985782A1 DICING SHEET SUBSTRATE FILM, AND DICING SHEET PROVIDED WITH SAID SUBSTRATE FILM 审中-公开
标题翻译： ZERTEILERFOLIE MIT DIESEM SUBSTRAT
公开(公告)号：EP2985782A1
公开(公告)日：2016-02-17
申请号：EP13876898.1
申请日：2013-03-04
申请人： Lintec Corporation
发明人： TAYA Naoki , UEDA Masashi , ITO Masaharu
IPC分类号： H01L21/301
CPC分类号： H01L21/6836 , C08L23/06 , C09J7/243 , C09J7/29 , C09J2201/162 , C09J2201/606 , C09J2203/326 , C09J2205/114 , C09J2423/046 , C09J2433/006 , H01L21/68 , H01L2221/68327 , Y10T428/28 , Y10T428/31938
摘要： A base film (2) for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object in the full-cut dicing without imparting physical energy, such as electron beam or γ ray, and which has an enhanced expanding property in the expanding process. The base film (2) for a dicing sheet comprises a resin layer (A) that contains a polyethylene and an ethylene-tetracyclododecene copolymer. A dicing sheet that comprises the base film for a dicing sheet is also provided.
摘要翻译：提供了一种用于切割片的基膜（2），其能够在全切割切割中切割切割物体时抑制切割碎屑产生，而不会赋予诸如电子束或³射线的物理能量，并且其具有增强的在扩大的过程中扩大财产。用于切割片的基膜（2）包括含有聚乙烯和乙烯 - 四环十二碳烯共聚物的树脂层（A）。还提供了一种包括用于切割片的基底膜的切割片。

3. 发明公开

EP2786808A1 MANUFACTURING METHOD FOR GAS BARRIER FILM, AND ELECTRONIC MEMBER OR OPTICAL MEMBER PROVIDED WITH GAS BARRIER FILM 审中-公开
标题翻译：处理对阻气薄膜和电子元件的或与隔气膜的光学元件
公开(公告)号：EP2786808A1
公开(公告)日：2014-10-08
申请号：EP12852991.4
申请日：2012-11-28
申请人： Lintec Corporation
发明人： IWAYA Wataru , ITO Masaharu , KONDO Takeshi
IPC分类号： B05D7/24 , B05D3/04 , B32B9/00 , B32B27/00 , B32B27/16
CPC分类号： C23C14/48 , B05D3/148 , B05D7/04 , C23C18/122 , C23C28/00
摘要： The present invention pertains to: a method for producing a gas barrier film that includes at least a base that is formed of a synthetic resin, and a gas barrier layer that is formed on the base, the method comprising a step 1 and 2 below; and an electronic member or an optical member that includes a gas barrier film obtained by the method. In the gas barrier film obtained by means of the present invention, a problem of adhesion failure between the gas barrier layer and the base dose not occur even when the gas barrier film is subjected to high-temperature/high-humidity conditions. [Step 1] that applies a silicon-based polymer compound solution that includes a silicon-based polymer compound and an organic solvent to the base to obtain a film of the silicon-based polymer compound solution, and dries the film by heating to form a layer that includes the silicon-based polymer compound, the base having a gel fraction of 70% or more and less than 98% when immersed in the organic solvent at 23°C for 72 hours; [Step 2] that subjects the layer that includes the silicon-based polymer compound to a plasma treatment to form the gas barrier layer.
摘要翻译：本发明涉及：一种用于制备阻气膜，确实包括至少一个基座并形成有合成树脂，并且气体阻隔层没有形成在基底上，该方法包括步骤1和2; 和电子部件或光学构件确实包括一个阻气通过该方法成膜得到。在阻气性通过本发明的手段膜得到的，气体阻隔层和基材之间的粘合失败的问题剂量不会即使当气体阻隔性膜，进行高温/高湿度条件时。 [步骤1]做了适用的硅基聚合物化合物溶液确实包括与有机溶剂的在基座上的硅基聚合物化合物，以获得基于硅的聚合物化合物溶液的膜，并通过加热干燥该膜，以形成层做包括硅基聚合物化合物，为70％以上且小于98％的凝胶分数。当在23℃下浸渍在有机溶剂中72小时的基础; [步骤2]没有受试者层确实包括基于硅的聚合物化合物等离子处理，以形成气体阻隔层。

4. 发明授权

EP2774755B1 GAS BARRIER FILM, METHOD FOR PRODUCING SAME, GAS BARRIER FILM LAMINATE, MEMBER FOR ELECTRONIC DEVICES, AND ELECTRONIC DEVICE 有权
公开(公告)号：EP2774755B1
公开(公告)日：2020-03-25
申请号：EP12846522.6
申请日：2012-11-02
申请人： Lintec Corporation
发明人： IWAYA Wataru , FUJIMOTO Hironobu , TAYA Naoki , ITO Masaharu , KONDO Takeshi
IPC分类号： B32B27/00 , B32B9/00 , C08K5/103 , C08L101/00 , H05B33/02 , B32B27/28 , B32B27/32 , C23C14/48 , G02F1/1333 , H01L51/52

5. 发明公开

EP2433980A1 MOLDED OBJECT, PROCESS FOR PRODUCING SAME, MEMBER FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE 有权转让
标题翻译：表单对象，用于生产该元件的电子器件和电子设备
公开(公告)号：EP2433980A1
公开(公告)日：2012-03-28
申请号：EP10777840.9
申请日：2010-05-21
申请人： LINTEC Corporation
发明人： HOSHI Shinichi , ITO Masaharu , UEMURA Kazue , SUZUKI Yuta
IPC分类号： C08J7/00 , B32B27/16 , G02F1/1333 , H01L31/042 , H05B33/04 , H05B33/14
CPC分类号： C23C14/48 , B32B27/06 , B32B2307/7244 , C08J7/047 , C08J7/123 , C08J2383/05 , G02F1/133305 , G02F2201/501 , G02F2201/503 , H01L31/049 , Y02E10/50
摘要： A formed article comprising a gas barrier layer that is formed of a material including at least an oxygen atom, a carbon atom, and a silicon atom, the gas barrier layer including an area (A) where an oxygen atom content rate gradually decreases, and a carbon atom content rate gradually increases in a depth direction from a surface, the area (A) including a partial area (A1) and a partial area (A2), the (A1) having an oxygen atom content rate of 20 to 55%, a carbon atom content rate of 25 to 70%, and a silicon atom content rate of 5 to 20% based on the total content rate of oxygen atoms, carbon atoms, and silicon atoms, and the (A2) having an oxygen atom content rate of 1 to 15%, a carbon atom content rate of 72 to 87%, and a silicon atom content rate of 7 to 18% based on the total content rate of oxygen atoms, carbon atoms, and silicon atoms; a method of producing the same; an electronic device member; an electronic device. The formed article exhibits an excellent gas barrier capability, excellent bendability, excellent adhesion, and excellent surface flatness.
摘要翻译：成形制品，其包含的气体阻隔层并形成在包括至少氧原子，碳原子和硅原子，在气体阻隔层包含在区域中的材料的（A），其中氧原子的存在比例逐渐减小，并一个碳原子的存在比例在深度方向逐渐增加从一个表面上，包括一个部分区域（A1）和具有在20〜55％的氧原子的存在比例的部分区域（A2）中，（A1）的区域（A）的25〜70％，和5〜20％，基于氧原子，碳原子和硅原子，和（A2）的总含有率的硅原子的存在比例具有的氧原子含量的碳原子含有率的1至15％，72至87％的碳原子的存在比例，及7〜18％，基于氧原子，碳原子和硅原子的总含有率的硅原子的存在比例率; 产生相同的方法; 电子设备部件; 的电子装置。形成的物品表现出优异的阻气性，优异的弯曲加工性，优良的粘合性，和优异的表面平坦性。

6. 发明授权

EP2433980B1 MOLDED OBJECT, PROCESS FOR PRODUCING SAME, MEMBER FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE 有权转让
公开(公告)号：EP2433980B1
公开(公告)日：2019-07-10
申请号：EP10777840.9
申请日：2010-05-21
申请人： LINTEC Corporation
发明人： HOSHI Shinichi , ITO Masaharu , UEMURA Kazue , SUZUKI Yuta
IPC分类号： C08J7/00 , B32B27/16 , G02F1/1333 , H01L31/042 , H05B33/04 , H05B33/14 , C08J7/04 , C08J7/12

7. 发明公开

EP3263330A1 ADHESIVE SHEET 审中-公开
标题翻译：胶粘剂片材
公开(公告)号：EP3263330A1
公开(公告)日：2018-01-03
申请号：EP16755431.0
申请日：2016-02-23
申请人： Lintec of America, Inc. , LINTEC Corporation
发明人： OVALLE Raquel , ITO Masaharu , INOUE Kanzan
IPC分类号： B32B27/00
CPC分类号： B32B9/007 , B32B27/12 , B32B27/14 , B32B2255/02 , B32B2255/26 , B32B2262/106 , B32B2264/108 , B32B2305/77 , B32B2405/00
摘要： An adhesive sheet includes: a carbon nanotube sheet including a plurality of carbon nanotubes aligned preferentially in one direction within a plane of the sheet; and an adhesive agent layer including an adhesive agent, the adhesive agent layer being curable.
摘要翻译：粘合片包括：碳纳米管片，其包括多个碳纳米管，所述多个碳纳米管优先在所述片的平面内的一个方向上排列; 和包含粘合剂的粘合剂层，所述粘合剂层可固化。

8. 发明公开

EP2940717A1 DICING-SHEET SUBSTRATE FILM AND DICING SHEET 审中-公开
公开(公告)号：EP2940717A1
公开(公告)日：2015-11-04
申请号：EP13869293.4
申请日：2013-10-09
申请人： LINTEC Corporation
发明人： TAYA Naoki , UEDA Masashi , ITO Masaharu
IPC分类号： H01L21/301
CPC分类号： H01L21/6836 , B32B27/08 , B32B27/308 , B32B2307/54 , C08G2261/3324 , C08G2261/3325 , C08G2261/418 , C08G2261/724 , C08L23/06 , C08L23/12 , C08L45/00 , C08L47/00 , C09J7/24 , C09J7/29 , C09J2201/162 , C09J2201/606 , C09J2203/326 , C09J2423/006 , C09J2423/046 , C09J2433/006 , C09J2453/006 , H01L21/683 , H01L2221/68327 , H01L2221/68336 , H01L2221/68381 , Y10T428/28 , Y10T428/31913 , C08L65/00 , C08L53/02
摘要： A dicing sheet base film (2) includes a resin layer (A). The resin layer (A) contains: a norbornene-based resin (a1) that is a thermoplastic resin containing a structural unit derived from a norbornene-based compound; a styrene-based elastomer (a2); and an olefin-based thermoplastic resin (a3) other than the norbornene-based resin (a1) and other than the styrene-based elastomer (a2). The dicing sheet base film (2) suppresses the occurrence of dicing debris, in particular filament-like dicing debris, during the dicing of a cut object without imparting physical energy such as electron rays and γ rays, and has sufficient expandability in the expanding process.
摘要翻译：切割片基膜（2）包含树脂层（A）。树脂层（A）含有：含有来自降冰片烯系化合物的结构单元的热塑性树脂即降冰片烯系树脂（a1）苯乙烯系弹性体（a2）; 和除降冰片烯系树脂（a1）以外的苯乙烯系弹性体（a2）以外的烯烃系热塑性树脂（a3）。切割片基膜（2）在切割被切割物体时抑制切割碎片，特别是细丝状切割碎片的发生，而不赋予物理能量如电子射线和γ射线，并且在扩展过程中具有足够的可扩展性。

9. 发明公开

EP2774755A1 GAS BARRIER FILM, METHOD FOR PRODUCING SAME, GAS BARRIER FILM LAMINATE, MEMBER FOR ELECTRONIC DEVICES, AND ELECTRONIC DEVICE 审中-公开
标题翻译： GASSPERRFOLIE，HERSTELLUNGSVERFAHRENDAFÜR，GASSPERRFOLIENLAMINAT，ELEMENTFÜRELEKTRONISCHE VORRICHTUNGEN UND ELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP2774755A1
公开(公告)日：2014-09-10
申请号：EP12846522.6
申请日：2012-11-02
申请人： Lintec Corporation
发明人： IWAYA Wataru , FUJIMOTO Hironobu , TAYA Naoki , ITO Masaharu , KONDO Takeshi
IPC分类号： B32B27/00 , B32B9/00 , C08K5/103 , C08L101/00 , H01L51/50 , H05B33/02
摘要： The present invention provides: a gas barrier film comprising a cured resin layer and a gas barrier layer, the gas barrier layer being provided on at least one side of the cured resin layer,
the cured resin layer being a layer formed of a cured product of a curable resin composition that includes (A) a thermoplastic resin having a glass transition temperature (Tg) of 140°C or more, and (B) a curable monomer,
the gas barrier film having a water vapor transmission rate of 1 g/m 2 /day or less at a temperature of 40°C and a relative humidity of 90%; a method for producing the gas barrier film; a gas barrier film laminate comprising the gas barrier film; an electronic device member comprising the gas barrier film; an electronic device member comprising the gas barrier film laminate; an electronic device comprising the electronic device member.
Since the gas barrier film and the gas barrier film laminate of the present invention exhibits excellent heat resistance, excellent solvent resistance, excellent interlayer adhesion, and an excellent gas barrier capability, has a low birefringence, and exhibits excellent optical isotropy, the gas barrier film and the gas barrier film laminate may suitably be used as an electronic device member.
摘要翻译：本发明提供一种阻气膜，其具有固化树脂层和阻气层，所述阻气层设置在所述固化树脂层的至少一侧，所述固化树脂层为由固化树脂层和固化树脂层的固化物形成的层包含（A）玻璃化转变温度（Tg）为140℃以上的热塑性树脂和（B）固化性单体的固化性树脂组合物，所述阻气膜的水蒸气透过率为1g / m 2 在40℃的温度和90％的相对湿度下为2 /天以下。阻气膜的制造方法; 包含阻气膜的阻气膜层压体; 包括所述阻气膜的电子设备构件; 包括所述阻气膜层压体的电子器件部件; 包括电子设备构件的电子设备。由于本发明的阻气膜和阻气膜层叠体显示出优异的耐热性，优异的耐溶剂性，优异的层间粘合性和优异的阻气性，具有低双折射性，并且表现出优异的光学各向同性，阻气膜并且阻气膜层压体可以适当地用作电子器件部件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式