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1. 发明公开

EP3486962A2 DISPLAY PANEL AND ELECTRONIC DEVICE INCLUDING THE SAME 有权
公开(公告)号：EP3486962A2
公开(公告)日：2019-05-22
申请号：EP18194427.3
申请日：2018-09-14
申请人： Samsung Display Co., Ltd.
发明人： Seo, Junghan , Sung, Wooyong
IPC分类号： H01L51/52 , H01L27/32
CPC分类号： H01L51/5256 , H01L27/3244 , H01L27/3251 , H01L51/0097 , H01L51/5237 , H01L51/5271 , H01L2251/301 , H01L2251/303 , H01L2251/5338 , H01L2251/558
摘要： A display panel includes a base substrate (10) including a front surface and a rear surface and having first (MH) and second holes (BH), and a pixel layer on the base substrate. A display area is defined in the front surface. The first hole overlaps with the display area and penetrates the front and rear surfaces. The second hole overlaps with the display area, is adjacent to the first hole, and is recessed from the front surface. The base substrate includes a first base layer (11) including the rear surface, a first barrier layer (12) on the first base layer and including first inorganic films having a first refractive index, and second inorganic films having a second refractive index, a second base layer (13) on the first barrier layer, and a second barrier layer (14) on the second base layer and including the front surface. The first and second inorganic films are alternately stacked.

2. 发明授权

EP2615144B1 ADHESIVE SHEET AND ELECTRONIC DEVICE 有权
公开(公告)号：EP2615144B1
公开(公告)日：2018-10-17
申请号：EP11823386.5
申请日：2011-08-18
申请人： Lintec Corporation
发明人： UEMURA, Kazue , AMINO, Yumiko , SUZUKI, Yuta , ONO, Yoshitomo , NAKAJIMA, Emi
IPC分类号： C09J7/29 , H01L51/52 , C09J121/00 , C09D183/16
CPC分类号： C09D183/16 , C09J7/29 , C09J121/00 , C09J133/04 , C09J183/16 , C09J2203/326 , C09J2421/00 , C09J2433/00 , C09J2483/006 , H01L51/5253 , H01L51/5256 , Y10T428/2848
摘要： The invention pertains to an adhesive sheet including a base material having thereon at least a gas barrier layer and an adhesive layer, wherein the gas barrier layer is constituted of a material containing at least an oxygen atom and a silicon atom; in a surface layer part of the gas barrier layer, an existing proportion of an oxygen atom is from 60 to 75 %, an existing proportion of a nitrogen atom is from 0 to 10 %, and an existing proportion of a silicon atom is from 25 to 35 % relative to a total existing amount of the oxygen atom, the nitrogen atom, and the silicon atom; and a film density in the surface layer part of the gas barrier layer is from 2.4 to 4.0 g/cm 3 , and also to an electronic device provided with the subject adhesive sheet as an electronic device member. The invention is able to provide an adhesive sheet with excellent gas barrier properties, resistance to folding and transparency and also an electronic device provided with the subject adhesive sheet as an electronic device member.

3. 发明授权

EP1859496B1 HIGH INTEGRITY PROTECTIVE COATING 有权转让
公开(公告)号：EP1859496B1
公开(公告)日：2018-09-12
申请号：EP05858693.4
申请日：2005-11-15
申请人： BOE Technology Group Co., Ltd.
发明人： KIM, Tae, Won , YAN, Min , HELLER, Christian, Maria, Anton , SCHAEPKENS, Marc , GORCZYCA, Thomas, Bert , MCCONNELEE, Paul, Alan , ERLAT, Ahmet, Gun
IPC分类号： H01L51/52
CPC分类号： H01L51/5256
摘要： A composite article with at least one high integrity protective coating, the high integrity protective coating having at least one planarizing layer and at least one organic-inorganic composition barrier coating layer. A method for depositing a high integrity protective coating.

4. 发明授权

EP2255399B1 METHOD OF MANUFACTURING AN ENCAPSULATED ELECTRONIC DEVICE 有权
公开(公告)号：EP2255399B1
公开(公告)日：2018-08-22
申请号：EP09711180.1
申请日：2009-02-13
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO , Koninklijke Philips N.V.
发明人： TOONEN, Leonardus Maria , RENSING, Petrus Alexander , VAN MOL, Antonius Maria Bernardus , LIFKA, Herbert , TANASE, Cristina
IPC分类号： H01L51/56 , H01L51/52
CPC分类号： B82Y30/00 , B82Y20/00 , H01L51/003 , H01L51/5256 , H01L51/5268 , H01L51/5275 , H01L2251/5369
摘要： An encapsulated electronic device is described comprising: - a first barrier structure (20) comprising at least one inorganic (24) and at least one organic layer (23), - a second barrier structure (30) comprising at least one inorganic (31) and at least one organic layer (32), - an electronic device (10) arranged between the first and the second barrier structure (20, 30), characterized in that the at least one inorganic layer (24) of the first barrier structure (20) and the at least one inorganic (31) layer of the second barrier structure (30) contact each outside an area (A) occupied by the electronic device (10).

5. 发明授权

EP2837642B1 PHOTOCURABLE COMPOSITION AND ENCAPSULATED APPARATUS PREPARED USING THE SAME 有权
标题翻译：可光固化组合物和使用该组合物制备的封装装置
公开(公告)号：EP2837642B1
公开(公告)日：2018-05-09
申请号：EP14177801.9
申请日：2014-07-21
申请人： Samsung SDI Co., Ltd.
发明人： Lee, Ji Yeon , Ko, Sung Min , Nam, Seong Ryong , Oh, Se Il , Choi, Seung Jib , Ha, Kyoung Jin
IPC分类号： C08F230/02 , C08F2/48 , C08F230/08 , H01L33/52
CPC分类号： C08F222/20 , C08F2/48 , C08F230/02 , C08F230/08 , H01L33/56 , H01L51/0043 , H01L51/5237 , H01L51/5253 , H01L51/5256 , C08F2220/1891 , C08F2222/1013
摘要： Disclosed herein is a photocurable composition and the encapsulated apparatus prepared using the same. The photocurable composition has A/B of 0.7 kgf/% or more and A of 2.5 kgf or more when A indicates glass-metal alloy die shear strength (unit: kgf) after curing between a glass substrate and a Ni/Fe alloy and B indicates curing shrinkage (unit: %).

6. 发明公开

EP3306696A1 PACKAGING THIN-FILM AND MANUFACTURING METHOD THEREFOR, LIGHT-EMITTING DEVICE, DISPLAY PANEL AND DISPLAY APPARATUS 有权
标题翻译：包装薄膜及其制造方法，发光装置，显示面板和显示装置
公开(公告)号：EP3306696A1
公开(公告)日：2018-04-11
申请号：EP15860012.2
申请日：2015-10-08
申请人： BOE Technology Group Co., Ltd.
发明人： SHI, Shoulei , HUNG, Hsiaowen
IPC分类号： H01L51/52 , H01L51/56 , H01L27/32
CPC分类号： H01L51/0096 , H01L51/5246 , H01L51/5256 , H01L51/5259 , H01L51/56 , H01L2251/5369
摘要： A package thin film and a manufacturing method thereof, a light emitting device, a display panel and a display device are provided. The package thin film may comprise: a nano material layer or a polycation organic material layer, a moisture absorption layer formed on the nano material layer or the polycation organic material layer, a sealing layer for sealing the nano material layer or the polycation organic material layer and the moisture absorption layer. The package structure provided by embodiments of the present invention is formed by alternate assembly of materials (the nano material layer or the polycation organic material layer and the moisture absorption layer) with different charges.
摘要翻译：提供封装薄膜及其制造方法，发光装置，显示面板和显示装置。封装薄膜可以包括：纳米材料层或聚阳离子有机材料层，形成在纳米材料层或聚阳离子有机材料层上的吸湿层，用于密封纳米材料层或聚阳离子有机材料层的密封层和吸湿层。本发明实施例提供的封装结构是通过交替组装不同电荷的材料（纳米材料层或聚阳离子有机材料层和吸湿层）形成的。

7. 发明公开

EP3300131A1 DISPLAY DEVICE 有权
标题翻译：显示设备
公开(公告)号：EP3300131A1
公开(公告)日：2018-03-28
申请号：EP17192749.4
申请日：2017-09-22
申请人： Samsung Display Co., Ltd.
发明人： CHOI, Hayoung , HEO, Kyeongyeol , KIM, Joonsam , HWANG, Jihong
IPC分类号： H01L51/00 , H01L27/32 , H01L51/52
CPC分类号： H01L51/0097 , H01L27/3244 , H01L27/3276 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L2251/5338 , Y02E10/549
摘要： A display device includes a substrate having a planar area, a bending area extending from the planar area, and a surrounding area extending from the bending area, a first protective layer at a boundary portion of the bending area, and a second protective layer covering an entire surface of the bending area and covering the first protective layer.
摘要翻译：本发明提供一种显示装置，该显示装置包括：具有平面区域，从该平面区域延伸的弯曲区域和从该弯曲区域延伸的周围区域的基板，在该弯曲区域的边界部分处的第一保护层，以及覆盖弯曲区域的整个表面并覆盖第一保护层。

8. 发明公开

EP3282497A2 ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE 有权
标题翻译：有机发光二极管显示装置
公开(公告)号：EP3282497A2
公开(公告)日：2018-02-14
申请号：EP17179100.7
申请日：2017-06-30
申请人： Samsung Display Co., Ltd.
发明人： SUNG, Wooyong , KIM, Doohwan , LEE, Ilsang , KIM, Minsang , SONG, Seungyong
IPC分类号： H01L51/52
CPC分类号： H01L51/5275 , H01L51/5237 , H01L51/5256
摘要： An OLED display device includes a substrate. A first electrode is disposed on the substrate (110). An organic light emitting layer (212) is disposed on the first electrode (211). A second electrode (213) is disposed on the organic light emitting layer. A thin film encapsulation layer (310) is disposed on the second electrode. The thin film encapsulation layer includes at least one inorganic layer (310, 330) and at least one organic layer (320) that is disposed alternately with the at least one inorganic layer. The at least one organic layer includes a low refractive index layer overlapping the organic light emitting layer and a high refractive index layer disposed on the low refractive index layer. The high refractive index layer includes a convex surface protruding toward the organic light emitting layer.
摘要翻译： OLED显示装置包括基板。第一电极设置在基板（110）上。有机发光层（212）设置在第一电极（211）上。第二电极（213）设置在有机发光层上。薄膜封装层（310）设置在第二电极上。薄膜封装层包括至少一个无机层（310,330）和至少一个与至少一个无机层交替布置的有机层（320）。所述至少一个有机层包括与有机发光层重叠的低折射率层和设置在低折射率层上的高折射率层。高折射率层包括朝向有机发光层突出的凸表面。

9. 发明公开

EP3277055A1 SEALING MATERIAL, METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE 审中-公开
标题翻译：密封材料，制造密封材料的方法以及制造发光器件的方法
公开(公告)号：EP3277055A1
公开(公告)日：2018-01-31
申请号：EP16768933.0
申请日：2016-03-25
申请人： Zeon Corporation
发明人： HARAI, Kenichi
IPC分类号： H05B33/04 , H01L51/50
CPC分类号： H01L51/5246 , C08F297/04 , C08L53/025 , C09K3/10 , C09K2200/0645 , H01L51/0043 , H01L51/448 , H01L51/5256 , H01L51/5259 , H05B33/04
摘要： Provided is a sealing material for sealing in a light-emitting element, the sealing material having a bonding surface that can be in contact with the light-emitting element, an arithmetic mean roughness of the bonding surface being 10 nm or greater and 1000 nm or less. A storage elastic modulus of the sealing material at 90'C is preferably 10 MPa or greater. The sealing material preferably contains a metal compound. A method for manufacturing a light-emitting device of the present invention includes a step
for bonding the bonding surface of the sealing material to the light-emitting element, and a step for bonding a barrier member to a surface of the sealing material opposite to the bonding surface.
摘要翻译：本发明提供一种发光元件密封用密封材料，该密封材料具有能够与发光元件接触的接合面，接合面的算术平均粗糙度为10nm以上且1000nm以下，减。密封材料在90℃的储存弹性模量优选为10MPa或更大。密封材料优选含有金属化合物。本发明的发光装置的制造方法包括：将密封材料的接合面接合于发光元件的工序;以及将阻挡部件接合于与密封材料相反侧的表面的工序粘合表面。

10. 发明授权

EP3095145B1 ENCAPSULATED SEMICONDUCTOR DEVICE AND ENCAPSULATION METHOD 有权
标题翻译：封装半导体器件和封装方法
公开(公告)号：EP3095145B1
公开(公告)日：2017-11-08
申请号：EP15700233.8
申请日：2015-01-13
申请人： OLEDWorks GmbH
发明人： MEYER, Jens , GIERTH, Rainald Manfred , GRABOWSKI, Stefan Peter , LIFKA, Herbert , VAN DE WEIJER, Peter , BOUTEN, Petrus Cornelis Paulus , VAN ELSBERGEN, Volker Lambert , RUSKE, Manfred Stephan , HARTMAN, Sören
IPC分类号： H01L51/52 , H01L51/44
CPC分类号： H01L51/5256 , H01L51/0097 , H01L51/448 , H01L2251/5338 , H01L2251/566

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