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1. 发明授权

EP2980179B1 HOT-MELT ADHESIVE 有权转让
公开(公告)号：EP2980179B1
公开(公告)日：2018-10-10
申请号：EP14774177.1
申请日：2014-03-25
申请人： Henkel AG & Co. KGaA
发明人： INOUE, Kentarou , MORIGUCHI, Masahiro , MAEDA, Naohiro
IPC分类号： C09J153/02 , A61F13/15 , C08K5/01 , C09J145/00
CPC分类号： C09J153/02 , A61F13/15 , C08K5/01 , C09J145/00
摘要： Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25°C as a 25% (by weight) toluene solution of not more than 250 mPa·s (A1).

2. 发明公开

EP3318586A1 HYDROCARBON RESIN, METHOD FOR PREPARING HYDROCARBON RESIN, AND ADHESIVE COMPOSITION 审中-公开
标题翻译：烃树脂，制备烃树脂的方法和粘合剂组合物
公开(公告)号：EP3318586A1
公开(公告)日：2018-05-09
申请号：EP15897275.2
申请日：2015-12-31
申请人： Kolon Industries, Inc.
发明人： LEE, Sang Hyun , PARK, Jun Hyo , LEE, Joong Suk , CHO, Min Sik
IPC分类号： C08F240/00 , C08F210/14 , C08F8/04 , C08L57/02 , C09J157/02
CPC分类号： C09J147/00 , C08F8/04 , C08F32/00 , C08F210/14 , C08F240/00 , C08L45/00 , C08L57/02 , C09J123/06 , C09J123/16 , C09J133/062 , C09J145/00 , C09J157/02
摘要： This invention relates to a hydrocarbon resin and a method of preparing the same, wherein thermal polymerization of a diolefin and an olefin is performed, thus obviating a catalyst removal process, material supply problems can be solved, and a hydrogenated hydrocarbon resin can be prepared using a catalyst, which is inexpensive and is easy to handle, thereby realizing a yield and a preparation process that enable real-world application thereof. The hydrogenated hydrocarbon resin prepared by the method of the invention has excellent compatibility and a low specific viscosity, and can thus be efficiently used as a tackifier or an adhesive in a variety of fields.
摘要翻译：本发明涉及一种烃树脂及其制备方法，其中进行二烯烃和烯烃的热聚合，因此避免了催化剂去除过程，材料供应问题可以得到解决，并且氢化烃树脂可以使用这种催化剂便宜且易于处理，从而实现了能够实际应用的产率和制备过程。通过本发明的方法制备的氢化烃树脂具有优异的相容性和低比粘度，因此可以有效地用作各种领域中的增粘剂或粘合剂。

3. 发明公开

EP2980179A1 HOT-MELT ADHESIVE 有权转让
标题翻译：热熔胶粘剂
公开(公告)号：EP2980179A1
公开(公告)日：2016-02-03
申请号：EP14774177.1
申请日：2014-03-25
申请人： Henkel AG&Co. KGAA
发明人： INOUE, Kentarou , MORIGUCHI, Masahiro , MAEDA, Naohiro
IPC分类号： C09J153/02
CPC分类号： C09J153/02 , A61F13/15 , C08K5/01 , C09J145/00
摘要： Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25°C as a 25% (by weight) toluene solution of not more than 250 mPa·s (A1).
摘要翻译：本发明要解决的问题是提供一种能够在低温下施用，在低温下具有优异的粘合性的热熔粘合剂以及通过使用该热熔粘合剂而获得的一次性产品。解决该问题的手段是由乙烯基类芳香族烃与共轭二烯化合物的共聚物即热塑性嵌段共聚物（A）构成的热熔粘接剂，其中，热塑性嵌段共聚物（A）由放射型苯乙烯嵌段共聚物其苯乙烯含量为35-45重量％，二嵌段含量为50-90重量％，并且在25℃下25％（重量）甲苯溶液的粘度不超过250mPa·s（ A1）。

4. 发明公开

EP2803713A4 RESIN COMPOSITION FOR SEALANTS, LAMINATED FILM, AND PACKAGING BAG 审中-公开
标题翻译：树脂组合物密封胶，复合膜与包装袋
公开(公告)号：EP2803713A4
公开(公告)日：2015-07-08
申请号：EP13735789
申请日：2013-01-07
申请人： FUJIMORI KOGYO CO
发明人： OKAMOTO HAJIME , KASHIMA KOUSUKE , INADA MASAKAZU , YOSHIDA MIHOKO
IPC分类号： C09K3/10 , B32B27/00 , B32B27/32 , B65D65/40 , C08J5/18 , C08L23/08 , C08L45/00 , C08L65/00
CPC分类号： C08L25/02 , B32B7/12 , B32B15/08 , B32B27/32 , B32B27/325 , B32B27/34 , B32B27/36 , B32B2270/00 , B32B2307/31 , B32B2307/518 , B32B2307/54 , B32B2307/7242 , B32B2439/00 , B32B2439/70 , B65D31/02 , B65D65/40 , C08G2261/418 , C08J5/18 , C08J2323/08 , C08J2365/00 , C08J2423/08 , C08J2465/00 , C08L23/0823 , C08L45/00 , C08L65/00 , C08L2205/02 , C08L2205/025 , C09J145/00 , C09K3/1006 , C09K2200/0617 , Y10T428/2878 , C08L2666/06
摘要： The object of the present invention is to provide a resin composition for a sealant which has improved heat-sealing properties and non-absorbing properties to an inorganic component contained in the content, a laminated film, and a packaging bag, and the present invention provides a resin composition for a sealant including a cycloolefin polymer and a cycloolefin copolymer, wherein the resin composition includes 10 to 95% by weight of the cycloolefin polymer and 5 to 90% by weight of the cycloolefin copolymer.

5. 发明公开

EP2264113A3 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive 审中-公开
标题翻译：对于用于与其的半导体装置的树脂组合物的制造和使用作为临时粘接剂的半导体晶片和方法临时粘合剂
公开(公告)号：EP2264113A3
公开(公告)日：2012-09-26
申请号：EP09175317.8
申请日：2009-11-06
申请人： Sumitomo Bakelite Co., Ltd.
发明人： Takeuchi, Etsu , Kusunoki, Junya , Sugiyama, Hiromichi , Kuboyama, Toshiharu , Kawata, Masakazu
IPC分类号： C09J169/00 , C09J123/24 , H01L21/68
CPC分类号： C09J169/00 , C08L2203/206 , C09J123/24 , C09J145/00 , H01L21/6836 , H01L2221/68327
摘要： To provide a temporary bonding adhesive for a semiconductor wafer that can reduce damage to the semiconductor wafer, is easily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using the same.
A temporary bonding adhesive for a semiconductor device is provided, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition such that the difference between the 95% weight loss temperature and the 5% weight loss temperature is 1 degree Celsius ≤ 95 % weight loss temperature - 5 % weight loss temperature ≤ 300 degrees Celsius .

6. 发明公开

EP3318587A1 HYDROGENATED PETROLEUM RESIN, AND PRODUCTION METHOD AND USE THEREFOR 审中-公开
标题翻译：氢化石油树脂及其生产方法和用途
公开(公告)号：EP3318587A1
公开(公告)日：2018-05-09
申请号：EP16818190.7
申请日：2016-06-28
申请人： Kolon Industries, Inc.
发明人： LEE, Sang Hyun , CHO, Min Sik , PARK, Jun Hyo , LEE, Joong Suk
IPC分类号： C08F240/00 , C08F210/14 , C08F8/04 , C08L57/02 , C09J157/02
CPC分类号： C09J147/00 , C08F8/04 , C08F32/00 , C08F210/14 , C08F240/00 , C08L45/00 , C08L57/02 , C09J123/06 , C09J123/16 , C09J133/062 , C09J145/00 , C09J157/02
摘要： The present invention relates to a hydrogenated petroleum resin, and to a manufacturing method and use thereof. More specifically, it relates to a hydrogenated petroleum resin manufactured by subjecting dicyclopentadiene and an olefinic monomer to thermal polymerization and then carrying out a hydrogenation reaction, and to a manufacturing method and use therefor.
The hydrogenated petroleum resin has the advantage of being useful in practical applications, since the petroleum resin is manufactured via thermal polymerization using inexpensive raw materials and on the contrary to conventional catalytic polymerization, a catalyst elimination process can be excluded. The hydrogenated petroleum resin produced in this way can be applied to, for example, an adhesive agent used in environmentally friendly sanitary goods, because the petroleum resin has excellent compatibility, adhesiveness and heat resistance, and has no bad odor.
摘要翻译：氢化石油树脂及其制造方法和用途技术领域本发明涉及氢化石油树脂及其制造方法和用途。更具体地说，涉及一种氢化石油树脂及其制造方法和用途，所述氢化石油树脂是通过使二环戊二烯和烯烃单体进行热聚合然后进行氢化反应而制造的。氢化石油树脂具有在实际应用中有用的优点，因为石油树脂是通过使用廉价原料的热聚合制造的，并且与常规催化聚合相反，可以排除催化剂消除过程。由于石油树脂具有优异的相容性，粘合性和耐热性，并且没有不良气味，所以以这种方式生产的氢化石油树脂可以应用于例如用于环保卫生用品的粘合剂。

7. 发明公开

EP2966139A1 ADHESIVE COMPOSITION, ADHESIVE FILM, AND METHOD FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE USING SAME 有权
公开(公告)号：EP2966139A1
公开(公告)日：2016-01-13
申请号：EP14835356.8
申请日：2014-08-05
申请人： LG Chem, Ltd.
发明人： CHO, Yoon Gyung , BAE, Kyung Yul , PARK, Min Soo , SHIM, Jung Sup , YOO, Hyun Jee
IPC分类号： C09J121/00 , C09J7/00 , C09J9/00
CPC分类号： C09J109/00 , C09J4/00 , C09J7/00 , C09J7/10 , C09J7/20 , C09J9/00 , C09J123/22 , C09J133/08 , C09J145/00 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2205/114 , C09J2409/00 , C09J2415/003 , C09J2423/00 , C09J2423/003 , C09J2433/003 , H01L51/0001 , H01L51/0026 , H01L51/004 , H01L51/0043 , H01L51/0094 , H01L51/5237 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , Y10T428/2883
摘要： Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

8. 发明公开

EP2934886A1 VERBUNDTEIL 审中-公开
标题翻译：复合材料部件
公开(公告)号：EP2934886A1
公开(公告)日：2015-10-28
申请号：EP13821471.3
申请日：2013-12-20
申请人： LANXESS Deutschland GmbH
发明人： FRÜH, Thomas , DEDERICHS, Thomas , BISCHOFF, Andreas , GIESE, Ulrich , THUST, Torsten
IPC分类号： B32B25/08 , B32B27/34 , C08L65/00 , C08L77/00
CPC分类号： B32B27/34 , B29C45/1676 , B29K2007/00 , B29K2009/06 , B29K2023/16 , B29K2077/00 , B32B25/08 , C08G2261/418 , C08L7/00 , C08L9/00 , C08L9/06 , C08L23/16 , C08L45/00 , C08L65/00 , C08L77/02 , C08L77/06 , C09J107/00 , C09J109/00 , C09J109/06 , C09J123/16 , C09J145/00 , C09J177/06
摘要： The invention relates to a composite part which is produced using two-component processing methods, preferably two-component injection-moulding (2C injection moulding), from at least one section consisting of at least one polyamide moulding compound that has polyalkenamer additives and at least one section consisting of at least one elastomer which can be obtained from rubber to be vulcanised or cross-linked with elementary sulphur, or said composite part being composed of said components after the production thereof, without any adhesion promoter being used. The individual sections of said composite part are macroscopic moulded parts although not, for example, dispersed particles in a plastic elastomer blend or polyamide fibres in an elastomer matrix, such blends therefore not constituting composite parts within the sense of the invention. The invention also relates to a method for producing such composite parts, to the use of polyalkenamer for improving the composite adhesion of polyamide-based moulded parts to an elastomer component which can be obtained from rubber to be vulcanised or cross-linked with elementary sulphur, and to the use of polyalkenamer for reducing the melting point or softening point of polyamide.

9. 发明公开

EP2351805A4 TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME 审中-公开
标题翻译：手段TIME途径固定半导体晶片和方法用于生产半导体组件
公开(公告)号：EP2351805A4
公开(公告)日：2012-09-26
申请号：EP10789478
申请日：2010-06-15
申请人： SUMITOMO BAKELITE CO
发明人： TAKEUCHI ETSU , KUSUNOKI JUNYA , SUGIYAMA HIROMICHI , KUBOYAMA TOSHIHARU , KAWATA MASAKAZU
IPC分类号： C09J201/00 , C09J145/00 , C09J169/00 , H01L21/683
CPC分类号： C09J169/00 , C08L2203/206 , C09J123/24 , C09J145/00 , H01L21/6836 , H01L2221/68327

10. 发明公开

EP0604120A1 Hot-melt adhesive composition 有权转让
标题翻译： Heissschmelzklebezusammensetzung。
公开(公告)号：EP0604120A1
公开(公告)日：1994-06-29
申请号：EP93310157.8
申请日：1993-12-16
申请人： MITSUI PETROCHEMICAL INDUSTRIES, LTD.
发明人： Kuroiwa, Toshiaki, c/o Mitsui Petrochemical , Muro, Tuneaki, c/o Mitsui Petrochemical , Tokita, Suguru, c/o Mitsui Petrochemical , Inagaki, Hajime, c/o Mitsui Petrochemical
IPC分类号： C09J125/08 , C09J145/00 , C09J153/02
CPC分类号： C09J125/02 , C08L53/02 , C08L101/00 , C08L2666/02 , C09J145/00
摘要： A hot-melt adhesive composition containing, (A) 10 to 80 parts by weight of a base polymer, (B) 10 to 80 parts by weight of a stickiness-imparting agent which is a copolymer of a particular styrene-type monomer and a particular indene-type monomer, the molar ratio of the indene-type monomer to the styrene-type monomer being from 99/1 to 30/70, and the weight average molecular weight of said copolymer being from 300 to 5000. The hot-melt adhesive composition exhibits excellent heat-resistant adhesiveness and heat-resistant creeping property, and has a low-molecular weight and exhibits good hue.
摘要翻译：一种热熔粘合剂组合物，其包含（A）10至80重量份的基础聚合物，（B）10至80重量份的粘性赋形剂，其是特定苯乙烯类单体和特定的茚类单体，茚类单体与苯乙烯类单体的摩尔比为99/1〜30/70，所述共聚物的重均分子量为300〜5000。粘合剂组合物表现出优异的耐热粘合性和耐热蠕变性，并且具有低分子量并且表现出良好的色调。

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