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31. 发明公开

EP2275871A3 Position Calibration of Alignment Heads in a Multi-Head Alignment System 有权
标题翻译：在多头对准系统的对准头的位置校准
公开(公告)号：EP2275871A3
公开(公告)日：2014-07-23
申请号：EP10169673.0
申请日：2010-07-15
申请人： ASML Netherlands B.V.
发明人： Kaneko, Takeshi , Compen, Rene
IPC分类号： G03F9/00
CPC分类号： G03F9/7011 , G03F9/7019 , G03F9/7088
摘要： A calibration method is disclosed, for the position calibration of secondary alignment heads with a primary alignment head in a multi-head alignment system, such as that used for the measurement of markers on the surface of a wafer, as carried out during a lithographic process in the formation of circuits in or on the wafer. A plurality of offset measurements are made for at least one of the secondary alignment heads, so that the offset of the secondary alignment heads with respect to the primary alignment head can be measured, and used as correction data in subsequent wafer measurement calculations.

32. 发明授权

EP2057506B1 A METHOD AND A SYSTEM FOR REDUCING OVERLAY ERRORS WITHIN EXPOSURE FIELDS BY APC CONTROL STRATEGIES 有权
标题翻译：方法和系统减少曝光区域覆盖误差由APC的税务策略
公开(公告)号：EP2057506B1
公开(公告)日：2012-08-01
申请号：EP07801880.1
申请日：2007-08-24
申请人： ADVANCED MICRO DEVICES, INC.
发明人： SELTMANN, Rolf , SCHULZ, Bernd , HEMPEL, Fritjof , SCHULZE, Uwe
IPC分类号： G03F7/20 , G03F9/00
CPC分类号： G03F7/70458 , G03F7/70633 , G03F9/7011 , G03F9/7019 , G03F9/7046
摘要： By taking into consideration tool specific distortion signatures and reticle specific placement characteristics in an alignment control system the control quality of sophisticated APC strategies may significantly be enhanced. Respective correction data may be established on the basis of any combinations of tool/reticles and layers to be aligned to each other, which may modify the respective target values of alignment parameters used for controlling the alignment process on the basis of standard overlay measurement data obtained from dedicated overlay marks.

33. 发明公开

EP2275871A2 Position Calibration of Alignment Heads in a Multi-Head Alignment System 有权
标题翻译： Einem Mehrfach-Kopf-Ausrichtungssystem的Positionskalibrierung vonAusrichtungsköpfen
公开(公告)号：EP2275871A2
公开(公告)日：2011-01-19
申请号：EP10169673.0
申请日：2010-07-15
申请人： ASML Netherlands B.V.
发明人： Kaneko, Takeshi , Compen, Rene
IPC分类号： G03F9/00
CPC分类号： G03F9/7011 , G03F9/7019 , G03F9/7088
摘要： A calibration method is disclosed, for the position calibration of secondary alignment heads with a primary alignment head in a multi-head alignment system, such as that used for the measurement of markers on the surface of a wafer, as carried out during a lithographic process in the formation of circuits in or on the wafer. A plurality of offset measurements are made for at least one of the secondary alignment heads, so that the offset of the secondary alignment heads with respect to the primary alignment head can be measured, and used as correction data in subsequent wafer measurement calculations.
摘要翻译：公开了一种校准方法，用于在多头对准系统中具有主对准头的二次对准头的位置校准，例如用于在光刻过程中执行的用于测量晶片表面上的标记的那些在晶片中或晶片上形成电路。对于第二对准头中的至少一个进行多次偏移测量，从而可以测量次对准头相对于主对准头的偏移，并用作随后的晶片测量计算中的校正数据。

34. 发明公开

EP2204696A3 Lithographic apparatus and method for calibrating the same 审中-公开
公开(公告)号：EP2204696A3
公开(公告)日：2010-10-06
申请号：EP09178886.9
申请日：2005-07-19
申请人： ASML Netherlands B.V.
发明人： Loopstra, Erik , Levasier, Leon , Oesterholt, Rene
IPC分类号： G03F7/20
CPC分类号： G03F7/70775 , G03F7/70458 , G03F7/70516 , G03F9/7011 , G03F9/7019
摘要： A method for calibrating an encoder in a lithographic apparatus, the encoder including a sensor and a grating, the encoder configured to measure a position of a moveable support of the lithographic apparatus, the method comprising: measuring a position of the moveable support using an interferometer; and calibrating the encoder based on the position of the moveable support measured by the interferometer.

35. 发明公开

EP2204696A2 Lithographic apparatus and method for calibrating the same 审中-公开
标题翻译：光刻设备和用于校准它的方法
公开(公告)号：EP2204696A2
公开(公告)日：2010-07-07
申请号：EP09178886.9
申请日：2005-07-19
申请人： ASML Netherlands B.V.
发明人： Loopstra, Erik , Levasier, Leon , Oesterholt, Rene
IPC分类号： G03F7/20
CPC分类号： G03F7/70775 , G03F7/70458 , G03F7/70516 , G03F9/7011 , G03F9/7019
摘要： A method for calibrating an encoder in a lithographic apparatus, the encoder including a sensor and a grating, the encoder configured to measure a position of a moveable support of the lithographic apparatus, the method comprising: measuring a position of the moveable support using an interferometer; and calibrating the encoder based on the position of the moveable support measured by the interferometer.
摘要翻译：一种用于校准光刻设备中的编码器的方法，所述编码器包括传感器和光栅，所述编码器被配置为测量所述光刻设备的可移动支撑件的位置，所述方法包括：使用干涉仪测量所述可移动支撑件的位置 ; 以及基于由干涉仪测量的可移动支撑的位置来校准编码器。

36. 发明公开

EP1431833A3 Lithographic apparatus, device manufacturing method, and device manufactured thereby 审中-公开
标题翻译：光刻设备，用于生产制品和制造制品的方法
公开(公告)号：EP1431833A3
公开(公告)日：2009-04-15
申请号：EP03079077.8
申请日：2003-12-15
申请人： ASML Netherlands B.V.
发明人： Den Boef, Arie Jeffrey , Mos, Everhardus Cornelis , van der Schaar, Maurits
IPC分类号： G03F9/00
CPC分类号： G03F9/7076 , G03F9/7011 , G03F9/7019 , G03F9/7084 , G03F9/7088 , G03F9/7092
摘要： During device manufacturing a projection beam is projected onto a substrate through a mask. The substrate is aligned with the mask using an alignment structure on the substrate. Properties of the light reflected from the alignment structure are used to determine the relative position of the substrate. Preceding processing of the substrate potentially causes errors in the position determined from the reflected light. measurement of properties of the reflected light are used to determine the size of a correction that is needed to correct for the errors caused by processing of the substrate. Preferably parameters of a physical model of the alignment structure are estimated from the reflected light and used to determine the correction. Preferably, the amplitudes of a plurality of different diffraction peaks are measured to determine the correction.

37. 发明授权

EP1839088B1 IMPRINT REFERENCE TEMPLATE FOR MULTILAYER OR MULTIPATTERN REGISTRATION AND METHOD THEREFOR 有权
标题翻译：压力参考文件多层或更多的结构登记及其方法
公开(公告)号：EP1839088B1
公开(公告)日：2008-06-25
申请号：EP05804583.2
申请日：2005-10-18
申请人： International Business Machines Corporation
发明人： COLBURN, Matthew, E. , MARTIN, Yves, C. , RETTNER, Charles, T. , VAN KESSEL, Theodore, G. , WICKRAMASINGHE, Hematha, K.
IPC分类号： G03F7/00
CPC分类号： G03F7/0002 , B01D2239/045 , B82Y10/00 , B82Y40/00 , G03F9/7011 , G03F9/7019
摘要： A method (and resultant structure) of forming a plurality of masks, includes creating a reference template, using imprint lithography to print at least one reference template alignment mark on all of a plurality of mask blanks for a given chip set, and printing sub-patterns on each of the plurality of mask blanks, and aligning the sub-patterns to the at least one reference template alignment mark.

38. 发明公开

EP1791169A1 ALIGNING METHOD, PROCESSING SYSTEM, SUBSTRATE LOADING REPEATABILITY MEASURING METHOD, POSITION MEASURING METHOD, EXPOSURE METHOD, SUBSTRATE PROCESSING APPARATUS, MEASURING METHOD AND MEASURING APPARATUS 审中-公开
标题翻译：注册过程中，开发系统，片电荷重复性测量方法，位置测量方法，曝光方法，基板处理装置，测量方法和测量装置
公开(公告)号：EP1791169A1
公开(公告)日：2007-05-30
申请号：EP05777070.3
申请日：2005-08-30
申请人： NIKON CORPORATION
发明人： ISHII, Yuuki, NIKON CORPORATION , OKITA, Shinichi, NIKON CORPORATION
IPC分类号： H01L21/027 , G03F7/20 , H01L21/68
CPC分类号： G03F9/7011 , G03F9/7019 , H01L21/681 , H01L21/682
摘要： An edge of a surface to be measured of wafer (W) and each of search alignment marks (SYM, SθM) on the wafer (W) are detected by an inline measurement instrument or the like that operates independently of an exposure apparatus, and position coordinates of the search marks (SYM, SθM) in an X'Y' coordinate system, which is a two-dimensional coordinate system substantially parallel to the surface to be measured and is set by a position of a notch of the wafer (W), are measured. Then, in pre-alignment performed when loading the wafer (W) into the exposure apparatus, the edge of the wafer (W) is detected, and from the detection results, position information of the object in the X'Y' coordinate system is measured. Further, a relative position in the X'Y' coordinate system of the wafer (W) to be loaded into the exposure apparatus based on measurement results of the pre-alignment with respect to a measurement field of an alignment system that measures positions of the search marks on the wafer (W) is adjusted based on measurement results of the inline measurement instrument or the like.
摘要翻译：一个表面的边缘将被测量晶片（W），并且每个对晶片（W）的搜索对准标记（SYM，SM）的通过在线测量仪器或类似操作unabhängig的曝光装置的检测和位置检索标记（SYM，SM）在X'Y“坐标系中的坐标，所有这是一个二维坐标系统，基本上平行于该表面要测量，并且通过的一个凹口的位置设置晶片（W），进行测定。然后，在预对准演出当装载晶片（W）至曝光装置，晶片（W）的边缘进行检测，并从检测结果，在X'Y对象的“坐标位置信息系统是测量。此外，在X'Y“坐标晶片（W）的系统中的相对位置被加载到基于所述预对准的测量结果相对于对准系统的测量场的曝光装置那样的措施位置晶片（W）上搜索标记是基于在线测量仪或类似的测量结果进行调整。

39. 发明公开

EP1621933A3 Lithographic apparatus and method for calibrating the same 有权
标题翻译：相同的光刻设备和方法，用于校准
公开(公告)号：EP1621933A3
公开(公告)日：2006-06-28
申请号：EP05076665.8
申请日：2005-07-19
申请人： ASML Netherlands BV
发明人： Loopstra, Erik Roelof , Oesterholt, Rene , Levasier, Leon Martin
IPC分类号： G03F7/20
CPC分类号： G03F7/70775 , G03F7/70458 , G03F7/70516 , G03F9/7011 , G03F9/7019
摘要： Lithographic apparatus includes a substrate table and a motion control system for controlling a movement of the substrate table. The motion control system includes at least 3 position detectors constructed for detecting a position of the substrate table. For measuring a position and orientation of the substrate table, each position detector comprises an optical encoder of a single dimensional or multi dimensional type, the optical encoders being arranged for providing together at least 6 position values, at least one position value being provided for each of the 3 dimensions. 3 or more of the at least 3 optical encoders being connected to the substrate table at different locations in the 3 dimensional coordinate system. The motion control system is arranged to calculate the position of the substrate table in the 3 dimensional coordinate system from a subset of at least 3 of the 6 position values and to calculate an orientation of the substrate table with respect to the coordinate system from another subset of at least 3 of the 6 position values. Further, a method for calibrating the position detectors is described.

40. 发明公开

EP1646502A1 METHOD AND DEVICE FOR ACCURATELY POSITIONING A PATTERN ON A SUBSTRATE 审中-公开
标题翻译：方法和系统有关的衬底结构的精确定位
公开(公告)号：EP1646502A1
公开(公告)日：2006-04-19
申请号：EP04744460.9
申请日：2004-07-01
申请人： Koninklijke Philips Electronics N.V.
发明人： VAN DAM, Dirkjan, B. , VAN DEN BESSELAAR, Leonardus, J., C.
IPC分类号： B41J2/01 , H05B33/10
CPC分类号： G03F9/7084 , F04B47/02 , G03F7/70791 , G03F9/7003 , G03F9/7011 , G03F9/7019 , G03F9/7088 , H01L51/56
摘要： A printing machine comprises an X-Y table (50) for moving a substrate (30) with respect to a print head (20). During a printing process, the substrate (30) is moved, whereas the print head (20) is intermittently activated to fire ink droplets. A camera (25) is arranged for providing images of the substrate (30) to a computer which is programmed to recognize patterns. In order for the print head (20) to be able to print a spot at a predetermined position on the substrate (30), an offset between a predetermined and an actual mutual position of the substrate (30) and the print head (20) is measured and compensated for. For the purpose of measuring this offset, a test spot (38) is printed on the substrate (30) and an offset between a predetermined and an actually obtained position of this test spot (38) is measured by means of pattern recognition.

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