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    • 4. 发明公开
    • Exposure apparatus
    • Belichtungsgerät
    • EP1930777A2
    • 2008-06-11
    • EP07122285.5
    • 2007-12-04
    • Canon Kabushiki Kaisha
    • Egashira, Shinichi
    • G03F9/00
    • G03F9/7003G03F9/7046G03F9/7076G03F9/7088G03F9/7092
    • An exposure apparatus exposes each of a plurality of regions arranged on a substrate. The apparatus includes a processor (9) configured to i) cause a measurement device (7, 8) to acquire an image signal of an alignment mark formed in each of plural regions which are at least a part of the plurality of regions and to measure a position of the alignment mark under a plurality of measurement conditions, ii) calculate a feature value of the signal acquired with respect to each of the plural regions under each of the plurality of measurement conditions, and iii) calculate, with respect to each of the plurality of measurement conditions, a coefficient of a transformation equation which transforms a coordinate of a designed position of the alignment mark to a value that approximate the feature value corresponding to the designed position, and a console (100) configured to display information of the calculated coefficients.
    • 曝光装置暴露布置在基板上的多个区域中的每一个。 该装置包括:处理器(9),其被配置为:i)使得测量装置(7,8)获取形成在多个区域中的至少一部分的多个区域中的每一个中形成的对准标记的图像信号,并且测量 在多个测量条件下的对准标记的位置,ii)计算在多个测量条件中的每一个下针对多个区域中的每一个获取的信号的特征值,以及iii)针对每个 所述多个测量条件,将所述对准标记的设计位置的坐标变换为与所述设计位置对应的所述特征值近似的值的变换方程式的系数,以及配置为显示所述对准标记的信息的控制台 计算系数。
    • 7. 发明公开
    • Multi-channel grating interference alignment sensor
    • 使用干涉光栅的多通道对准传感器
    • EP1076264A3
    • 2005-03-02
    • EP00115757.7
    • 2000-07-21
    • SVG LITHOGRAPHY SYSTEMS, INC.
    • Stanton, Stuart T.
    • G03F9/00
    • G03F9/7065G03F9/70G03F9/7092
    • An alignment sensor (30) having a fixed reference grating (60) and a movable wafer grating (68) receiving electromagnetic radiation from a coherent illumination source (34). The illumination source (34) is split into two beams by a beamsplitter (50). One beam is directed to a fixed reference grating (60) and the diffracted orders (64A, 64B, 64C, 64D) are collected. The other beam from the beamsplitter (50) is directed to a movable wafer grating (68). The diffracted orders (70A, 70B, 70C, 70D) from the movable wafer grating (68) are collected and caused to interfere with the diffracted orders from the fixed reference grating (60), causing a phase shift indicative of the wafer movement or misalignment with respect to the fixed reference grating (60). Multiple channels having discrete wavelengths or colors are used to optimize detection and alignment irrespective of wafer processing variables. A polarization fixture (38) on the illumination source (34) and a central polarizing portion (52) on the beamsplitter (50) is used to provide contrast optimization, or alternately a latent image metrology mode. The alignment sensor improves alignment accuracy irrespective of processing variables and provides flexibility improving efficiency in the manufacture of semiconductor devices.
    • 9. 发明公开
    • MARK DETECTING METHOD, EXPOSURE METHOD, DEVICE MANUFACTURING METHOD, MARK DETECTOR, EXPOSURE APPARATUS, AND DEVICE
    • 用于确定品牌,曝光方法,用于生产部件,标检测器,曝光装置及零件
    • EP1150249A1
    • 2001-10-31
    • EP99931487.5
    • 1999-07-22
    • Nikon Corporation
    • NAKAJIMA, Shin-ichi Niki Corporation
    • G06T7/00G01B11/00H01L21/027
    • G03F9/7092G03F9/70G03F9/7088
    • The object of the present invention is to provide a mark detection method, an exposure method, a device manufacturing method, a mark detection apparatus, an exposure apparatus, and a device manufactured by the use of the exposure apparatus, which are capable of reducing a position measurement error in a short time even in the case where a sampling interval must be set to about 0.2 times or more of a lower limit of a minimum periodic component. In the present invention, a mark formed on an object is irradiated with a detection beam, an image of the mark is picked up through an image-forming system, the image of the mark formed on an image pickup device is converted into an electrical image signal, a signal related to the image signal is output at predetermined sampling intervals, and a signal related to the image signal is interpolated in a cycle equal to or less than the predetermined sampling interval.
    • 本发明的目的是提供一种标记检测方法中,在曝光方法中,一种器件制造方法,标记检测装置,曝光装置,以及通过使用曝光装置的,其能够降低制造设备 在即使在采样间隔必须设定为最小周期性分量的下限为约0.2倍以上的情况下短的时间位置的测量误差。 在本发明中,形成在到对象的标记上照射检测光束,所述标记的图像通过图像形成系统拾起,形成在图像拾取器件上的标记的图像在电图像转换成 信号,与图像信号的信号是在预定的采样间隔输出,并且与所述图像信号的信号在比所述预定采样间隔等于或小于一个周期被内插。
    • 10. 发明公开
    • ALIGNMENT SIMULATION
    • 定向仿真
    • EP1090329A1
    • 2001-04-11
    • EP99920243.5
    • 1999-04-29
    • NIKON CORPORATION
    • COON, Paul, DerekCHAU, Henry, Kwok, PangAIYER, Arun, Ananth
    • G03B27/42G03B27/58
    • G03F9/7092G03F9/7076
    • An alignment simulation method simulates the signal waveform for an alignment mark using various alignment methods as well as the signal strength for an alignment mark, which is useful in optimizing the thickness of one or more layers as well as the geometry of the mark. The simulation of signal strength is also useful in optimizing the thickness of a layer for artifact wafers. The alignment simulation method includes accurately modeling the alignment mark, including one or more layers of various thicknesses and materials. The accurate modeling of the alignment mark includes such things as smoothing regions of the alignment mark and generating lateral shifts of the layers. The model of the alignment mark is a series of small pixels, each including the thickness of the layers and the layers indices of refraction. Using scalar diffraction, a complex reflectivity is generated for each pixel and a fast fourier transform is performed on the series of pixels. The results of the fast fourier transform are used to simulate the diffraction intensities for the alignment mark alignment systems, such as LIA or LSA as well as the signal waveforms. The LSA signal waveform, however, requires additional modeling of the alignment mark. An FIA image is generated by removing appropriate orders from the fast fourier transform result and performing an inverse fast fourier transform and repeating the process at different light wavelengths and illumination angles. The signal strength is the maximum value of the image minus the minimum.