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31. 发明公开

EP2769256A1 MEMS SCANNING MICROMIRROR 有权转让
标题翻译： MEMS扫描微反射镜
公开(公告)号：EP2769256A1
公开(公告)日：2014-08-27
申请号：EP12780314.6
申请日：2012-10-10
申请人： Innoluce B.V.
发明人： VAN LIEROP, Hendrikus Wilhelmus Leonardus Antonius Maria , SUIJLEN, Matthijs Alexander Gerard , VAN OS, Marijn Johannes
IPC分类号： G02B26/08
CPC分类号： G02B26/105 , B81B3/007 , B81B2201/042 , B81B2203/0109 , B81B2203/0154 , B81B2203/0163 , G02B26/0833 , G02B26/0841
摘要： A MEMS micromirror (30) is presented including a frame (60) with a mirror body (50) arranged therein. The mirror body (50) is rotatable around a rotation axis (58) extending in a plane (x-y) defined by the frame (60). The MEMS micromirror (30) further includes at least one cantilever beam assembly (70) having a longitudinal direction and extending within said plane. The MEMS micromirror (30) also includes vertical support beams (40) connected between the mirror body (50) and the frame (60) along the rotation axis (58). The at least one cantilever beam assembly (70) has a cantilever beam (72) with a first and a second end (721, 722) and a relief means (74) at the first end (721) allowing for a translation of the cantilever beam (72) at its first end (721) in said longitudinal direction. The first end (721) is coupled via the relief means (74) to the frame (60) and the second end (722) is fixed to the mirror body (50). The cantilever beam (72) has a thickness, perpendicular to a plane of the frame (60), that is smaller than its width, in the plane of the frame (60).
摘要翻译：提出了一种MEMS微反射镜（30），其包括具有布置在其中的镜体（50）的框架（60）。镜体（50）可围绕在由框架（60）限定的平面（x-y）中延伸的旋转轴线（58）旋转。 MEMS微镜（30）还包括至少一个悬臂梁组件（70），其具有纵向方向并在所述平面内延伸。 MEMS微镜（30）还包括沿旋转轴线（58）连接在镜体（50）和框架（60）之间的垂直支撑梁（40）。所述至少一个悬臂梁组件（70）具有悬臂梁（72），所述悬臂梁具有第一和第二端部（721,722）以及位于所述第一端部（721）处的释放装置（74），从而允许所述悬臂在所述纵向方向上在其第一端（721）处具有横梁（72）。第一端（721）通过释放装置（74）连接到框架（60），第二端（722）固定到镜体（50）。悬臂梁（72）在框架（60）的平面中具有垂直于框架（60）的平面的厚度，该平面小于其宽度。

32. 发明授权

EP2524198B1 MIKROELEKTROMECHANISCHES HALBLEITERBAUELEMENT UND VERFAHREN ZU SEINER HERSTELLUNG 有权转让
标题翻译：微机电半导体部件及其制造方法
公开(公告)号：EP2524198B1
公开(公告)日：2014-07-09
申请号：EP11700061.2
申请日：2011-01-10
申请人： ELMOS Semiconductor AG
发明人： BURCHARD, Bernd
IPC分类号： G01L9/00 , B81C3/00
CPC分类号： B81C1/00158 , B81B3/0018 , B81B3/0021 , B81B3/007 , B81B3/0072 , B81B3/0081 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81C1/00626 , B81C99/0035 , B81C2201/019 , G01L9/0047 , H01L29/4916 , H01L29/84

33. 发明公开

EP2748667A1 ELECTROMECHANICAL SYSTEM STRUCTURES WITH RIBS HAVING GAPS 审中-公开
标题翻译： WITH隔开的肋机电系统结构
公开(公告)号：EP2748667A1
公开(公告)日：2014-07-02
申请号：EP12769511.2
申请日：2012-08-23
申请人： Pixtronix, Inc.
发明人： ANDERSSON, Mark B. , WU, Joyce , STEYN, Jasper Lodewyk
IPC分类号： G02B26/02 , H04N5/74
CPC分类号： B81B3/007 , B81B2201/047 , B81B2203/0109 , B81B2203/0163 , B81B2203/0307 , B81B2203/051 , G02B26/023 , G09G3/346 , G09G3/3473 , G09G2300/08
摘要： This disclosure provides systems, methods and apparatus for an electromechanical systems (EMS) assembly. The EMS assembly includes a substrate, an anchor disposed on the substrate, and a suspended planar body supported over the substrate by the anchor. The suspended planar body includes at least one depression extending out of a plane of the suspended planar body and protruding towards the substrate. The suspended planar body also includes a substantially horizontal portion corresponding to a gap in the at least one depression. An extent of the gap is up to 20% of a length of the suspended planar body.

34. 发明公开

EP1990671A3 Methods of fabricating MEMS having elevated land regions for routing and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与形成为使得升高的陆地区域用于路由和处理设备
公开(公告)号：EP1990671A3
公开(公告)日：2013-07-24
申请号：EP08153794.6
申请日：2008-03-31
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/08 , B81C1/00 , G02B26/00 , G02B5/28
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device having elevated land regions for routing and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed on an array region thereof. The front substrate is also provided with elevated land regions on a peripheral region thereof. Conductive traces are formed on the land regions for routing mechanical strips. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

35. 发明授权

EP1542059B1 MICRO ROCKING DEVICE HAVING TORSION BAR 有权
标题翻译：具有扭力杆的微型摇摆装置
公开(公告)号：EP1542059B1
公开(公告)日：2013-04-24
申请号：EP02760638.3
申请日：2002-08-14
申请人： FUJITSU LIMITED
发明人： MI, Xiaoyu, c/o FUJITSU LIMITED , TSUBOI, Osamu, c/o FUJITSU LIMITED , UEDA, Satoshi, c/o FUJITSU LIMITED , SAWAKI, Ippei, c/o FUJITSU LIMITED
IPC分类号： G02B26/10 , G02B26/08 , B81B3/00
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/0235 , B81B2201/033 , B81B2201/042 , B81B2203/0109 , B81B2203/0154 , B81B2203/058

36. 发明公开

EP2523895A2 MIKROELEKTROMECHANISCHES HALBLEITERBAUELEMENT 有权转让
标题翻译：微机电半导体部件
公开(公告)号：EP2523895A2
公开(公告)日：2012-11-21
申请号：EP11700162.8
申请日：2011-01-10
申请人： ELMOS Semiconductor AG
发明人： TEN HAVE, Arnd Dr.
IPC分类号： B81B3/00
CPC分类号： B81C1/00158 , B81B3/0018 , B81B3/0021 , B81B3/007 , B81B3/0072 , B81B3/0081 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81C1/00626 , B81C99/0035 , B81C2201/019 , G01L9/0047 , H01L29/4916 , H01L29/84
摘要： The micro-electromechanical semiconductor component is provided with a semiconductor substrate (16) in which a cavity (18) is formed, which is delimited by lateral walls (18a) and by a ceiling and a floor wall (18c, 18b). In order to form a flexible connection to the region of the semiconductor substrate (16), the ceiling or floor wall (18c, 18b) is provided with grooves (19) around the cavity (18), and flexible webs (20) are formed between said grooves. At least one measuring element (22) that is sensitive to mechanical stresses is formed inside at least one of said flexible webs (20). Inside the central region (21) surrounded by the grooves (19), the ceiling or floor wall (18c, 18b) comprises a plurality of depressions (97a) reducing the mass of the central region (21) and a plurality of stiffening braces (97b) separating the depressions (97a).

37. 发明公开

EP2019811A1 MICROCOMPOSANT MUNI D'UNE CAVITE DELIMITEE PAR UN CAPOT A RESISTANCE MECANIQUE AMELIOREE 有权转让
标题翻译： WITH A提供具有改进的机械强度的限制空心微型组分A CAP
公开(公告)号：EP2019811A1
公开(公告)日：2009-02-04
申请号：EP07729329.8
申请日：2007-05-21
申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE
发明人： GILLOT, Charlotte , PORNIN, Jean-Louis , LAGOUTTE, Emmanuelle , JACQUET, Fabrice , HENTZ, Sébastien
IPC分类号： B81B7/00
CPC分类号： B81B3/007 , B81C2203/0136 , B81C2203/0145 , B81C2203/0163
摘要： The invention relates to a micro component having a cavity (13) bounded by a cap (12), containing an active part (10) supported by a substrate (11). The cap (12) has a top wall (12a) that includes stiffening means with at least one projecting stiffening element (12b), this stiffening element (12b) being located between two recessed zones (12c) of the top wall (12a) and having one end (14) away from the recessed zones (12c) and not in contact with the substrate (11).

38. 发明公开

EP1998212A2 Methods of fabricating interferometric modulators having black masks and devices formed by same 审中-公开
标题翻译：形成产生具有黑色遮光罩和装置干涉式调制器的方法，使得
公开(公告)号：EP1998212A2
公开(公告)日：2008-12-03
申请号：EP08153809.2
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/00 , B81B3/00
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating interferometric modulators having black masks and devices formed by the same are disclosed. In one embodiment, interferometric modulators are fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. The front substrate is also provided with black masks to prevent or mitigate bright areas in the actuated state of the resulting interferometric modulators. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting interferometric modulators can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
摘要翻译：制造具有黑色掩模，并通过相同的形成的器件干涉式调制器的方法是游离缺失盘。在一个，实施例的干涉式调制器通过层压前部衬底和载体，其每一个具有预成型于其上的组件制成。前基板上设置有上形成有固定电极。因此，前基板上设置有黑色遮罩以防止或在干涉式调制器的所得的致动状态下减轻明亮区域。载体，包括在被附接到前部衬底在那里形成可动电极。一些实施例的载体传递环后释放可动电极的前部衬底。在其它实施方案中，载体保持在所述前基片，并作为MEMS器件的背板。特征是通过沉积和图案化来形成，通过压印或通过图案化和蚀刻。该方法不仅降低制造成本，因此而提供更高的收益率。层叠基板之间并且将所得干涉式调制器可以俘获较小体积对压力变化和湿气泄漏不敏感。

39. 发明公开

EP1990672A2 Methods of fabricating MEMS with spacers between plates and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与形成为使得板和设备之间的间隔件过程
公开(公告)号：EP1990672A2
公开(公告)日：2008-11-12
申请号：EP08153815.9
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/08
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
摘要翻译：微机电系统（MEMS）装置与由相同的成形板和MEMS器件之间的间隔件的制造方法是游离缺失盘。在一个，实施例的MEMS装置通过层叠前部衬底和载体，其每一个具有预成型于其上的组件制成。前基板上设置有上形成有固定电极。载体，包括在被附接到前部衬底在那里形成可动电极。一些实施例的载体传递环后释放可动电极的前部衬底。。换句话说实施方案中，所述载体保持在所述前基片，并作为MEMS器件的背板。特征是通过沉积和图案化来形成，通过压印或通过图案化和蚀刻。所述前基板和在那里保持之间的间隙背板之间设置间隔物。该方法不仅降低制造成本，因此而提供更高的收益率。所得MEMS装置可以层叠基板之间并捕获更小的体积对压力变化和湿气泄漏不敏感。

40. 发明公开

EP1640329A3 System and method for protecting microelectromechanical systems array using structurally reinforced back-plate 审中-公开
标题翻译：系统和方法，用于微机电系统的矩阵的保护用的后板与所述加强结构
公开(公告)号：EP1640329A3
公开(公告)日：2007-12-05
申请号：EP05255678.4
申请日：2005-09-14
申请人： IDC, LLC
发明人： Cummings, William J. , Gally, Brian J. , Palmateer, Lauren
IPC分类号： B81B7/00
CPC分类号： B81B3/007 , B81B7/0058 , B81C2203/0163 , G02B26/001
摘要： Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate 101, an interferometric modulation display array 111 formed on the substrate 101, and a back-plate 130. The back-plate is placed over the display array 111 with a gap 124 between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.

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