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1. 发明授权

EP2867577B1 LOW-PROFILE LIGHTING SYSTEM 有权
标题翻译：小型照明系统
公开(公告)号：EP2867577B1
公开(公告)日：2016-09-07
申请号：EP13737050.8
申请日：2013-06-26
申请人： Qualcomm Mems Technologies, Inc.
发明人： HOLMAN, Robert L. , SAMPSELL, Matthew B.
IPC分类号： F21K99/00 , F21S8/02 , F21V8/00 , F21Y115/10 , F21W131/10
CPC分类号： F21K9/52 , F21K9/61 , F21S8/026 , F21V2200/20 , F21W2131/10 , F21Y2105/00 , F21Y2115/10 , G02B6/0046 , G02B6/0073 , Y10T29/49826

2. 发明公开

EP3005227A1 ULTRASONIC SENSOR WITH BONDED PIEZOELECTRIC LAYER 有权转让
标题翻译：具有粘结压电陶瓷层TRANSDUCER
公开(公告)号：EP3005227A1
公开(公告)日：2016-04-13
申请号：EP14734349.5
申请日：2014-06-03
申请人： Qualcomm Mems Technologies, Inc.
发明人： FENNELL, Leonard Eugene , BUCHAN, Nicholas Ian , BURNS, DavidWilliam , DJORDJEV, Kostadin Dimitrov , GOJEVIC, Stephen Michael , KITCHENS, Jack Conway II , SCHNEIDER, John Keith , BENNETT, Nathaniel Robert , LAVERY, Kristopher Andrew
IPC分类号： G06K9/00 , G01N29/22
CPC分类号： G01N29/22 , G06K9/0002 , H01L41/25 , Y10T29/42
摘要： This disclosure provides systems, methods and apparatus related to an ultrasonic sensor for detecting ultrasonic energy. In some implementations, the ultrasonic sensor includes a piezoelectric receiver layer bonded with an adhesive to an array of pixel circuits disposed on a substrate, each pixel circuit in the array including at least one thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit. Methods of forming ultrasonic sensors include bonding piezoelectric receiver layers to TFT arrays.

3. 发明授权

EP2619791B1 INTEGRATED PASSIVES AND POWER AMPLIFIER 有权
标题翻译：集成无源元件和电源转换器
公开(公告)号：EP2619791B1
公开(公告)日：2015-10-21
申请号：EP11770223.3
申请日：2011-09-16
申请人： Qualcomm Mems Technologies, Inc.
发明人： BLACK, Justin, Phelps , SHENOY, Ravindra, V. , GOUSEV, Evgeni, Petrovich , HADJICHRISTOS, Aristotele , MYERS, Thomas, Andrew , KIM, Jonghae , VELEZ, Mario, Francisco , LAN, Je-Hsiung, Jeffrey , LO, Chi, Shun
IPC分类号： H01L23/31 , G02B26/00 , H01L21/56
CPC分类号： G02B26/001 , H01L21/565 , H01L23/3128 , H01L2224/16225 , H01L2924/09701 , H01L2924/12044 , H01L2924/1461 , H01L2924/00

4. 发明公开

EP2909933A1 COMPOSITE DILATION MODE RESONATORS 审中-公开
标题翻译：复合扩散模式谐振器
公开(公告)号：EP2909933A1
公开(公告)日：2015-08-26
申请号：EP13756276.5
申请日：2013-08-26
申请人： Qualcomm Mems Technologies, Inc.
发明人： ZUO, Chengjie , KIM, Jonghae , YUN, Changhan, Hobie , PARK, Sang-June , STEPHANOU, Philip, Jason , LO, Chi, Shun , MIKULKA, Robert, Paul , VELEZ, Mario, Francisco , SHENOY, Ravindra, V. , NOWAK, Matthew, Michael
IPC分类号： H03H9/24 , H03H9/205 , H03H9/02
CPC分类号： H03H9/02157 , H03H9/02574 , H03H9/205 , H03H9/2405 , H03H2009/02503 , H03H2009/02527 , H03H2009/241
摘要： This disclosure provides systems, methods and apparatus related to acoustic resonators that include composite transduction layers (116, 118) for enabling selective tuning of one or more acoustic or electromechanical properties. In one aspect, a resonator structure includes one or more first electrodes (142), one or more second electrodes (144), and a transduction layer (116, 118) arranged between the first and second electrodes. The transduction layer includes a plurality of constituent layers. In some implementations, the constituent layers include one or more first piezoelectric layers and one or more second piezoelectric layers. The transduction layer is configured to, responsive to signals provided to the first and second electrodes, provide at least a first mode of vibration of the transduction layer with a displacement component along the z axis and at least a second mode of vibration of the transduction layer with a displacement component _ along the plane of the x axis and the y axis.
摘要翻译：本公开提供了与声谐振器有关的系统，方法和装置，所述系统，方法和装置包括用于实现一个或多个声学或机电属性的选择性调节的复合换能层（116,118）。在一个方面，谐振器结构包括一个或多个第一电极（142），一个或多个第二电极（144）以及布置在第一和第二电极之间的换能层（116,118）。转导层包括多个构成层。在一些实施方式中，构成层包括一个或多个第一压电层和一个或多个第二压电层。换能层被配置为响应于提供给第一和第二电极的信号提供换能层的至少第一振动模式，其具有沿z轴的位移分量和换能层的至少第二振动模式沿着x轴和y轴的平面具有位移分量_。

5. 发明公开

EP2907294A1 EAR POSITION AND GESTURE DETECTION WITH MOBILE DEVICE 有权转让
标题翻译： OHRPOSITIONS-UND GESTENERKENNUNG MIT MOBILER VORRICHTUNG
公开(公告)号：EP2907294A1
公开(公告)日：2015-08-19
申请号：EP13779493.9
申请日：2013-10-07
申请人： Qualcomm Mems Technologies, Inc.
发明人： BURNS, David William , FELNHOFER, Daniel , ELLOWAY, Donald John
IPC分类号： H04M1/60 , G06F3/044 , G06F3/041
CPC分类号： H04M1/605 , G06F3/044 , G06F3/0484 , G06F3/04883 , G06F2203/04103 , H04M2250/22
摘要： A mobile device may include a sensor array. The sensor array may be a touch sensor array, such as a projected capacitive touch (PCT) sensor array. The mobile device may be configured to determine whether one or more sensor signals from the sensor array indicate an ear gesture and/or the presence of an ear. One or more device operations may be invoked according to the determination.
摘要翻译：移动设备可以包括传感器阵列。传感器阵列可以是触摸传感器阵列，例如投影电容式触摸（PCT）传感器阵列。移动设备可以被配置为确定来自传感器阵列的一个或多个传感器信号是否指示耳朵手势和/或耳朵的存在。可以根据确定来调用一个或多个设备操作。

6. 发明公开

EP2906500A1 BACKPLATE ELECTRODE SENSOR 审中-公开
标题翻译： REAR电极板探头
公开(公告)号：EP2906500A1
公开(公告)日：2015-08-19
申请号：EP13777456.8
申请日：2013-10-08
申请人： Qualcomm Mems Technologies, Inc.
发明人： MEADOR, James C. , TCHERTKOV, Igor
IPC分类号： B81B7/02 , G01D5/241
CPC分类号： B81B7/02 , B81B2201/047 , G01D5/2417 , G01G7/06 , G01L1/146 , G01L5/0052 , G01L9/0072 , G01P15/0891 , G01P15/125 , G02B26/001 , G06F3/017 , G06F3/0412 , G06F3/044 , G06F3/0488 , G09G3/3466 , Y10T29/49117
摘要： This disclosure provides systems, methods and apparatus for electromechanical systems (EMS) device packages having integrated sensors. In one aspect, electrodes within a packaged EMS device can be used in conjunction with an electrode disposed on another substrate within the EMS device package to form one or more capacitive sensors. The capacitive sensor may be used to determine the relative deformation of substrates within the EMS device package, which can in turn be used as part of a pressure, touch, mass, or impact measuring system.

7. 发明公开

EP2831496A1 LIGHT GUIDE WITH INTERNAL LIGHT RECIRCULATION 审中-公开
标题翻译：带内部光再循环的光导
公开(公告)号：EP2831496A1
公开(公告)日：2015-02-04
申请号：EP13715097.5
申请日：2013-03-25
申请人： Qualcomm Mems Technologies, Inc.
发明人： LI, Kebin , BURNS, David William , TAVAKOLI, Hamid
IPC分类号： F21V8/00
CPC分类号： G02B6/0035 , G02B6/0055 , Y10T29/49002
摘要： This disclosure provides systems, methods, and apparatuses for illumination using illumination systems having a light guide (1000). A light source (1010) is configured to inject light into a light input edge (1030a) of the light guide. The light guide is configured to recirculate the injected light therein such that the light passes back and forth across the light guide one or more times. The light guide includes light-turning features (1040) that extract light out of the light guide. To promote light recirculation, the light-turning features have a per- pass light extraction efficiency of about 50% or less and one or more edges (1030b) of the light guide may be reflective. The light extracted out of the light guide by the light-turning features may be used to illuminate a display.
摘要翻译：本公开提供了使用具有光导（1000）的照明系统进行照明的系统，方法和设备。光源（1010）被配置为将光注入到光导的光输入边缘（1030a）中。光导被配置成使注入的光在其中再循环，使得光一次或多次地在光导上前后穿过。光导包括从光导提取光的光转向特征（1040）。为了促进光再循环，光转向特征具有大约50％或更小的光通量提取效率，并且光导的一个或多个边缘（1030b）可以是反射性的。通过光转向特征从光导中提取出的光可以用于照亮显示器。

8. 发明公开

EP2786367A1 SYSTEMS, DEVICES, AND METHODS FOR DRIVING AN ANALOG INTERFEROMETRIC MODULATOR 审中-公开
标题翻译：系统，设备和一种用于控制模拟干涉调制器
公开(公告)号：EP2786367A1
公开(公告)日：2014-10-08
申请号：EP12798521.6
申请日：2012-11-16
申请人： Qualcomm Mems Technologies, Inc.
发明人： HONG, John H. , LEE, Chong U. , MARSH, Gene W.
IPC分类号： G09G3/34
CPC分类号： G09G3/3466 , G09G2300/0426 , G09G2300/08 , G09G2300/0876 , G09G2320/0233 , G09G2320/029 , G09G2320/0295
摘要： This disclosure provides systems, methods, and apparatus for calibrating and controlling the actuation of an analog interferometric modulator. In one aspect, an electrode of a movable layer of the analog interferometric modulator may include a part for receiving a drive voltage, and an electrically isolated part. A voltage may be sensed from the electrically isolated part, and used to determine the position of the movable layer and/or provide feedback to the drive voltage.

9. 发明授权

EP1540738B1 CONTROLLING ELECTROMECHANICAL BEHAVIOR OF STRUCTURES WITHIN A MICROELECTROMECHANICAL SYSTEMS DEVICE 有权
标题翻译：结构机电行为内的微机电系统设置控制
公开(公告)号：EP1540738B1
公开(公告)日：2014-09-17
申请号：EP03759463.7
申请日：2003-09-18
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： MILES, Mark W. , BATEY, John , CHUI, Clarence c/o Iridigm Display Corp. , KOTHARI, Manish
IPC分类号： H01L29/82 , H01L21/00
CPC分类号： G02B26/001 , B81B3/0035

10. 发明公开

EP2768767A1 STACKED VIAS FOR VERTICAL INTEGRATION 审中-公开
标题翻译： STACKED经文纵向整合
公开(公告)号：EP2768767A1
公开(公告)日：2014-08-27
申请号：EP12781228.7
申请日：2012-10-17
申请人： Qualcomm Mems Technologies, Inc.
发明人： PAN, Yaoling , ZHOU, Lixia
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0006 , B81C1/00246
摘要： This disclosure provides systems, methods and apparatus for a via structure. In one aspect, an apparatus includes a substrate and a first electromechanical systems device on a surface of the substrate. The first electromechanical systems device includes a first metal layer and a second metal layer. A first via structure can be included on the surface of the substrate. The first via structure includes the first metal layer, the second metal layer, and a third metal layer. The first metal layer of the first electromechanical systems device may be the same metal layer as the first metal layer of the first via structure.

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