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1. 发明公开

EP1990672A3 Methods of fabricating MEMS with spacers between plates and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与形成为使得板和设备之间的间隔件过程
公开(公告)号：EP1990672A3
公开(公告)日：2013-12-18
申请号：EP08153815.9
申请日：2008-03-31
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： B81B3/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

2. 发明公开

EP2495212A3 Mems devices having support structures and methods of fabricating the same 审中-公开
标题翻译：与支撑结构及其制造方法的MEMS装置
公开(公告)号：EP2495212A3
公开(公告)日：2012-10-31
申请号：EP12170329.2
申请日：2006-07-20
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Chui, Clarence , Chung, Wonsuk , Ganti, Surya Prakash , Kothari, Manish , Miles, Mark W. , Sampsell, Jeffrey Brian , Sasagawa, Teruo
IPC分类号： B81B3/00 , B81C1/00 , G02B26/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B3/0072 , B81B2201/047 , B81B2203/0163 , B81B2203/019 , B81B2203/0307 , B81B2203/053 , B81C1/00142 , B81C1/00666 , B81C2201/0167 , G02B26/001 , Y10S359/90
摘要： Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

3. 发明公开

EP1990673A2 Methods of fabricating MEMS with a shaped carrier for mechanical strips and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与形成为使得金属带和装置的成形载体处理
公开(公告)号：EP1990673A2
公开(公告)日：2008-11-12
申请号：EP08153820.9
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/08
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with a shaped carrier for mechanical strips and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features on the carrier are formed by embossing, by inscribing, or by patterning and etching. Static interferometric modulators can also be formed by such shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
摘要翻译：微机电系统（MEMS）装置与由相同的成形机械条带和MEMS器件的成形载体的制造方法是游离缺失盘。在一个，实施例的MEMS装置通过层叠前部衬底和载体，其每一个具有预成型于其上的组件制成。前基板上设置有上形成有固定电极。载体，包括在被附接到前部衬底在那里形成可动电极。一些实施例的载体传递环后释放可动电极的前部衬底。在其它实施方案中，载体保持在所述前基片，并作为MEMS器件的背板。在载体上的特征由压花加工形成，通过刻或通过图案化和蚀刻。静态干涉式调制器可因此通过寻求成形或预成形和层压来形成。该方法不仅降低制造成本，因此而提供更高的收益率。所得MEMS装置可以层叠基板之间并捕获更小的体积对压力变化和湿气泄漏不敏感。

4. 发明公开

EP1990669A2 Method of fabrication MEMS by lamination and devices formed by same 审中-公开
标题翻译：一种用于通过层压和制造MEMS器件的过程中形成，使得
公开(公告)号：EP1990669A2
公开(公告)日：2008-11-12
申请号：EP08153803.5
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/00 , B81B3/00 , H01L31/00
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with reduced masking and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. In some embodiments in which the MEMS device serves as an interferometric modulator, the front substrate is also provided with black masks to prevent or mitigate bright areas in the actuated state of the MEMS device. Static interferometric modulators can also be formed by shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
摘要翻译：微机电系统（MEMS）装置与由相同的成形减小的掩蔽和MEMS器件的制造方法是游离缺失盘。在一个，实施例的MEMS装置通过层叠前部衬底和载体，其每一个具有预成型于其上的组件制成。前基板上设置有上形成有固定电极。载体，包括在被附接到前部衬底在那里形成可动电极。一些实施例的载体传递环后释放可动电极的前部衬底。在其它实施方案中，载体保持在所述前基片，并作为MEMS器件的背板。特征是通过沉积和图案化来形成，通过压印或通过图案化和蚀刻。在其中MEMS装置用作对干涉式调制器的一些实施例中，前部衬底因此设置有黑色遮罩以防止或在致动的MEMS装置的状态减轻明亮区域。静态干涉式调制器因此可通过成型或预成形和层压来形成。该方法不仅降低制造成本，因此而提供更高的收益率。所得MEMS装置可以层叠基板之间并捕获更小的体积对压力变化和湿气泄漏不敏感。

5. 发明公开

EP2221799A3 Area array modulation and lead reduction in interferometric modulators 审中-公开
公开(公告)号：EP2221799A3
公开(公告)日：2011-05-25
申请号：EP10165437.4
申请日：2004-11-22
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Chui, Clarence , Kothari, Manish
IPC分类号： G09G3/34 , G09G3/20
CPC分类号： G09G3/3466 , G02B26/001 , G09G3/2074 , G09G3/2081 , G09G2300/06 , G09G2310/0267 , G09G2310/0297
摘要： A light modulator is arranged as an array of rows and columns of interferometric display elements. Each element is divided into sub-rows of sub-elements. Array connection lines transmit operating signals to the display elements, with one connection line corresponding to one row of display elements in the array. Sub-array connection lines electrically connect to each array connection line. Switches transmit the operating signals from each array connection line to the sub-rows to effect gray scale modulation.

6. 发明公开

EP2221798A2 Area array modulation and lead reduction in interferometric modulators 有权
标题翻译：干扰素调节剂和调味剂
公开(公告)号：EP2221798A2
公开(公告)日：2010-08-25
申请号：EP10165436.6
申请日：2004-11-22
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Chui, Clarence , Kothari, Manish
IPC分类号： G09G3/34
CPC分类号： G09G3/3466 , G02B26/001 , G09G3/2074 , G09G3/2081 , G09G2300/06 , G09G2310/0267 , G09G2310/0297
摘要： A light modulator is arranged as an array of rows and columns of interferometric display elements. Each element is divided into sub-rows of sub-elements. Array connection lines transmit operating signals to the display elements, with one connection line corresponding to one row of display elements in the array. Sub-array connection lines electrically connect to each array connection line. Switches transmit the operating signals from each array connection line to the sub-rows to effect gray scale modulation.
摘要翻译：光调制器被布置为干涉式显示元件的行和列的阵列。每个元素被划分成子行子元素。阵列连接线将操作信号发送到显示元件，其中一条连接线对应于阵列中的一行显示元件。子阵列连接线电连接到每个阵列连接线。开关将来自每个阵列连接线的操作信号传输到子行以实现灰度调制。

7. 发明公开

EP1998210A3 Methods of fabricating mems with a carrier for patterned mechanical strips and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与载体结构化的金属带和器件被形成为使得处理
公开(公告)号：EP1998210A3
公开(公告)日：2009-03-04
申请号：EP08153791.2
申请日：2008-03-31
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/00 , B81B3/00
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with a carrier for patterned mechanical strips and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The movable electrodes are formed on the carrier by, for example, deposition and patterning. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

8. 发明公开

EP1998211A2 Methods of fabricating mems with a shaped substrate and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的具有由此形成的成型基底和设备处理
公开(公告)号：EP1998211A2
公开(公告)日：2008-12-03
申请号：EP08153806.8
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip, Don
IPC分类号： G02B26/00 , B81B3/00
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with shaped substrate and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features on the front substrate are shaped by embossing, by inscribing, or by patterning and etching. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
摘要翻译：微机电系统（MEMS）装置与由相同的形成的成型基板和MEMS器件的制造方法是游离缺失盘。在一个，实施例的MEMS装置通过层叠前部衬底和载体，其每一个具有预成型于其上的组件制成。前基板上设置有上形成有固定电极。载体，包括在被附接到前部衬底在那里形成可动电极。一些实施例的载体传递环后释放可动电极的前部衬底。在其它实施方案中，载体保持在所述前基片，并作为MEMS器件的背板。在前面基板的特征由压花形，通过刻或通过图案化和蚀刻。该方法不仅降低制造成本，因此而提供更高的收益率。所得MEMS装置可以层叠基板之间并捕获更小的体积对压力变化和湿气泄漏不敏感。

9. 发明公开

EP1988333A1 Dual film light guide for illuminating displays 审中-公开
标题翻译：双薄膜光导照明显示
公开(公告)号：EP1988333A1
公开(公告)日：2008-11-05
申请号：EP08153770.6
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gruhlke, Russell Wayne , Mienko, Marek , Xu, Gang , Bita, Ion
IPC分类号： F21V8/00
CPC分类号： G02B6/0053 , G02B6/0038 , G02B26/001
摘要： A front light guide panel including a plurality of embedded surface features is provided. The front light panel is configured to deliver uniform illumination from an artificial light source disposed at one side of the font light panel to an array of display elements located behind the front light guide while allowing for the option of illumination from ambient lighting transmitted through the light guide panel. The surface embedded surface relief features create air pockets within the light guide panel. Light incident on the side surface of the light guide propagates though the light guide until it strikes an air/light material guide interface at one on the air pockets. The light is then turned by total internal reflection through a large angle such that it exits an output face disposed in front of the array of display elements.
摘要翻译：提供了包括多个嵌入表面特征的前导光板。前灯板被配置为将来自布置在字体灯板的一侧的人造光源的均匀照明传递到位于前导光板后面的显示元件阵列，同时允许从通过灯传输的环境照明的照明选项指导小组。表面嵌入式表面浮雕功能可在导光板内形成气穴。入射在光导的侧表面上的光传播通过光导，直到其撞击气囊上的一个空气/轻质材料引导界面。然后通过全内反射使光转过大角度，从而使其离开布置在显示元件阵列前面的输出面。

10. 发明公开

EP2221798A3 Area array modulation and lead reduction in interferometric modulators 有权
标题翻译：阵列的区域调制和减少在干涉式调制器连接的
公开(公告)号：EP2221798A3
公开(公告)日：2011-05-25
申请号：EP10165436.6
申请日：2004-11-22
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Chui, Clarence , Kothari, Manish
IPC分类号： G09G3/34
CPC分类号： G09G3/3466 , G02B26/001 , G09G3/2074 , G09G3/2081 , G09G2300/06 , G09G2310/0267 , G09G2310/0297
摘要： A light modulator is arranged as an array of rows and columns of interferometric display elements. Each element is divided into sub-rows of sub-elements. Array connection lines transmit operating signals to the display elements, with one connection line corresponding to one row of display elements in the array. Sub-array connection lines electrically connect to each array connection line. Switches transmit the operating signals from each array connection line to the sub-rows to effect gray scale modulation.

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