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1. 发明公开

EP1998209A3 Methods of fabricating static interferometric display devices and devices formed by same 审中-公开
标题翻译：一种用于干涉式显示器设备和显示器的制造中的是被形成为使得处理
公开(公告)号：EP1998209A3
公开(公告)日：2009-03-04
申请号：EP08153787.0
申请日：2008-03-31
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/00 , B81B3/00 , G02B5/28
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating static interferometric display devices and devices formed by the same are disclosed. In one embodiment, a static interferometric display device is fabricated by laminating a front substrate and a backplate, each of which has components preformed thereon. At least one of the front substrate and the backplate has cavities of selected depth for interferometric modulation. Features are formed by deposition and patterning, by embossing, or by patterning and etching. The methods not only reduce the manufacturing costs, but also provide a higher yield.

2. 发明公开

EP1998210A3 Methods of fabricating mems with a carrier for patterned mechanical strips and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与载体结构化的金属带和器件被形成为使得处理
公开(公告)号：EP1998210A3
公开(公告)日：2009-03-04
申请号：EP08153791.2
申请日：2008-03-31
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/00 , B81B3/00
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with a carrier for patterned mechanical strips and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The movable electrodes are formed on the carrier by, for example, deposition and patterning. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

3. 发明公开

EP2012169A2 MEMS devices having improved uniformity and methods for making them 审中-公开
标题翻译：微机电伺服电机Uniformitätund deren Herstellungsverfahren
公开(公告)号：EP2012169A2
公开(公告)日：2009-01-07
申请号：EP08153313.5
申请日：2008-03-26
申请人： Qualcomm Mems Technologies, Inc.
发明人： Heald, David L. , Zhong, Fan , Floyd, Philip Don
IPC分类号： G02B26/08
CPC分类号： G02B26/001 , B81B3/0072 , B81B2201/047
摘要： Disclosed is a microelectromechanical system (MEMS) device and method of manufacturing the same. In one aspect, MEMS such as an interferometric modulator include one or more elongated interior posts and support rails supporting a deformable reflective layer, where the elongated interior posts are entirely within an interferometric cavity and aligned parallel with the support rails. In another aspect, the interferometric modulator includes one or more elongated etch release holes formed in the deformable reflective layer and aligned parallel with channels formed in the deformable reflective layer defining parallel strips of the deformable reflective layer.
摘要翻译：公开了一种微机电系统（MEMS）装置及其制造方法。在一个方面，诸如干涉式调制器的MEMS包括一个或多个细长的内部柱和支撑可变形的反射层的支撑轨道，其中细长的内部柱完全在干涉式空腔内并与支撑轨平行排列。在另一方面，干涉式调制器包括形成在可变形反射层中的一个或多个细长的蚀刻释放孔，并且与形成在可变形反射层中形成的沟道平行地限定可变形反射层的平行条带。

4. 发明公开

EP1990672A3 Methods of fabricating MEMS with spacers between plates and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与形成为使得板和设备之间的间隔件过程
公开(公告)号：EP1990672A3
公开(公告)日：2013-12-18
申请号：EP08153815.9
申请日：2008-03-31
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： B81B3/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

5. 发明公开

EP1990673A2 Methods of fabricating MEMS with a shaped carrier for mechanical strips and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与形成为使得金属带和装置的成形载体处理
公开(公告)号：EP1990673A2
公开(公告)日：2008-11-12
申请号：EP08153820.9
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/08
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with a shaped carrier for mechanical strips and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features on the carrier are formed by embossing, by inscribing, or by patterning and etching. Static interferometric modulators can also be formed by such shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
摘要翻译：微机电系统（MEMS）装置与由相同的成形机械条带和MEMS器件的成形载体的制造方法是游离缺失盘。在一个，实施例的MEMS装置通过层叠前部衬底和载体，其每一个具有预成型于其上的组件制成。前基板上设置有上形成有固定电极。载体，包括在被附接到前部衬底在那里形成可动电极。一些实施例的载体传递环后释放可动电极的前部衬底。在其它实施方案中，载体保持在所述前基片，并作为MEMS器件的背板。在载体上的特征由压花加工形成，通过刻或通过图案化和蚀刻。静态干涉式调制器可因此通过寻求成形或预成形和层压来形成。该方法不仅降低制造成本，因此而提供更高的收益率。所得MEMS装置可以层叠基板之间并捕获更小的体积对压力变化和湿气泄漏不敏感。

6. 发明公开

EP1990669A2 Method of fabrication MEMS by lamination and devices formed by same 审中-公开
标题翻译：一种用于通过层压和制造MEMS器件的过程中形成，使得
公开(公告)号：EP1990669A2
公开(公告)日：2008-11-12
申请号：EP08153803.5
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/00 , B81B3/00 , H01L31/00
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with reduced masking and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. In some embodiments in which the MEMS device serves as an interferometric modulator, the front substrate is also provided with black masks to prevent or mitigate bright areas in the actuated state of the MEMS device. Static interferometric modulators can also be formed by shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
摘要翻译：微机电系统（MEMS）装置与由相同的成形减小的掩蔽和MEMS器件的制造方法是游离缺失盘。在一个，实施例的MEMS装置通过层叠前部衬底和载体，其每一个具有预成型于其上的组件制成。前基板上设置有上形成有固定电极。载体，包括在被附接到前部衬底在那里形成可动电极。一些实施例的载体传递环后释放可动电极的前部衬底。在其它实施方案中，载体保持在所述前基片，并作为MEMS器件的背板。特征是通过沉积和图案化来形成，通过压印或通过图案化和蚀刻。在其中MEMS装置用作对干涉式调制器的一些实施例中，前部衬底因此设置有黑色遮罩以防止或在致动的MEMS装置的状态减轻明亮区域。静态干涉式调制器因此可通过成型或预成形和层压来形成。该方法不仅降低制造成本，因此而提供更高的收益率。所得MEMS装置可以层叠基板之间并捕获更小的体积对压力变化和湿气泄漏不敏感。

7. 发明公开

EP1990671A3 Methods of fabricating MEMS having elevated land regions for routing and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与形成为使得升高的陆地区域用于路由和处理设备
公开(公告)号：EP1990671A3
公开(公告)日：2013-07-24
申请号：EP08153794.6
申请日：2008-03-31
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/08 , B81C1/00 , G02B26/00 , G02B5/28
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device having elevated land regions for routing and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed on an array region thereof. The front substrate is also provided with elevated land regions on a peripheral region thereof. Conductive traces are formed on the land regions for routing mechanical strips. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

8. 发明公开

EP1998212A2 Methods of fabricating interferometric modulators having black masks and devices formed by same 审中-公开
标题翻译：形成产生具有黑色遮光罩和装置干涉式调制器的方法，使得
公开(公告)号：EP1998212A2
公开(公告)日：2008-12-03
申请号：EP08153809.2
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/00 , B81B3/00
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating interferometric modulators having black masks and devices formed by the same are disclosed. In one embodiment, interferometric modulators are fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. The front substrate is also provided with black masks to prevent or mitigate bright areas in the actuated state of the resulting interferometric modulators. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting interferometric modulators can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
摘要翻译：制造具有黑色掩模，并通过相同的形成的器件干涉式调制器的方法是游离缺失盘。在一个，实施例的干涉式调制器通过层压前部衬底和载体，其每一个具有预成型于其上的组件制成。前基板上设置有上形成有固定电极。因此，前基板上设置有黑色遮罩以防止或在干涉式调制器的所得的致动状态下减轻明亮区域。载体，包括在被附接到前部衬底在那里形成可动电极。一些实施例的载体传递环后释放可动电极的前部衬底。在其它实施方案中，载体保持在所述前基片，并作为MEMS器件的背板。特征是通过沉积和图案化来形成，通过压印或通过图案化和蚀刻。该方法不仅降低制造成本，因此而提供更高的收益率。层叠基板之间并且将所得干涉式调制器可以俘获较小体积对压力变化和湿气泄漏不敏感。

9. 发明公开

EP1990672A2 Methods of fabricating MEMS with spacers between plates and devices formed by same 审中-公开
标题翻译：一种用于生产MEMS的与形成为使得板和设备之间的间隔件过程
公开(公告)号：EP1990672A2
公开(公告)日：2008-11-12
申请号：EP08153815.9
申请日：2008-03-31
申请人： Qualcomm Mems Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/08
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
摘要翻译：微机电系统（MEMS）装置与由相同的成形板和MEMS器件之间的间隔件的制造方法是游离缺失盘。在一个，实施例的MEMS装置通过层叠前部衬底和载体，其每一个具有预成型于其上的组件制成。前基板上设置有上形成有固定电极。载体，包括在被附接到前部衬底在那里形成可动电极。一些实施例的载体传递环后释放可动电极的前部衬底。。换句话说实施方案中，所述载体保持在所述前基片，并作为MEMS器件的背板。特征是通过沉积和图案化来形成，通过压印或通过图案化和蚀刻。所述前基板和在那里保持之间的间隙背板之间设置间隔物。该方法不仅降低制造成本，因此而提供更高的收益率。所得MEMS装置可以层叠基板之间并捕获更小的体积对压力变化和湿气泄漏不敏感。

10. 发明公开

EP1998212A3 Methods of fabricating interferometric modulators having black masks and devices formed by same 审中-公开
标题翻译：形成产生具有黑色遮光罩和装置干涉式调制器的方法，使得
公开(公告)号：EP1998212A3
公开(公告)日：2009-03-04
申请号：EP08153809.2
申请日：2008-03-31
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Sampsell, Jeffrey Brian , Gally, Brian James , Floyd, Philip Don
IPC分类号： G02B26/00 , B81B3/00
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
摘要： Methods of fabricating interferometric modulators having black masks and devices formed by the same are disclosed. In one embodiment, interferometric modulators are fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. The front substrate is also provided with black masks to prevent or mitigate bright areas in the actuated state of the resulting interferometric modulators. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting interferometric modulators can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

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