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    • 31. 发明公开
    • Semiconductor integrated circuit device
    • 半导体集成电路设备
    • EP0459502A3
    • 1993-01-13
    • EP91108897.9
    • 1991-05-31
    • KABUSHIKI KAISHA TOSHIBATOSHIBA MICRO-ELECTRONICS CORPORATION
    • Tokonami, KatsujiOhshima, Shigeo
    • H01L23/50H01L23/485
    • H01L24/06H01L23/5286H01L24/48H01L24/49H01L2224/05554H01L2224/48227H01L2224/49113H01L2924/00014H01L2924/14H01L2224/45099H01L2224/05599
    • There is disclosed a semiconductor integrated circuit device having: external input signal leads (109A,B) provided outside a semiconductor chip (201); a power supply lead (108) provided outside the semiconductor chip (201); a first electrode (104A) connected to an internal circuit (102A) on the semiconductor chip (201), and arranged close to the external input signal lead (109A), wherein when the circuit (102A) is caused to be operative, the first electrode (104A) is connected to the external input signal lead (109A); and a second electrode (105A) connected to the first electrode (104A) on the semiconductor chip (201), and arranged close to said power supply lead (108), wherein when the circuit (102A) is not caused to be operative, the second electrode (105A) is connected to the power supply lead (108). This invention is also applicable to a device where there are provided a plurality of internal circuits (102a, 102b). In this case, a plurality of the first electrodes (104a, 104b) drawn out from the internal circuits (102A,102B) are arranged close to the external input signal lead (109A,109B), and a plurality of the second electrodes (105a, 105b) similarly drawn out from the internal circuits (102A,102B) are arranged close to the power supply lead (108).
    • 公开了一种半导体集成电路器件,其具有设置在半导体芯片的外部的外部输入信号引线(109) 设置在所述半导体芯片外部的电源引线(108) 连接到半导体芯片上的内部电路(102)并且靠近外部输入信号引线设置的第一电极(104),其中当使电路工作时,第一电极连接到外部输入信号引线 ; 以及连接到半导体芯片上的第一电极并且靠近所述电源引线设置的第二电极(105),其中当不使电路工作时,第二电极连接到电源引线。 本发明适用于设置有多个内部电路(102a,102b)的装置。 在这种情况下,从内部电路引出的多个第一电极(104a,104b)布置成靠近外部输入信号引线,并且多个第二电极(105a,105b)类似地从内部电路中抽出 靠近电源线安排。
    • 33. 发明公开
    • Semiconductor memory device
    • 半导体存储器件
    • EP0432509A3
    • 1992-09-30
    • EP90121917.0
    • 1990-11-15
    • KABUSHIKI KAISHA TOSHIBATOSHIBA MICRO-ELECTRONICS CORPORATION
    • Kiryu, MasakazuOhshima, Shigeo
    • G11C7/00G11C11/409
    • G11C7/00G11C11/4096
    • A semiconductor memory device comprises a memory cell array, a row decoder (RD), a column decoder (CP1), registers (CR) and a control unit (BLW). The control unit (BLW) allows the write operational mode of the column decoder (CD1) to switch. In the ordinary write operational mode, data in the n registers (CR) are written into the active memory cells of the n memory cell columns in one column block (CB) selected by the column decoder, respectively. In the block write mode, data in the n registers are written into active memory cells of the n memory cell columns in the 2 N column blocks selected by the column decoder, respectively. Another semiconductor memory device comprises N memory units (UNT). Each memory unit (UNT) comprises a memory cell array, a row decoder (RD), a first column decoder (CP1), a second column decoder (CD2), a data input terminal (WI/O), registers (CR) and a control circuit. The control circuit is operative to allow the operational mode. When the device is in the ordinary mode, data latched in the register (CR) is written into one memory cell (MC) connected to one word line (WL) selected by the row decoder (RD) of one column selected by the first column decoder (CD1) of column blocks (CB) selected by the second decoder (CD2). While when the device is in the block write mode, data latched in the register (CR) is written at the same time into j memory cells (MC) connected to one word line (WL) selected by the row decoder (RD) of column blocks (CB) selected by the second column decoder (CD2).
    • 半导体存储器件包括存储单元阵列,行解码器(RD),列解码器(CP1),寄存器(CR)和控制单元(BLW)。 控制单元(BLW)允许列解码器(CD1)的写操作模式切换。 在普通写入操作模式中,n个寄存器(CR)中的数据分别被写入由列解码器选择的一个列块(CB)中的n个存储器单元列的活动存储器单元中。 在块写入模式中,将n个寄存器中的数据分别写入由列解码器选择的2N个列块中的n个存储器单元列中的有效存储器单元。 另一种半导体存储器件包括N个存储单元(UNT)。 每个存储单元(UNT)包括存储单元阵列,行解码器(RD),第一列解码器(CP1),第二列解码器(CD2),数据输入端子(WI / O),寄存器(CR)和 一个控制电路。 控制电路可操作以允许操作模式。 当器件处于普通模式时,锁存在寄存器(CR)中的数据被写入连接到由第一列选择的一列的行解码器(RD)选择的一个字线(WL)的一个存储器单元(MC) 由第二解码器(CD2)选择的列块(CB)的解码器(CD1)。 而当器件处于块写入模式时,锁存在寄存器(CR)中的数据同时写入连接到由列的行解码器(RD)选择的一个字线(WL)的j个存储器单元(MC) 由第二列解码器(CD2)选择的块(CB)。
    • 35. 发明公开
    • Semiconductor memory device
    • 半导体存储器件
    • EP0464468A2
    • 1992-01-08
    • EP91110045.1
    • 1991-06-19
    • KABUSHIKI KAISHA TOSHIBA
    • Miyamoto, ShinjiOhshima, Shigeo
    • G11C5/14G11C7/00
    • G11C5/14G11C7/1051
    • A semiconductor memory device having: a first power source (P1) having a non-ground potential V cc1 terminal and a ground potential V ss1 terminal;
         the internal circuit (10) being supplied with power from the power source (P1) dedicated to the internal circuit, the internal circuit selecting a memory cell (MC) of a memory cell array (4) in accordance with an inputted address (A1, A2) and having a first output terminal (1) and a second output terminal (2), and the first output terminal outputting one of the pair of potentials V cc1 and V ss1 and the second output terminal outputting the other of the pair, in accordance with the data in the selected memory cell; a second power source (P2) output circuit (20) and having a non-ground potential V cc2 terminal and a ground potential V ss2 terminal; and the output circuit being supplied with power from the power source dedicated to the output circuit, the output circuit having first and second transistors (T1, T0) serially connected between the V cc2 terminal and V ss2 terminal, the control terminals of the first and second transistors being connected to the first and second output terminals (1, 2), and having a third transistor (T2) being connected between an interconnection between the first and second transistors connected to a data output terminal (D out ) from which data is externally outputted, and the first output terminal, and the control terminal of the third transistor being connected to the second output terminal (2).
    • 一种半导体存储器件,具有:具有非接地电位Vcc1端子和接地电位Vss1端子的第一电源(P1) 内部电路(10)由专用于内部电路的电源(P1)供电,内部电路根据输入的地址(A1,A1)选择存储单元阵列(4)的存储单元(MC) A2)并且具有第一输出端子(1)和第二输出端子(2),并且第一输出端子输出一对电位Vcc1和Vss1中的一个,并且第二输出端子输出另一个电位,根据 所选存储单元中的数据; 第二电源(P2)输出电路(20),具有非接地电位Vcc2端子和接地电位Vss2端子; 并且输出电路由专用于输出电路的电源供电,输出电路具有串联连接在Vcc2端子和Vss2端子之间的第一和第二晶体管(T1,T0),第一和第二晶体管 连接到所述第一和第二输出端子,并且具有第三晶体管,所述第三晶体管连接在连接到从外部输出数据的数据输出端子的第一和第二晶体管之间的互连之间, 和第一输出端子,并且第三晶体管的控制端子连接到第二输出端子(2)。