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11. 发明授权

EP2680679B1 A circuit board system with mechanical protection 有权转让
标题翻译：具有机械保护的电路板系统
公开(公告)号：EP2680679B1
公开(公告)日：2018-01-17
申请号：EP13171339.8
申请日：2013-06-11
申请人： Coriant Oy
发明人： Holma, Antti , Kokko, Peter
IPC分类号： H05K3/22 , H05K3/30
CPC分类号： H05K3/303 , H05K1/02 , H05K3/22 , H05K3/222 , H05K3/30 , H05K3/306 , H05K2201/09972 , H05K2201/10189 , H05K2201/10303 , H05K2201/10363 , H05K2201/1059 , H05K2201/2018 , H05K2203/162 , Y10T29/49004 , Y10T29/4913
摘要： A circuit board system comprising mechanical protection of electrical components is presented. The circuit board system comprises a circuit board (101) furnished with electrical components (103-111) and a protection element (102) attached to areas of the circuit board which are free from the electrical components. The protection element has thickness in the direction perpendicular to the circuit board and it is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board. Thus, the protection element constitutes barriers protecting the electrical components but still allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe testing. The body of the protection element can be made of same material as the electrically insulating body of the circuit board. Thus, the thermal expansion coefficient of the protection element can be substantially the same as that of the circuit board.

12. 发明授权

EP2533617B1 PRINTED CIRCUIT BOARD WITH CHIP PACKAGE COMPONENT 有权
标题翻译：印刷电路板与芯片包装组件
公开(公告)号：EP2533617B1
公开(公告)日：2017-12-13
申请号：EP11736603.9
申请日：2011-01-10
申请人： Huawei Device Co., Ltd.
发明人： JIANG, Zhiwei , CHEN, Xiaochen , GUO, Zhipeng
IPC分类号： H05K1/11 , H05K1/14 , H05K3/22
CPC分类号： H05K1/111 , H05K1/112 , H05K1/141 , H05K3/225 , H05K2201/09072 , H05K2201/09381 , H05K2201/0939 , H05K2201/09663 , H05K2203/042 , Y02P70/611
摘要： Embodiments of the present invention disclose a PCBA chip package component and a soldering component, which can facilitate repairing of a PCBA chip package module. The PCBA chip package component in the embodiments of the present invention includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad. The embodiments of the present invention further provides a soldering component. The embodiments of the present invention may facilitate the repairing of the PCBA chip package component.

13. 发明授权

EP2822033B1 Formation of conductive circuit 有权
标题翻译：导电电路的形成
公开(公告)号：EP2822033B1
公开(公告)日：2017-11-29
申请号：EP14172469.0
申请日：2014-06-16
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Hamada, Yoshitaka
IPC分类号： H01L25/065 , H05K1/03 , H05K1/09 , H05K3/22 , H05K3/36 , H01L23/00 , H01L25/00
CPC分类号： H05K1/095 , H01L24/11 , H01L24/13 , H01L24/75 , H01L24/81 , H01L24/98 , H01L25/0657 , H01L25/50 , H01L2224/11318 , H01L2224/1132 , H01L2224/11848 , H01L2224/119 , H01L2224/11901 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13291 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13387 , H01L2224/1339 , H01L2224/13393 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/16148 , H01L2224/16238 , H01L2224/75251 , H01L2224/75272 , H01L2224/81193 , H01L2224/8121 , H01L2224/81862 , H01L2224/9212 , H01L2225/06513 , H01L2924/12042 , H01L2924/351 , H05K1/0306 , H05K3/225 , H05K3/368 , H01L2924/00 , H01L2924/00014 , H01L2924/01006 , H01L2924/0542 , H01L2924/0103 , H01L2924/0544 , H01L2924/0105 , H01L2924/053 , H01L2924/01051 , H01L2924/0549 , H01L2924/04642 , H01L2924/00012 , H01L2924/014
摘要： A conductive circuit is formed using a substantially solvent-free, liquid, addition curable, conductive circuit-forming ink composition comprising (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups, (B) an organohydrogenpolysiloxane having at least two SiH groups, (C) conductive particles, (D) a thixotropic agent, and (E) a hydrosilylation catalyst. The ink composition is printed on a metal electrode to form a green circuit pattern layer, which is fired and cured for thereby forming a conductive circuit and bonding the conductive circuit to the metal electrode.

14. 发明公开

EP3058113A4 LIFT PRINTING OF MULTI-COMPOSITION MATERIAL STRUCTURES 有权
标题翻译： ABZUGDRUCK VON STRUKTUREN AUS EINEM MEHRTEILIGEN材料
公开(公告)号：EP3058113A4
公开(公告)日：2017-08-09
申请号：EP14853486
申请日：2014-10-07
申请人： ORBOTECH LTD
发明人： ZENOU MICHAEL , KOTLER ZVI
IPC分类号： C23C14/28 , B23K26/08 , B41M5/025 , C23C26/02 , H01L21/268 , H05K3/00 , H05K3/12 , H05K3/22
CPC分类号： H01L21/268 , B33Y10/00 , B33Y30/00 , B41M5/025 , B41M2205/08 , C23C26/02 , H01G7/021 , H01G7/026 , H01L21/02601 , H01L21/02612 , H01L21/288 , H05K3/1241 , H05K3/225

15. 发明公开

EP2984912A4 MATERIALS, ELECTRONIC SYSTEMS AND MODES FOR ACTIVE AND PASSIVE TRANSIENCE 有权
标题翻译：材料，电子体制和方式主动和被动短暂
公开(公告)号：EP2984912A4
公开(公告)日：2017-01-25
申请号：EP14782216
申请日：2014-04-11
申请人： UNIV ILLINOIS
发明人： ROGERS JOHN A , LEE CHI HWAN , YIN LAN , HUANG XIAN , LEAL CECILIA MARIA DAS NEVES BARBOSA , HARBURG DANIEL VINCENT
IPC分类号： H05K7/00 , A61B5/00 , A61M5/44 , G06K19/077 , H01L21/70 , H01L23/00 , H01L23/06 , H05K1/02 , H05K1/03 , H05K3/22 , H05K3/28
CPC分类号： H05K1/185 , A61B5/686 , A61B2562/125 , A61M5/44 , G06K19/0775 , H01L21/02164 , H01L21/0217 , H01L21/02274 , H01L21/0228 , H01L21/31111 , H01L21/31133 , H01L21/56 , H01L23/291 , H01L23/3121 , H01L23/3192 , H01L23/49894 , H01L25/0655 , H01L2924/0002 , H05K1/0275 , H05K1/0286 , H05K1/0306 , H05K3/22 , H05K3/285 , H05K3/287 , H05K3/288 , H05K5/069 , H05K13/0023 , H05K2201/10151 , H05K2201/10196 , H05K2201/10212 , H05K2203/0271 , H05K2203/0292 , H05K2203/0769 , H05K2203/0776 , H05K2203/0786 , H05K2203/17 , H05K2203/175 , H05K2203/178 , Y10T29/49124 , Y10T137/0318 , Y10T428/239 , H01L2924/00
摘要： The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

16. 发明公开

EP2907367A1 LEITERPLATTE ZUM BESTÜCKEN MIT LEUCHTKÖRPERN MIT VARIABLEM ARBEITSFENSTER 审中-公开
标题翻译：电路板用不同的工作窗口光导体配件
公开(公告)号：EP2907367A1
公开(公告)日：2015-08-19
申请号：EP13774421.5
申请日：2013-10-09
申请人： Zumtobel Lighting GmbH
发明人： MARTIN, Kenneth , GAJDOS, David , BLOCK, Steffen , DANIEL, Christian
IPC分类号： H05K1/02 , H01L25/075 , H05K3/22
CPC分类号： F21V21/00 , F21V23/06 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H05K1/0295 , H05K3/222 , H05K2201/09227 , H05K2201/09254 , H05K2201/09318 , H05K2201/09663 , H05K2201/09954 , H05K2201/10106 , H05K2203/173 , H01L2924/00
摘要： The invention relates to a printed circuit board (10) for populating with illumination bodies, in particular LEDs (25), said board having population regions (20) with connection options for the illumination bodies. A number of the population regions (20) are connected in series by means of conductor tracks (21) to form a group. The printed circuit board is further provided with additional connection options (22) for electrical connection elements, in particular for 0-ohm resistors, via which at least some of the groups can be connected either in parallel or in series.

17. 发明授权

EP2648915B1 COMBINATION STENCIL PRINTER AND DISPENSER AND RELATED METHODS 有权转让
标题翻译：用丝网印刷机与分配器和相关程序组合
公开(公告)号：EP2648915B1
公开(公告)日：2015-02-18
申请号：EP11810922.2
申请日：2011-12-08
申请人： Illinois Tool Works Inc.
发明人： DOYLE, Dennis G.
IPC分类号： B41F15/12 , H05K3/12 , H05K3/22
CPC分类号： H05K7/02 , B41F15/12 , B41M1/12 , B41P2235/24 , H05K3/1216

18. 发明公开

EP2690937A1 METHOD FOR FORMING COPPER WIRING, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE 审中-公开
标题翻译：一种用于形成铜布线，方法进行生产配线基板和布线基板
公开(公告)号：EP2690937A1
公开(公告)日：2014-01-29
申请号：EP12760452.8
申请日：2012-03-14
申请人： FUJIFILM Corporation
发明人： MATAKI, Hiroshi
IPC分类号： H05K3/10 , H01B5/14 , H01B13/00 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/532 , H05K3/12 , H05K3/22
CPC分类号： H05K1/092 , H01L21/4867 , H01L23/5328 , H01L2924/0002 , H05K1/097 , H05K3/125 , H05K3/1283 , H05K2203/0278 , H05K2203/1157 , H01L2924/00
摘要： Provided are a method of forming copper wiring, a method of manufacturing a wiring board, and a wiring board, which are capable of improving conductivity and suppressing deterioration over a period of time of copper wiring. The method of forming copper wiring includes: a wiring pattern formation step of depositing a suspension (12) onto a substrate (10) to form a wiring pattern of the suspension (12) on the substrate (10), the suspension (12) including dispersed copper particles (14) having an average particle diameter that is not smaller than 100 nm; after the wiring pattern formation step, a drying step of drying the copper particles (14) at a temperature lower than 150°C; after the drying step, a pressure application step of applying pressure to the copper particles (14) in the wiring pattern; after the pressure application step, a heat application step of applying heat to the copper particles (14) in the wiring pattern; and after the heat application step, a reducing treatment step of subjecting the copper particles (14) to a reducing treatment.
摘要翻译：提供的是形成铜布线，制造布线板的方法的方法，以及布线基板，其能够改善导电性和抑制劣化一段铜布线的时间的。形成铜布线的方法，包括：到一个衬底上沉积的悬浮液（12）的配线图案形成步骤（10），以形成悬浮液（12）的在基板上的布线图案（10），悬架（12），其包括分散铜粒子（14），其具有平均粒径比没有100nm的不小; 配线图案形成步骤中，在温度低于150℃的铜粒子（14）干燥的干燥步骤之后; 在干燥步骤之后，将压力施加到在布线图案中的铜粒子（14）的压力施加步骤; 加压工序后，将热施加到在布线图案中的铜粒子（14）的加热步骤; 和加热步骤之后，将铜粒子（14）经受还原处理的还原处理工序。

19. 发明授权

EP2497344B1 VERFAHREN UND VORRICHTUNG ZUM BEDRUCKEN EINES SUBSTRATS, INSBESONDERE EINER LEITERPLATTE, MIT EINER DRUCKPASTE 失效
标题翻译：方法和设备进行印刷基材，尤其是电路板，印染浆
公开(公告)号：EP2497344B1
公开(公告)日：2013-12-11
申请号：EP10768873.1
申请日：2010-10-12
申请人： Ekra Automatisierungssysteme GmbH
发明人： VEGELAHN, Torsten
IPC分类号： H05K3/12 , H05K3/22 , G01B11/06 , G01B11/25 , H05K1/02 , H05K3/34
CPC分类号： H05K3/1216 , G01B11/0616 , G01B11/25 , H05K1/0269 , H05K3/225 , H05K3/3484 , H05K2203/163

20. 发明公开

EP2563105A1 PRINTED SUBSTRATE MANUFACTURING METHOD AND PRINTED SUBSTRATE EMPLOYING SAME 有权
标题翻译：用于生产安装基板和安装MADE基板这个过程
公开(公告)号：EP2563105A1
公开(公告)日：2013-02-27
申请号：EP11771803.1
申请日：2011-03-02
申请人： Meiko Electronics Co., Ltd.
发明人： SAITO, Yoichi , MICHIWAKI, Shigeru , TANEKO, Noriaki , TAKII, Shukichi
IPC分类号： H05K3/26 , H05K3/18 , H05K3/20 , H05K3/22
CPC分类号： H05K3/205 , H05K3/26 , H05K2201/0376 , H05K2201/098 , H05K2203/0152 , H05K2203/025 , H05K2203/1572
摘要： A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating (6) having a stem (7) as a portion of plating up to a level equal to the height of the mask layer, and a cap (8) as a portion of plating exceeding the height of the mask layer and having an outgrowth (8a) lying over the surface of the mask layer; laminating an insulating base (10) on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating (6) to form a circuit board intermediate in which the pattern plating (6) is buried in the insulating base (10); removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem (7) of the pattern plating is removed, to increase the line width of the conductive pattern on the exposed surface.
摘要翻译：制造印刷电路板的方法包括：形成在支撑板上的金属层; 形成在金属层上形成掩模层; 形成图案电镀（6）具有杆（7）作为电镀到等于掩模层的高度的电平的部分，和一个盖（8）镀敷的一部分超过该掩模层的高度和具有到生长（8A）位于所述掩模层的表面上; 由所述支撑板，所述金属层和所述图案电镀构成的导电电路板绝缘基底（10）的层合（6）以形成一电路板中间，其中所述图案镀层（6）埋设在绝缘基底（10 ）; 去除所述支撑板和所述金属层以形成暴露的表面上; 机械和抛光的暴露表面直到所述杆（7）的图案电镀被移除，以增加暴露的表面上的导电图案的线宽。

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