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1. 发明授权

EP2533617B1 PRINTED CIRCUIT BOARD WITH CHIP PACKAGE COMPONENT 有权转让
标题翻译：印刷电路板与芯片包装组件
公开(公告)号：EP2533617B1
公开(公告)日：2017-12-13
申请号：EP11736603.9
申请日：2011-01-10
申请人： Huawei Device Co., Ltd.
发明人： JIANG, Zhiwei , CHEN, Xiaochen , GUO, Zhipeng
IPC分类号： H05K1/11 , H05K1/14 , H05K3/22
CPC分类号： H05K1/111 , H05K1/112 , H05K1/141 , H05K3/225 , H05K2201/09072 , H05K2201/09381 , H05K2201/0939 , H05K2201/09663 , H05K2203/042 , Y02P70/611
摘要： Embodiments of the present invention disclose a PCBA chip package component and a soldering component, which can facilitate repairing of a PCBA chip package module. The PCBA chip package component in the embodiments of the present invention includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad. The embodiments of the present invention further provides a soldering component. The embodiments of the present invention may facilitate the repairing of the PCBA chip package component.

2. 发明公开

EP2790390A1 DATA TRANSMISSION METHOD AND DEVICE 审中-公开
标题翻译：数据传输方法和设备
公开(公告)号：EP2790390A1
公开(公告)日：2014-10-15
申请号：EP13758125.2
申请日：2013-03-06
申请人： Huawei Device Co., Ltd.
发明人： CHEN, Xiaochen
IPC分类号： H04M1/725
CPC分类号： H04W4/008 , G06F1/1626 , G06F1/1694 , G06F3/017 , G06F3/0486 , G06F3/0488 , G06F3/04883 , G06F2200/1637 , H04M1/7253 , H04M2250/02 , H04M2250/04 , H04M2250/06 , H04M2250/12 , H04M2250/22 , H04M2250/64 , H04W4/80
摘要： The embodiments of the present invention disclose a data transmission method, including: receiving, by a data transmission device, a user gesture; and, when the user gesture is the same as a preset data transmission action, transmitting, by the data transmission device, data to be transmitted to a receiving device. The embodiments of the present invention also disclose a data transmission device. By using the method and the device in the embodiments of the present invention, data transmission can be implemented conveniently and quickly, which is convenient for users to use and improves user experience.
摘要翻译：本发明实施例公开了一种数据传输方法，包括：数据传输设备接收用户手势; 并且当用户手势与预设的数据传输动作相同时，由数据传输设备传输要传输到接收设备的数据。本发明的实施例还公开了一种数据传输设备。采用本发明实施例的方法和设备，可以方便快捷的实现数据传输，方便用户使用，提高用户体验。

3. 发明公开

EP3076718A1 WIRELESS ACCESS METHOD AND RELEVANT DEVICE AND SYSTEM 有权转让
标题翻译： DRAHTLOSZUGANGSVERFAHREN SOWIE VORRICHTUNG系统
公开(公告)号：EP3076718A1
公开(公告)日：2016-10-05
申请号：EP13899468.6
申请日：2013-12-20
申请人： Huawei Device Co., Ltd.
发明人： XU, Jianhua , SUN, Rui , CHEN, Xiaochen
IPC分类号： H04W48/20 , H04W12/06 , H04B5/00
CPC分类号： H04W48/20 , H04B5/00 , H04B17/318 , H04W4/80 , H04W12/003 , H04W12/06 , H04W48/14 , H04W84/12
摘要： The present invention provides a wireless access method and a related device and system, where the method includes: reading, by a terminal device, access point information stored in an external near field communication tag; and acquiring, by the terminal device, one piece of target access point information according to the read access point information, and establishing, according to the target access point information, a wireless connection to an access point to which the target access point information belongs. Implementing the present invention can avoid operations of manually enabling access point search and manually entering a password by a user, so that efficiency in accessing an access point can be effectively improved.
摘要翻译：本发明提供了一种无线接入方法及相关设备和系统，其中该方法包括：由终端设备读取存储在外部近场通信标签中的接入点信息; 以及根据所述读访问点信息，由所述终端装置获取一条目标接入点信息，根据所述目标接入点信息，建立与所述目标接入点信息所属的接入点的无线连接。实现本发明可以避免手动启用接入点搜索和用户手动输入密码的操作，从而可以有效地提高访问接入点的效率。

4. 发明授权

EP3076718B1 WIRELESS ACCESS METHOD AND RELEVANT DEVICE AND SYSTEM 有权转让
公开(公告)号：EP3076718B1
公开(公告)日：2019-09-04
申请号：EP13899468.6
申请日：2013-12-20
申请人： Huawei Device Co., Ltd.
发明人： XU, Jianhua , SUN, Rui , CHEN, Xiaochen
IPC分类号： H04W48/20 , H04W12/06 , H04B5/00

5. 发明公开

EP2533617A1 PRINTED CIRCUIT BOARD ASSEMBLY CHIP PACKAGE COMPONENT AND WELDING COMPONENT 有权转让
标题翻译： LEITERPLATTE MITCHIPGEHÄUSE
公开(公告)号：EP2533617A1
公开(公告)日：2012-12-12
申请号：EP11736603.9
申请日：2011-01-10
申请人： Huawei Device Co., Ltd.
发明人： JIANG, Zhiwei , CHEN, Xiaochen , GUO, Zhipeng
IPC分类号： H05K1/11
CPC分类号： H05K1/111 , H05K1/112 , H05K1/141 , H05K3/225 , H05K2201/09072 , H05K2201/09381 , H05K2201/0939 , H05K2201/09663 , H05K2203/042 , Y02P70/611
摘要： Embodiments of the present invention disclose a PCBA chip package component and a soldering component, which can facilitate repairing of a PCBA chip package module. The PCBA chip package component in the embodiments of the present invention includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad. The embodiments of the present invention further provides a soldering component. The embodiments of the present invention may facilitate the repairing of the PCBA chip package component.
摘要翻译：本发明的实施例公开了PCBA芯片封装部件和焊接部件，其可以有助于修复PCBA芯片封装模块。本发明实施例中的PCBA芯片封装部件包括：模块板和接口板。第一焊盘设置在模块板的底部，第二焊垫设置在接口板的顶部上，第二焊垫是城堡型结构。第一焊盘包括第一焊接区域，第二焊接区域和连接第一焊接区域和第二焊接区域的连接桥。第一焊接区域对应于第二焊盘的顶表面，并且当第一焊接区域被焊接到第二焊盘时，第二焊接区域位于第二焊盘的外部。本发明的实施例还提供一种焊接部件。本发明的实施例可以有助于修复PCBA芯片封装部件。

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