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    • 3. 发明公开
    • PRINTED SUBSTRATE MANUFACTURING METHOD AND PRINTED SUBSTRATE EMPLOYING SAME
    • 用于生产安装基板和安装MADE基板这个过程
    • EP2563105A1
    • 2013-02-27
    • EP11771803.1
    • 2011-03-02
    • Meiko Electronics Co., Ltd.
    • SAITO, YoichiMICHIWAKI, ShigeruTANEKO, NoriakiTAKII, Shukichi
    • H05K3/26H05K3/18H05K3/20H05K3/22
    • H05K3/205H05K3/26H05K2201/0376H05K2201/098H05K2203/0152H05K2203/025H05K2203/1572
    • A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating (6) having a stem (7) as a portion of plating up to a level equal to the height of the mask layer, and a cap (8) as a portion of plating exceeding the height of the mask layer and having an outgrowth (8a) lying over the surface of the mask layer; laminating an insulating base (10) on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating (6) to form a circuit board intermediate in which the pattern plating (6) is buried in the insulating base (10); removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem (7) of the pattern plating is removed, to increase the line width of the conductive pattern on the exposed surface.
    • 制造印刷电路板的方法包括:形成在支撑板上的金属层; 形成在金属层上形成掩模层; 形成图案电镀(6)具有杆(7)作为电镀到等于掩模层的高度的电平的部分,和一个盖(8)镀敷的一部分超过该掩模层的高度和 具有到生长(8A)位于所述掩模层的表面上; 由所述支撑板,所述金属层和所述图案电镀构成的导电电路板绝缘基底(10)的层合(6)以形成一电路板中间,其中所述图案镀层(6)埋设在绝缘基底(10 ); 去除所述支撑板和所述金属层以形成暴露的表面上; 机械和抛光的暴露表面直到所述杆(7)的图案电镀被移除,以增加暴露的表面上的导电图案的线宽。