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1. 发明授权

EP2563105B1 PRINTED SUBSTRATE MANUFACTURING METHOD AND PRINTED SUBSTRATE EMPLOYING SAME 有权
标题翻译：用于生产安装基板和安装MADE基板这个过程
公开(公告)号：EP2563105B1
公开(公告)日：2016-07-20
申请号：EP11771803.1
申请日：2011-03-02
申请人： Meiko Electronics Co., Ltd.
发明人： SAITO, Yoichi , MICHIWAKI, Shigeru , TANEKO, Noriaki , TAKII, Shukichi
IPC分类号： H05K3/20 , H05K3/26
CPC分类号： H05K3/205 , H05K3/26 , H05K2201/0376 , H05K2201/098 , H05K2203/0152 , H05K2203/025 , H05K2203/1572

2. 发明公开

EP2763517A1 SUBSTRATE MANUFACTURING METHOD 审中-公开
标题翻译： SUBSTRATHERSTELLUNGSVERFAHREN
公开(公告)号：EP2763517A1
公开(公告)日：2014-08-06
申请号：EP11872968.0
申请日：2011-09-30
申请人： Meiko Electronics Co., Ltd.
发明人： TAKII, Shukichi , TANEKO, Noriaki , MICHIWAKI, Shigeru , KUROSU, Mitsuho , NAYA, Yuichiro
IPC分类号： H05K3/46 , H05K1/11
CPC分类号： H05K3/125 , H01L21/76802 , H01L2221/101 , H05K3/1258 , H05K3/3452 , H05K3/4673 , H05K2203/013 , H05K2203/10 , H05K2203/107
摘要： A substrate manufacturing method includes an inner layer circuit forming step for partially removing metal films from an insulating base material (2), on both surfaces of which the metal films are stuck, and forming an inner layer circuit (3); and an insulating layer forming step for applying first insulating resin (4) to each of both the surfaces of the insulating base material (2) with an inkjet system and forming an insulating layer (5). In the insulating layer forming step, a via hole (6) from which the inner layer circuit (3) is partially exposed is formed simultaneously with the application of the first insulating resin (4). Consequently, a step of separately forming a via hole with a laser or the like is unnecessary, expenses are relatively low, and it is possible to simplify a manufacturing process.
摘要翻译：衬底制造方法包括：内层电路形成步骤，用于从绝缘基材（2）部分去除金属膜，在其两面上粘附金属膜，形成内层电路（3）; 以及绝缘层形成步骤，用喷墨系统将第一绝缘树脂（4）施加到绝缘基材（2）的两个表面中的每一个表面上并形成绝缘层（5）。在绝缘层形成步骤中，与第一绝缘树脂（4）的施加同时形成内层电路（3）部分露出的通孔（6）。因此，不需要用激光等单独形成通孔的步骤，费用相对较低，并且可以简化制造过程。

3. 发明公开

EP2563105A1 PRINTED SUBSTRATE MANUFACTURING METHOD AND PRINTED SUBSTRATE EMPLOYING SAME 有权
标题翻译：用于生产安装基板和安装MADE基板这个过程
公开(公告)号：EP2563105A1
公开(公告)日：2013-02-27
申请号：EP11771803.1
申请日：2011-03-02
申请人： Meiko Electronics Co., Ltd.
发明人： SAITO, Yoichi , MICHIWAKI, Shigeru , TANEKO, Noriaki , TAKII, Shukichi
IPC分类号： H05K3/26 , H05K3/18 , H05K3/20 , H05K3/22
CPC分类号： H05K3/205 , H05K3/26 , H05K2201/0376 , H05K2201/098 , H05K2203/0152 , H05K2203/025 , H05K2203/1572
摘要： A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating (6) having a stem (7) as a portion of plating up to a level equal to the height of the mask layer, and a cap (8) as a portion of plating exceeding the height of the mask layer and having an outgrowth (8a) lying over the surface of the mask layer; laminating an insulating base (10) on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating (6) to form a circuit board intermediate in which the pattern plating (6) is buried in the insulating base (10); removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem (7) of the pattern plating is removed, to increase the line width of the conductive pattern on the exposed surface.
摘要翻译：制造印刷电路板的方法包括：形成在支撑板上的金属层; 形成在金属层上形成掩模层; 形成图案电镀（6）具有杆（7）作为电镀到等于掩模层的高度的电平的部分，和一个盖（8）镀敷的一部分超过该掩模层的高度和具有到生长（8A）位于所述掩模层的表面上; 由所述支撑板，所述金属层和所述图案电镀构成的导电电路板绝缘基底（10）的层合（6）以形成一电路板中间，其中所述图案镀层（6）埋设在绝缘基底（10 ）; 去除所述支撑板和所述金属层以形成暴露的表面上; 机械和抛光的暴露表面直到所述杆（7）的图案电镀被移除，以增加暴露的表面上的导电图案的线宽。

4. 发明公开

EP3505522A1 SURFACE TREATMENT METHOD, SURFACE TREATMENT AGENT, AND NOVEL COMPOUND 有权转让
公开(公告)号：EP3505522A1
公开(公告)日：2019-07-03
申请号：EP19152089.9
申请日：2012-08-31
申请人： Mori, Kunio , Sulfur Chemical Laboratory Inc. , Meiko Electronics Co., Ltd.
发明人： MORI, Kunio , MORI, Katsuhito , KUDO, Takahiro , TAKII, Shuukichi , MICHIWAKI, Shigeru , MIYAWAKI, Manabu , YANAI, Masanori , KAMIYAMA, Kouichi , CHIBA, Hitomi , MASUDA, Yasuyuki , MATSUNO, Yusuke
IPC分类号： C07F7/18
摘要： Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: said compound (α) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

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