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1. 发明公开

EP2690938A1 METHOD FOR FORMING COPPER WIRING, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE 审中-公开
标题翻译：一种用于形成铜布线，方法进行生产配线基板和布线基板
公开(公告)号：EP2690938A1
公开(公告)日：2014-01-29
申请号：EP12761154.9
申请日：2012-03-14
申请人： FUJIFILM Corporation
发明人： MATAKI, Hiroshi
IPC分类号： H05K3/10 , H01B5/14 , H01B13/00 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/532 , H05K3/12 , H05K3/24
CPC分类号： H05K3/227 , H01L21/4867 , H01L23/5328 , H01L2924/0002 , H05K1/09 , H05K1/097 , H05K3/125 , H05K3/1283 , H05K3/245 , H05K2201/0266 , H05K2203/0278 , H05K2203/1476 , H01L2924/00
摘要： Provided are a method of forming copper wiring, a method of manufacturing a wiring board, and a wiring board, which are capable of improving conductivity and suppressing deterioration over a period of time of copper wiring. The method of forming copper wiring includes: a wiring pattern formation step of depositing a first suspension (12) onto a substrate (10) to form a wiring pattern of the first suspension (12) on the substrate (10), the first suspension (12) including dispersed first copper particles (14) having an average particle diameter that is not smaller than 100 nm; a drying step of drying the first copper particles (14) at a temperature lower than 150°C; a second suspension deposition step of depositing a second suspension (16) onto the wiring pattern, the second suspension (16) including dispersed second copper particles (18) having an average particle diameter that is smaller than the average particle diameter of the first copper particles (14); a compaction step of reducing voids between the first and second copper particles (14, 18); a heat application step of applying heat to the first and second copper particles (14, 18); and a reducing treatment step of subjecting the first and second copper particles (14, 18) to a reducing treatment.
摘要翻译：提供的是形成铜布线，制造布线板的方法的方法，以及布线基板，其能够改善导电性和抑制劣化一段铜布线的时间的。形成铜布线的方法，包括：到一个衬底上沉积的第一悬浮液（12）的配线图案形成步骤（10），以形成在基板上的第一悬架（12）（10），所述第一悬浮液的配线图案（ 12）包括第一分散铜粒子（14），其具有平均粒径比没有100nm的不小; 在温度低于150℃的第1铜粒子（14）干燥的干燥工序; 到布线图案上沉积第二悬浮液（16）的第二悬浮液沉积步骤中，将第二悬浮液（16），其包括分散在平均粒径具有没有比第一铜粒子的平均粒径较小的第二铜粒子（18）（14）; 所述第一和第二铜粒子（14，18）之间减少空隙的压实步骤; 将热量施加到所述第一和第二铜粒子（14，18）的加热步骤; 和所述第一和第二铜粒子（14，18）经受还原处理的还原处理工序。

2. 发明授权

EP3275674B1 PRINTING APPARATUS AND PRINTING METHOD 有权
公开(公告)号：EP3275674B1
公开(公告)日：2018-10-17
申请号：EP17182227.3
申请日：2017-07-19
申请人： Fujifilm Corporation
发明人： MATAKI, Hiroshi
IPC分类号： B41J11/00 , B41M7/02 , B41F23/08
CPC分类号： B41J11/0015 , B41F23/08 , B41J11/002 , B41M7/0036 , B41M7/009
摘要： A printing apparatus and a printing method that can reduce a difference in glossiness in an in-plane direction of a printed matter to which aqueous varnish has been applied. The apparatus and method satisfy a relationship of "Tp-(40/6)×tw‰¤a" when the temperature of a recording surface at the time of application of aqueous varnish containing water is denoted by Tp, coating formation time of the aqueous varnish is denoted by tw, and a constant determined according to an allowable value of a gloss difference, which is a difference between glossiness of the recording surface of a printed matter of which applied aqueous varnish has been dried in a first direction and glossiness of the recording surface in a direction orthogonal to the first direction, is denoted by a. Here, the unit of the temperature Tp is °C and the unit of the coating formation time tw is minute.

3. 发明公开

EP2690937A1 METHOD FOR FORMING COPPER WIRING, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE 审中-公开
标题翻译：一种用于形成铜布线，方法进行生产配线基板和布线基板
公开(公告)号：EP2690937A1
公开(公告)日：2014-01-29
申请号：EP12760452.8
申请日：2012-03-14
申请人： FUJIFILM Corporation
发明人： MATAKI, Hiroshi
IPC分类号： H05K3/10 , H01B5/14 , H01B13/00 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/532 , H05K3/12 , H05K3/22
CPC分类号： H05K1/092 , H01L21/4867 , H01L23/5328 , H01L2924/0002 , H05K1/097 , H05K3/125 , H05K3/1283 , H05K2203/0278 , H05K2203/1157 , H01L2924/00
摘要： Provided are a method of forming copper wiring, a method of manufacturing a wiring board, and a wiring board, which are capable of improving conductivity and suppressing deterioration over a period of time of copper wiring. The method of forming copper wiring includes: a wiring pattern formation step of depositing a suspension (12) onto a substrate (10) to form a wiring pattern of the suspension (12) on the substrate (10), the suspension (12) including dispersed copper particles (14) having an average particle diameter that is not smaller than 100 nm; after the wiring pattern formation step, a drying step of drying the copper particles (14) at a temperature lower than 150°C; after the drying step, a pressure application step of applying pressure to the copper particles (14) in the wiring pattern; after the pressure application step, a heat application step of applying heat to the copper particles (14) in the wiring pattern; and after the heat application step, a reducing treatment step of subjecting the copper particles (14) to a reducing treatment.
摘要翻译：提供的是形成铜布线，制造布线板的方法的方法，以及布线基板，其能够改善导电性和抑制劣化一段铜布线的时间的。形成铜布线的方法，包括：到一个衬底上沉积的悬浮液（12）的配线图案形成步骤（10），以形成悬浮液（12）的在基板上的布线图案（10），悬架（12），其包括分散铜粒子（14），其具有平均粒径比没有100nm的不小; 配线图案形成步骤中，在温度低于150℃的铜粒子（14）干燥的干燥步骤之后; 在干燥步骤之后，将压力施加到在布线图案中的铜粒子（14）的压力施加步骤; 加压工序后，将热施加到在布线图案中的铜粒子（14）的加热步骤; 和加热步骤之后，将铜粒子（14）经受还原处理的还原处理工序。

4. 发明公开

EP3275674A1 PRINTING APPARATUS AND PRINTING METHOD 有权
标题翻译：印刷设备和印刷方法
公开(公告)号：EP3275674A1
公开(公告)日：2018-01-31
申请号：EP17182227.3
申请日：2017-07-19
申请人： Fujifilm Corporation
发明人： MATAKI, Hiroshi
IPC分类号： B41J11/00 , B41M7/02 , B41F23/08
CPC分类号： B41J11/0015 , B41F23/08 , B41J11/002 , B41M7/0036 , B41M7/009
摘要： A printing apparatus and a printing method that can reduce a difference in glossiness in an in-plane direction of a printed matter to which aqueous varnish has been applied. The apparatus and method satisfy a relationship of "Tp-(40/6)×tw≤a" when the temperature of a recording surface at the time of application of aqueous varnish containing water is denoted by Tp, coating formation time of the aqueous varnish is denoted by tw, and a constant determined according to an allowable value of a gloss difference, which is a difference between glossiness of the recording surface of a printed matter of which applied aqueous varnish has been dried in a first direction and glossiness of the recording surface in a direction orthogonal to the first direction, is denoted by a. Here, the unit of the temperature Tp is °C and the unit of the coating formation time tw is minute.
摘要翻译：本发明提供一种印刷装置和印刷方法，该印刷装置和印刷方法能够减少涂布有水性清漆的印刷物的面内方向的光泽差。当将涂布含水清漆时的记录表面的温度用Tp表示时，装置和方法满足关系“Tp-（40/6）×tw≤a”，水性清漆的涂布形成时间用tw表示，并且根据光泽差的允许值确定常数，所述光泽差是作用的水性清漆在第一方向上已经干燥的印刷品的记录表面的光泽度与记录的光泽度之间的差异在与第一方向正交的方向上的表面由a表示。这里，温度Tp的单位是℃，并且涂层形成时间tw的单位是分钟。

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