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    • 11. 发明公开
    • IN SERVICE PROGRAMMABLE LOGIC ARRAYS WITH ULTRA THIN VERTICAL BODY TRANSISTORS
    • WITH ULTRA THIN竖直主体TRANSISTORS运算可编程逻辑阵列
    • EP1366570A1
    • 2003-12-03
    • EP02724909.3
    • 2002-02-06
    • MICRON TECHNOLOGY, INC.
    • FORBES, Leonard
    • H03K19/177H01L25/00G06F7/38
    • H01L27/11803H01L27/115H01L27/11556H01L27/1203H01L29/66825H01L29/7881H01L2924/0002H01L2924/00
    • Structures and methods for in service programmable logic arrays with ultra thin vertical body transistors are provided. The in-service programmable logic array includes a first logic plane that receives a number of input signals. The first logic plane has a plurality of logic cells arranged in rows and columns that are interconnected to provide a number of logical outputs. A second logic plane has a number of logic cells arranged in rows and columns that receive the outputs of the first logic plane and that are interconnected to produce a number of logical outputs such that the in service programmable logic array implements a logical function. Each of the logic cells includes a vertical pillar extending outwardly from a semiconductor substrate. Each pillar includes a single crystalline first contact layer and a second contact layer separated by an oxide layer. At least one single crystalline ultra thin vertical floating gate transistor that is disposed adjacent each vertical pillar. The single crystalline vertical floating gate transistor includes an ultra thin single crystalline vertical first source/drain region coupled to the first contact layer, an ultra thin single crystalline vertical second source/drain region coupled to the second contact layer, and an ultra thin single crystalline vertical body region which opposes the oxide layer and couples the first and the second source/drain regions. A vertical floating gate opposes the ultra thin single crystalline vertical body region.
    • 18. 发明公开
    • TRANSISTOR AND ITS METHOD OF MANUFACTURE
    • VERFAHREN ZU DESSEN HERSTELLUNG的TRANSISTOR
    • EP2724373A2
    • 2014-04-30
    • EP12730616.5
    • 2012-06-22
    • Pragmatic Printing Ltd
    • PRICE, RichardWHITE, Scott
    • H01L29/66H01L27/12
    • H01L27/088G03F7/0002H01L21/0272H01L21/28008H01L21/283H01L21/31144H01L21/76895H01L21/823437H01L21/823475H01L23/528H01L27/11803H01L27/1214H01L27/1225H01L27/1288H01L27/1292H01L29/66757H01L29/66969H01L29/78666H01L29/78675H01L29/7869H01L51/0541
    • A method of manufacturing a transistor comprising: providing a substrate, a region of semiconductive material supported by the substrate, and a region of electrically conductive material supported by the region of semiconductive material; forming at least one layer of resist material over said regions to form a covering of resist material over said regions; forming a depression in a surface of the covering of resist material, said depression extending over a first portion of said region of conductive material, said first portion separating a second portion of the conductive region from a third portion of the conductive region; removing resist material located under said depression so as to form a window, through said covering, exposing said first portion of the electrically conductive region; removing said first portion to expose a connecting portion of the region of semiconductive material, said connecting portion connecting the second portion to the third portion of the conductive region; forming a layer of dielectric material over the exposed portion of the region of semiconductive material; and depositing electrically conductive material to form a layer of electrically conductive material over said layer of dielectric material, the layer of dielectric material electrically isolating the layer of electrically conductive material from the second and third portions of the conductive region.
    • 一种制造晶体管的方法,包括:提供衬底,由衬底支撑的半导体材料的区域和由半导体材料区域支撑的导电材料区域; 在所述区域上形成至少一层抗蚀剂材料,以在所述区域上形成抗蚀剂材料的覆盖层; 在抗蚀剂材料的覆盖物的表面上形成凹陷,所述凹陷在导电材料区域的第一部分上延伸,所述第一部分将导电区域的第二部分与导电区域的第三部分分开; 去除位于所述凹陷下方的抗蚀剂材料,以形成通过所述覆盖物的窗口,暴露所述导电区域的所述第一部分; 去除所述第一部分以暴露所述半导体材料区域的连接部分,所述连接部分将所述第二部分连接到所述导电区域的第三部分; 在半导体材料的区域的暴露部分上形成介电材料层; 以及沉积导电材料以在所述介电材料层上形成导电材料层,所述介电材料层将所述导电材料层与所述导电区域的第二和第三部分电隔离。