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    • 11. 发明公开
    • PLASMA PROCESSING APPARATUS AND METHOD OF PLASMA PROCESSING
    • PLASMABEHANDLUNGSAPPARATUR UND PLASMABEHANDLUNGSVERFAHREN
    • EP1213749A1
    • 2002-06-12
    • EP00951961.2
    • 2000-08-11
    • TOKYO ELECTRON LIMITED
    • TOMOYASU, Masayuki Tokyo Electron AT Limited
    • H01L21/3065H01J37/32
    • H01J37/3244H01J37/32082H01J37/32568H01J37/32577
    • There is provided a plasma processing system and method capable of decreasing the non-uniformity of a field distribution on the surface of an electrode and making the density of plasma uniform, in a plasma processing using a high density plasma which can cope with a further scale down.
      First and second electrodes 21 and 5 are provided in a chamber so as to face each other. A feeder plate 52 is arranged so as to be slightly spaced from the opposite surface of a surface serving as a feeding plane of the first electrode facing the second electrode 5. A feeder rod 51 is connected to the feeder plate 52 at a position which is radially shifted from a position corresponding to the center of the feeding plane of the first electrode 21. The feeder plate 52 is rotated to rotate the feeding position of the feeder rod 51 on the feeding plane of the first electrode. A high frequency electric power is thus fed to form a high frequency electric field between the first and second electrodes 21 and 5 to form plasma to plasma-process a substrate W.
    • 提供了一种等离子体处理系统和方法,其能够在使用能够应对更大比例的高密度等离子体的等离子体处理中降低电极表面上的场分布的不均匀性并使等离子体的密度均匀化 下。 第一和第二电极21和5设置在腔室中以彼此面对。 馈电板52被布置成与用作面向第二电极5的第一电极的馈电面的表面的相对表面稍微间隔开。馈送杆51在馈电板52的位置处 从与第一电极21的馈送平面的中心相对应的位置径向移动。馈送板52旋转以使馈送杆51的馈送位置在第一电极的馈送平面上旋转。 因此,馈送高频电力以在第一和第二电极21和5之间形成高频电场,以形成等离子体以等离子体处理衬底W.
    • 12. 发明公开
    • PLASMA PROCESSING SYSTEM, APPARATUS, AND METHOD FOR DELIVERING RF POWER TO A PLASMA PROCESSING CHAMBER
    • 用于等离子处理腔室的RF电源的等离子体处理装置和方法
    • EP1190437A1
    • 2002-03-27
    • EP00948512.9
    • 2000-06-15
    • LAM Research Corporation
    • FISCHER, AndreasKADKHODAYAN, BabakKUTHI, Andras
    • H01J37/32
    • H01J37/32174H01J37/32082H01J37/32577
    • The present invention provides a plasma processing apparatus, system, and method for providing RF power to a plasma processing chamber. The plasma processing system (300) includes an RF generator (310), a plasma chamber (304), a match network box (308), a first cable (314), a second cable (316), and means for electrically isolating (312) the match network box. The RF generator generates RF power for transmission to the plasma chamber. The plasma chamber receives the RF power for processing the wafer (302) and is characterized by an internal impedance during the plasma processing. The plasma chamber has one or more walls (344) for returning RF currents. The match network box is capable of receiving the RF currents and generates an impedance that matches the internal impedance of the plasma chamber to the impedance of the RF generator. The first cable is coupled between the RF generator and the match network box for transmitting RF power between the RF generator and the match network box. The second cable is coupled between the match network box and the plasma chamber for transmitting RF power between the match network and the plasma chamber. The second cable provides a return path for an RF return current from the plasma chamber to the match network box. The electrically isolating means electrically isolates the match network box from electrical contacts with the plasma chamber such that only the second cable provides the return path for the RF return current from the plasma chamber to the match network box.
    • 14. 发明公开
    • Dispositif d'amenée de tension sur un porte-substrat
    • Anordnung zurZuführungeiner Spannung auf einen Substrathalter。
    • EP0545748A1
    • 1993-06-09
    • EP92402982.0
    • 1992-11-04
    • COMMISSARIAT A L'ENERGIE ATOMIQUE
    • Claude, RichardDaviet, Jean-FrançoisMontmayeul, PhilippePeccoud, Louise
    • H01R13/24
    • H01R13/2421C23C16/4586H01J37/32577H01J2237/2007H01L21/6831
    • La présente invention concerne un connecteur de tension pour porte-substrat en milieu de rayonnement électromagnétique de haute-fréquence. Ce connecteur comporte :

      une tige de connexion (7) apte à établir, par l'intermédiaire d'une surface de contact supérieure (7b), un contact électrique avec une face inférieure (1b) du porte-substrat (1) et apte à assurer un isolement électromagnétique du porte-substrat ;
      des moyens élastiques électriquement conducteurs (11), disposés sous la tige de connexion et assurant un contact souple de la surface de contact supérieure de la tige de connexion sur la face inférieure du porte-substrat ;
      une embase (9), connectée à une source de tension, à l'intérieur de laquelle sont disposés les moyens élastiques ainsi qu'une partie au moins de la tige de connexion, ladite embase étant apte, d'une part, à établir une liaison électrique entre ladite source de tension et les moyens élastiques et, d'autre part, à assurer un isolement électromagnétique de la source de tension.

      Le dispositif s'applique notamment au domaine industriel de l'électronique.
    • 本发明涉及一种用于高频电磁辐射环境中的衬底保持器的电压连接器。 该连接器包括: - 能够通过上接触表面(7b)与衬底保持器(1)的下表面(1b)形成电接触并能够电磁隔离衬底的连接杆(7) 持有人; - 导电弹性装置(11),其放置在所述连接杆的下面,并且提供所述连接杆的上接触表面在所述衬底保持器的下表面上的柔性接触; - 连接到电压源的基座(9),其内部放置有弹性装置以及连接杆的至少一部分,所述基座能够一方面在所述电压之间建立电连接 源和弹性装置,另一方面,提供电压源的电磁隔离。 该器件特别适用于电子工业。