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11. 发明公开

EP1458015A3 Spin coating apparatus for coating photoresist 审中-公开
标题翻译：用于旋涂的设备用于与光致抗蚀剂涂覆，
公开(公告)号：EP1458015A3
公开(公告)日：2007-07-18
申请号：EP04251412.5
申请日：2004-03-11
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Choa, Sung-hoon , Choi, Min-seog
IPC分类号： H01L21/00
CPC分类号： H01L21/6715
摘要： A spin coating apparatus for coating photoresist has a spin chuck and a nozzle part. The spin chuck has a mount part on which a wafer is mounted and an extended projection part on which edge-bead is formed. The nozzle part is for depositing photoresist onto the wafer mounted on the mount part of the spin chuck. By using the spin coating apparatus, edge-bead is formed on the extended projection part, and not on the wafer.

12. 发明公开

EP1458015A2 Spin coating apparatus for coating photoresist 审中-公开
标题翻译： Vorrichtung zur Schleuderbeschichtung zur Beschichtung mit einem Photolack
公开(公告)号：EP1458015A2
公开(公告)日：2004-09-15
申请号：EP04251412.5
申请日：2004-03-11
申请人： Samsung Electronics Co., Ltd.
发明人： Lee, Eun-sung , Choa, Sung-hoon , Choi, Min-seog
IPC分类号： H01L21/00
CPC分类号： H01L21/6715
摘要： A spin coating apparatus for coating photoresist has a spin chuck and a nozzle part. The spin chuck has a mount part on which a wafer is mounted and an extended projection part on which edge-bead is formed. The nozzle part is for depositing photoresist onto the wafer mounted on the mount part of the spin chuck. By using the spin coating apparatus, edge-bead is formed on the extended projection part, and not on the wafer.
摘要翻译：用于涂覆光致抗蚀剂的旋涂装置具有旋转卡盘和喷嘴部分。旋转卡盘具有安装在其上的晶片的安装部分和形成边缘珠的延伸的突出部分。喷嘴部分用于将光致抗蚀剂沉积到安装在旋转卡盘的安装部分上的晶片上。通过使用旋涂装置，在延伸的突出部分上而不是在晶片上形成边缘珠。

13. 发明公开

EP1270505A2 Anti-stiction method and apparatus for drying wafer using centrifugal force 审中-公开
标题翻译：抗逆转录病毒和Vorrichtung zum Trocknen von Wafern，死Zentrifugalkraft verwendet
公开(公告)号：EP1270505A2
公开(公告)日：2003-01-02
申请号：EP02014541.3
申请日：2002-07-01
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Cho, Jin-woo , Lee, Moon-chul , Lee, Eun-sung
IPC分类号： B81B3/00
CPC分类号： H01L21/67034 , B81C1/00928
摘要： An anti-stiction method and apparatus for drying a wafer using a centrifugal force is provided. The anti-stiction method includes the steps of (a) removing a sacrificial layer stacked between the wafer and the micro structure, using an etching solution, (b) rinsing the etched micro structure and the etched wafer in a rinse solution for a predetermined time so that the etching solution between the micro structure and the wafer is replaced with the rinse solution, and (c) mounting the rinsed wafer in a mounting unit connected to a rotation axis and eliminating the rinse solution left between the wafer and the micro structure by the rotation of the axis. The wafer is mounted in the mounting unit in a vertical position so that the micro structure faces outwards from the rotation axis. Accordingly, a stiction phenomenon between the micro structure manufactured by a MEMS process and the wafer in a drying process can be prevented.
摘要翻译：提供了一种使用离心力干燥晶片的防静电方法和装置。抗静电方法包括以下步骤：（a）使用蚀刻溶液去除叠置在晶片和微结构之间的牺牲层，（b）在冲洗溶液中冲洗蚀刻的微结构和蚀刻的晶片达预定时间使得微结构和晶片之间的蚀刻溶液被冲洗溶液代替，并且（c）将冲洗的晶片安装在连接到旋转轴线的安装单元中，并且通过以下步骤消除晶片和微结构之间留下的冲洗溶液：轴的旋转。晶片以垂直位置安装在安装单元中，使得微结构从旋转轴线向外。因此，可以防止由MEMS工艺制造的微结构与干燥工艺中的晶片之间的静电现象。

14. 发明授权

EP2570075B1 Numerical aperture (na) controlling unit, variable optical probe including the na controlling unit, and depth scanning method using the na controlling unit 有权
标题翻译：数值开口（NA）控制单元，在使用NA-控制单元的NA-控制单元和深度扫描方法可变光学探头
公开(公告)号：EP2570075B1
公开(公告)日：2015-09-09
申请号：EP12184541.6
申请日：2012-09-14
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Seung-wan , Kim, Woon-bae , Lee, Eun-sung , Jung, Kyu-dong , Chang, Jong-hyeon
IPC分类号： A61B5/00 , G02B3/14 , G01B11/22 , G02B5/00 , G02B21/00 , G01B9/02 , G02B26/00 , G02B26/10 , G02B26/02
CPC分类号： A61B5/0066 , A61B5/444 , G01B9/02063 , G01B9/02091 , G01B11/22 , G02B3/14 , G02B5/005 , G02B21/006 , G02B26/005 , G02B26/101

15. 发明公开

EP2570075A3 Numerical aperture (na) controlling unit, variable optical probe including the na controlling unit, and depth scanning method using the na controlling unit 有权
标题翻译：数值开口（NA）控制单元，在使用NA-控制单元的NA-控制单元和深度扫描方法可变光学探头
公开(公告)号：EP2570075A3
公开(公告)日：2014-04-30
申请号：EP12184541.6
申请日：2012-09-14
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Seung-wan , Kim, Woon-bae , Lee, Eun-sung , Jung, Kyu-dong , Chang, Jong-hyeon
IPC分类号： A61B5/00 , G02B3/14 , G01B11/22 , G02B5/00 , G02B21/00 , G01B9/02 , G02B26/00 , G02B26/10 , G02B26/02
CPC分类号： A61B5/0066 , A61B5/444 , G01B9/02063 , G01B9/02091 , G01B11/22 , G02B3/14 , G02B5/005 , G02B21/006 , G02B26/005 , G02B26/101
摘要： A numerical aperture (NA) controlling unit and a variable optical probe including the same are provided. The NA controlling unit includes: an aperture adjustment unit which controls an aperture through which light is transmitted; and a focus control unit that is disposed in a predetermined position with respect to the aperture adjustment unit, that focuses light transmitted through the aperture, and that has an adjustable focal length. The variable optical probe includes: a light transmission unit; a collimator that collimates light transmitted through the light transmission unit into parallel light; an NA controlling unit that focuses light on a sample to be inspected; and a scanner that varies a path of light transmitted through the light transmission unit such that a predetermined region of the sample is scanned by light that passes through the NA controlling unit.

16. 发明公开

EP2570075A2 Numerical aperture (na) controlling unit, variable optical probe including the na controlling unit, and depth scanning method using the na controlling unit 有权
标题翻译：数值开口（NA）控制单元，在使用NA-控制单元的NA-控制单元和深度扫描方法可变光学探头
公开(公告)号：EP2570075A2
公开(公告)日：2013-03-20
申请号：EP12184541.6
申请日：2012-09-14
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Seung-wan , Kim, Woon-bae , Lee, Eun-sung , Jung, Kyu-dong , Chang, Jong-hyeon
IPC分类号： A61B5/00
CPC分类号： A61B5/0066 , A61B5/444 , G01B9/02063 , G01B9/02091 , G01B11/22 , G02B3/14 , G02B5/005 , G02B21/006 , G02B26/005 , G02B26/101
摘要： A numerical aperture (NA) controlling unit and a variable optical probe including the same are provided. The NA controlling unit includes: an aperture adjustment unit which controls an aperture through which light is transmitted; and a focus control unit that is disposed in a predetermined position with respect to the aperture adjustment unit, that focuses light transmitted through the aperture, and that has an adjustable focal length. The variable optical probe includes: a light transmission unit; a collimator that collimates light transmitted through the light transmission unit into parallel light; an NA controlling unit that focuses light on a sample to be inspected; and a scanner that varies a path of light transmitted through the light transmission unit such that a predetermined region of the sample is scanned by light that passes through the NA controlling unit.

17. 发明公开

EP2193911A3 Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 失效转让
标题翻译：用于制造使用微透镜的微透镜和相机模块的微透镜的方法和装置
公开(公告)号：EP2193911A3
公开(公告)日：2012-05-09
申请号：EP09170750.5
申请日：2009-09-18
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： B29D11/00 , B29C33/30
CPC分类号： B29D11/00375 , B29C33/305 , B29D11/0048 , B29L2011/0016
摘要： Method of manufacturing a micro lens apparatus, and manufacturing method therefore and a camera module employing the micro lens are provided. First mold (20) is manufactured in correspondence with a first lens profile of a lens element. Second mold (30) is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate (110) having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole (115) of the lens substrate (110). First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.

18. 发明公开

EP1325884A3 MEMS structure having a blocked-sacrificial layer support/anchor and a fabrication method of the same 有权
标题翻译： MEMS结构，刚性牺牲层支柱/锚包括，和它们的制备方法
公开(公告)号：EP1325884A3
公开(公告)日：2004-10-27
申请号：EP02258592.1
申请日：2002-12-13
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Lee, Eun-sung , Lee, Moon-chul , Kim, Hyun-ok
IPC分类号： B81B3/00
CPC分类号： B81B3/0078 , B81B2203/0307 , B81C2201/0109
摘要： A fabrication method for a MEMS structure, the MEMS structure including a fixing portion fixed to the substrate and a floating portion floating above the substrate. A sacrificial layer deposited on the substrate is patterned to have a groove forming a space surrounding the area corresponding to the area in which the fixing portion is to be formed. If the MEMS structure is deposited on the sacrificial layer, a sidewall is formed inside the space and the fixing portion and the floating portion are formed on the sacrificial layer. If the sacrificial layer is removed using an etchant, the sacrificial layer at the bottom of the fixing portion is protected from the etchant by the sidewall and accordingly, the sacrificial layer except the area surrounded by the sidewall is removed. Therefore, only the sacrificial layer under the floating portion is removed. Because the connecting portion is fabricated to have the same thickness as the fixing portion and the floating portion, a strong/durable MEMS structure is provided. Additionally, the boundary between the fixing portion and the floating portion can be precisely determined, and adjustment of the length of the floating portion can be precisely controlled.

19. 发明公开

EP1270505A3 Anti-stiction method and apparatus for drying wafer using centrifugal force 审中-公开
标题翻译：抗粘附性的方法和用于干燥晶片设备中，所使用的离心力
公开(公告)号：EP1270505A3
公开(公告)日：2004-02-11
申请号：EP02014541.3
申请日：2002-07-01
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Cho, Jin-woo , Lee, Moon-chul , Lee, Eun-sung
IPC分类号： B81B3/00 , B81B7/00 , H01L21/00
CPC分类号： H01L21/67034 , B81C1/00928
摘要： An anti-stiction method and apparatus for drying a wafer using a centrifugal force is provided. The anti-stiction method includes the steps of (a) removing a sacrificial layer stacked between the wafer and the micro structure, using an etching solution, (b) rinsing the etched micro structure and the etched wafer in a rinse solution for a predetermined time so that the etching solution between the micro structure and the wafer is replaced with the rinse solution, and (c) mounting the rinsed wafer in a mounting unit connected to a rotation axis and eliminating the rinse solution left between the wafer and the micro structure by the rotation of the axis. The wafer is mounted in the mounting unit in a vertical position so that the micro structure faces outwards from the rotation axis. Accordingly, a stiction phenomenon between the micro structure manufactured by a MEMS process and the wafer in a drying process can be prevented.

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