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    • 5. 发明申请
    • Apparatus and process for bulk wet etch with leakage protection
    • 用于具有漏电保护的散装湿蚀刻的装置和工艺
    • US20050118822A1
    • 2005-06-02
    • US11032800
    • 2005-01-11
    • Zhe WangQingxin ZhangPang FooHan Feng
    • Zhe WangQingxin ZhangPang FooHan Feng
    • H01L21/00H01L21/306H01L21/302H01L21/461
    • H01L21/67086H01L21/30608H01L21/6708
    • When using hot alkaline etchants such as KOH, the wafer front side, where various devices and/or circuits are located, must be isolated from any contact with the etchant. This has been achieved by using two chambers that are separated from each other by the wafer that is to be etched. Etching solution in one chamber is in contact with the wafer's back surface while deionized water in the other chamber contacts the front surface. The relative liquid pressures in the chambers is arranged to be slightly higher in the chamber of the front surface so that leakage of etchant through a pin hole from back surface to front surface does not occur. As a further precaution, a monitor to detect the etchant is located in the DI water so that, if need be, etching can be terminated before irreparable damage is done.
    • 当使用诸如KOH的热碱性蚀刻剂时,其中各种装置和/或电路所在的晶片正面必须与与蚀刻剂的任何接触隔离。 这是通过使用被待蚀刻的晶片彼此分离的两个室来实现的。 一个室中的蚀刻溶液与晶片的背面接触,而另一个室中的去离子水接触前表面。 腔室中的相对液体压力被布置为在前表面的腔室中略高,使得蚀刻剂不会通过针孔从背表面泄漏到前表面。 作为进一步的预防措施,用于检测蚀刻剂的监测器位于去离子水中,使得如果需要,可以在不可修复的损伤完成之前终止蚀刻。
    • 6. 发明授权
    • Microelectromechanical system (MEMS) device, method of operating the same, and method of forming the same
    • 微机电系统(MEMS)装置,其操作方法及其形成方法
    • US08755106B2
    • 2014-06-17
    • US13377030
    • 2009-06-11
    • Qingxin ZhangYu DuChee Wei Tan
    • Qingxin ZhangYu DuChee Wei Tan
    • G02B26/00H01H71/00H01H61/00H01H51/00
    • B81B3/0054B81B2201/033B81B2201/047G02B6/4204G02B6/4226G02B6/4236G02B26/0833G02B26/0866
    • A microelectromechanical system (MEMS) device, method of operating the MEMS device, and a method of forming the MEMS device are provided. The MEMS device includes a positioning mechanism and a locking mechanism. The positioning mechanism includes a first arm structure having a first surface and a second surface; a second arm structure having a first surface and a second surface; wherein the first surface of the first arm structure faces the first surface of the second arm structure. The positioning mechanism also includes a first actuator disposed adjacent to the second surface of the first arm structure facing away from the second arm structure; and a second actuator disposed adjacent to the second surface of the second arm structure facing away from the first arm structure. The locking mechanism includes a first pair of locking elements arranged such that each locking element is disposed at two opposite side surfaces of the first arm structure between the first and second surfaces of the first arm structure; and a second pair of locking elements arranged such that each locking element is disposed at two opposite side surfaces of the second arm structure between the first and second surfaces of the second arm structure. The first and second pairs of locking elements are configured to engage with and disengage from the first and second arm structures respectively.
    • 提供了微机电系统(MEMS)装置,操作MEMS装置的方法以及形成MEMS器件的方法。 MEMS装置包括定位机构和锁定机构。 定位机构包括具有第一表面和第二表面的第一臂结构; 具有第一表面和第二表面的第二臂结构; 其中第一臂结构的第一表面面向第二臂结构的第一表面。 所述定位机构还包括第一致动器,所述第一致动器邻近所述第一臂结构的所述第二表面邻近所述第二臂结构设置; 以及第二致动器,其邻近所述第二臂结构的所述第二表面邻近所述第一臂结构设置。 锁定机构包括第一对锁定元件,其布置成使得每个锁定元件设置在第一臂结构的第一和第二表面之间的第二臂结构的两个相对的侧表面处; 以及第二对锁定元件,其布置成使得每个锁定元件设置在第二臂结构的第二和第二表面之间的第二臂结构的两个相对的侧表面处。 第一和第二对锁定元件构造成分别与第一和第二臂结构接合和分离。
    • 9. 发明申请
    • Microelectromechanical System (MEMS) Device, Method of Operating The Same, and Method of Forming the Same
    • 微机电系统(MEMS)装置,其操作方法及其形成方法
    • US20120182594A1
    • 2012-07-19
    • US13377030
    • 2009-06-11
    • Qingxin ZhangYu DuChee Wei Tan
    • Qingxin ZhangYu DuChee Wei Tan
    • G02B26/00H01L29/84
    • B81B3/0054B81B2201/033B81B2201/047G02B6/4204G02B6/4226G02B6/4236G02B26/0833G02B26/0866
    • A microelectromechanical system (MEMS) device, method of operating the MEMS device, and a method of forming the MEMS device are provided. The MEMS device includes a positioning mechanism and a locking mechanism. The positioning mechanism includes a first arm structure having a first surface and a second surface; a second arm structure having a first surface and a second surface; wherein the first surface of the first arm structure faces the first surface of the second arm structure. The positioning mechanism also includes a first actuator disposed adjacent to the second surface of the first arm structure facing away from the second arm structure; and a second actuator disposed adjacent to the second surface of the second arm structure facing away from the first arm structure. The locking mechanism includes a first pair of locking elements arranged such that each locking element is disposed at two opposite side surfaces of the first arm structure between the first and second surfaces of the first arm structure; and a second pair of locking elements arranged such that each locking element is disposed at two opposite side surfaces of the second arm structure between the first and second surfaces of the second arm structure. The first and second pairs of locking elements are configured to engage with and disengage from the first and second arm structures respectively.
    • 提供了微机电系统(MEMS)装置,操作MEMS装置的方法以及形成MEMS器件的方法。 MEMS装置包括定位机构和锁定机构。 定位机构包括具有第一表面和第二表面的第一臂结构; 具有第一表面和第二表面的第二臂结构; 其中第一臂结构的第一表面面向第二臂结构的第一表面。 所述定位机构还包括第一致动器,所述第一致动器邻近所述第一臂结构的所述第二表面邻近所述第二臂结构设置; 以及第二致动器,其邻近所述第二臂结构的所述第二表面邻近所述第一臂结构设置。 锁定机构包括第一对锁定元件,其布置成使得每个锁定元件设置在第一臂结构的第一和第二表面之间的第二臂结构的两个相对的侧表面处; 以及第二对锁定元件,其布置成使得每个锁定元件设置在第二臂结构的第二和第二表面之间的第二臂结构的两个相对的侧表面处。 第一和第二对锁定元件构造成分别与第一和第二臂结构接合和分离。