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1. 发明授权

US5699610A Process for connecting electronic devices 失效
标题翻译：连接电子设备的过程
公开(公告)号：US5699610A
公开(公告)日：1997-12-23
申请号：US474019
申请日：1995-06-07
申请人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka , Shinichi Hasegawa
发明人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka , Shinichi Hasegawa
IPC分类号： H01L21/48 , H01L23/40 , H01L23/495 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H05K3/36 , H05K13/34
CPC分类号： H01L21/486 , H01L23/4006 , H01L23/49572 , H01L23/4985 , H01L24/01 , H05K3/301 , H05K3/363 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H05K1/0201 , H05K2201/062 , H05K2201/09827 , H05K2201/09854 , H05K2201/10568 , H05K2201/10666 , H05K2201/10681 , H05K3/3457 , Y10T29/49144 , Y10T29/49165
摘要： In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the second substrate. In a third step, a solder is provided on the pad of the second substrate. In a fourth step, the through-hole of the first substrate is positioned on the solder. The second surface of the first substrate and the first surface of the second substrate face each other. In a fifth step, the solder is heated to flow the solder into the through-hole of the first substrate. In the sixth step, an appearance of the solder on the first surface of the first substrate may be confirmed for detection of a connection of the solder.
摘要翻译：在第一步骤中，制备第一衬底。第一基板具有第一表面，第二表面和它们之间的通孔。在第二步骤中，制备第二衬底。第二基板在第二基板的第一表面上具有第一表面，第二表面和焊盘。在第三步骤中，在第二基板的焊盘上设置焊料。在第四步骤中，第一基板的通孔位于焊料上。第一基板的第二表面和第二基板的第一表面彼此面对。在第五步骤中，焊料被加热以使焊料流入第一衬底的通孔中。在第六步骤中，可以确认第一基板的第一表面上的焊料的外观，以检测焊料的连接。

2. 发明授权

US6087597A Connecting member and a connecting method with ball and tapered via 失效
标题翻译：连接构件和球形和锥形通孔的连接方法
公开(公告)号：US6087597A
公开(公告)日：2000-07-11
申请号：US505847
申请日：1995-07-24
申请人： Yuzo Shimada , Yoshimasa Tanaka , Shinichi Hasegawa , Takayuki Suyama
发明人： Yuzo Shimada , Yoshimasa Tanaka , Shinichi Hasegawa , Takayuki Suyama
IPC分类号： H01L23/495 , H01L23/498 , H05K3/34 , H05K3/36 , H01R9/09
CPC分类号： H05K3/3436 , H01L23/49572 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H05K3/363 , H01L2224/16237 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H05K2201/0209 , H05K2201/09827 , H05K2201/10234 , H05K2201/10666 , H05K2201/10681 , H05K2201/10992 , H05K2203/041 , Y02P70/613
摘要： An electronic device assembly (and method for forming the same) including a first substrate having a first surface, a second surface, and a first pad on the first surface thereof; a second substrate having a first surface, a second surface, and a second pad on the second surface thereof, the first pad facing the second pad; a rigid spherical core interposed between the first and second pads; and solder connecting the first and second pads. The first substrate has a through-hole which is provided through the first substrate at a position of the first pad, at least a part of the solder is positioned in the through-hole and at least a part of the spherical core is received in the through-hole. The through-hole has an inner wall which is continuously tapered from the first surface of the first substrate to the second surface of the first substrate.
摘要翻译：一种包括在其第一表面上具有第一表面，第二表面和第一焊盘的第一基板的电子器件组件（及其形成方法）; 第二基板，具有第一表面，第二表面和在其第二表面上的第二焊盘，所述第一焊盘面向所述第二焊盘; 插入在第一和第二垫之间的刚性球形芯; 以及焊接连接第一和第二焊盘。第一基板具有在第一焊盘的位置处通过第一基板提供的通孔，焊料的至少一部分位于通孔中，并且至少一部分球形芯被接收在通孔中通孔。通孔具有从第一基板的第一表面到第一基板的第二表面连续渐缩的内壁。

3. 发明授权

US5838064A Supporting member for cooling means and electronic package using the same 失效
标题翻译：冷却装置的支撑构件和使用其的电子封装
公开(公告)号：US5838064A
公开(公告)日：1998-11-17
申请号：US423455
申请日：1995-04-19
申请人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
发明人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
IPC分类号： H01L21/48 , H01L23/40 , H01L23/495 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H05K3/36 , H01L23/10 , H01L23/34
CPC分类号： H01L21/486 , H01L23/4006 , H01L23/49572 , H01L23/4985 , H01L24/50 , H05K3/301 , H05K3/363 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2224/73253 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H05K1/0201 , H05K2201/062 , H05K2201/09827 , H05K2201/09854 , H05K2201/10568 , H05K2201/10666 , H05K2201/10681 , H05K3/3457
摘要： An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling is attached onto and supported by the upper surface of the plate.
摘要翻译：电子包装包括支撑部件，电子装置，载体，基板，冷却装置。支撑构件包括用于支撑板的板和底腿。底脚的第一端连接到板的下表面。载体具有用于接收底部支腿的孔。电子装置连接到载体上并附着到板的下表面。底脚的第二端插入托架的孔中。底脚的第二端连接到基底的上表面。电子设备位于支撑构件的板和基板之间。冷却被附着到板的上表面并由其支撑。

4. 发明授权

US5814535A Supporting member for cooling means, electronic package and method of making the same 失效
标题翻译：冷却装置的支撑构件，电子封装及其制造方法
公开(公告)号：US5814535A
公开(公告)日：1998-09-29
申请号：US573131
申请日：1995-12-15
申请人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
发明人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
IPC分类号： H01L21/48 , H01L23/40 , H01L23/495 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H05K3/36 , H01L21/00 , H01L21/70 , H01L23/34
CPC分类号： H01L21/486 , H01L23/4006 , H01L23/49572 , H01L23/4985 , H01L24/50 , H05K3/301 , H05K3/363 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2224/73253 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H05K1/0201 , H05K2201/062 , H05K2201/09827 , H05K2201/09854 , H05K2201/10568 , H05K2201/10666 , H05K2201/10681 , H05K3/3457
摘要： An electronic package according to the present invention comprises a supporting member, an electronic device, a carrier, a substrate and cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling means is attached onto and supported by the upper surface of the plate.
摘要翻译：根据本发明的电子封装包括支撑构件，电子装置，载体，基板和冷却装置。支撑构件包括用于支撑板的板和底腿。底脚的第一端连接到板的下表面。载体具有用于接收底部支腿的孔。电子装置连接到载体上并附着到板的下表面。底脚的第二端插入托架的孔中。底脚的第二端连接到基底的上表面。电子设备位于支撑构件的板和基板之间。冷却装置附接到板的上表面并由板的上表面支撑。

5. 发明授权

US10057945B2 Induction heating device, induction heating equipment, induction heating method, and heat treatment method 有权
公开(公告)号：US10057945B2
公开(公告)日：2018-08-21
申请号：US14110410
申请日：2012-04-06
申请人： Hitoshi Nakatsu , Masato Yoshioka , Yoshimasa Tanaka , Tsutomu Ito , Kenji Koyanagi , Masaki Sagae , Tatsuya Ishii , Yoshitaka Misaka , Yasuharu Ogawa
发明人： Hitoshi Nakatsu , Masato Yoshioka , Yoshimasa Tanaka , Tsutomu Ito , Kenji Koyanagi , Masaki Sagae , Tatsuya Ishii , Yoshitaka Misaka , Yasuharu Ogawa
IPC分类号： H05B6/06 , H05B6/04 , H05B6/36 , H05B6/40 , H05B6/10 , H05B6/44
CPC分类号： H05B6/40 , H05B6/06 , H05B6/101 , H05B6/44
摘要： An induction heating device and an induction heating method are provided. The entire areas to be heated of the workpiece can be uniformly heated to a predetermined high temperature, and uniform heating is possible even when the workpiece deforms in a non-uniform manner during heating. When areas to be heated are established on a workpiece so as to extend in one direction and the areas to be heated are induction-heated, the deformation amount on one edge of the areas to be heated is different from that on the other. This induction heating device includes: heating coils facing a portion of the areas to be heated when the workpiece is induction-heated; and a relative transfer means for transferring the workpiece and the heating coils along one direction in a relative manner, and the heating coils are disposed so as to correspond to the areas to be heated during the heating period.

6. 发明授权

US09534267B2 Induction hardening apparatus, induction hardening method, induction heating coil, heat treatment apparatus, and heat treatment method 有权
标题翻译：感应淬火装置，感应淬火法，感应加热线圈，热处理装置和热处理方法
公开(公告)号：US09534267B2
公开(公告)日：2017-01-03
申请号：US13360274
申请日：2012-01-27
申请人： Yoshimasa Tanaka , Yoshitaka Misaka , Yuji Asano
发明人： Yoshimasa Tanaka , Yoshitaka Misaka , Yuji Asano
IPC分类号： H05B6/10 , H05B6/22 , H05B6/36 , C21D1/10 , C21D1/42 , C21D9/40
CPC分类号： C21D9/40 , C21D1/10 , C21D1/42 , C21D2221/00 , H05B6/102 , H05B6/36 , H05B6/40 , H05B6/44 , Y02P10/253
摘要： According to an embodiment, an induction heating coil includes a heating conductor portion which is formed of a conductor member and has a zigzag shape in which a bent portion opened to one side in a first direction and a bent portion opened to the other side in the first direction are alternately continuously arranged in opposite directions along a second direction crossing the first direction.
摘要翻译：根据实施例，感应加热线圈包括由导体构件形成并具有之字形形状的加热导体部分，其中在第一方向上一侧开口的弯曲部分和在第一方向上向另一侧敞开的弯曲部分第一方向沿着与第一方向交叉的第二方向沿相反方向交替地连续布置。

7. 发明授权

US08426386B2 NK1 receptor antagonist composition 有权
标题翻译： NK1受体拮抗剂组合物
公开(公告)号：US08426386B2
公开(公告)日：2013-04-23
申请号：US12445811
申请日：2007-10-12
申请人： Takuya Uozumi , Satoru Morishita , Yoshimasa Tanaka , Mayumi Yumoto
发明人： Takuya Uozumi , Satoru Morishita , Yoshimasa Tanaka , Mayumi Yumoto
IPC分类号： A01N43/04 , A61K31/715
CPC分类号： A61K31/702 , A23L2/52 , A23L33/10 , A61K8/64 , A61Q7/00 , A61Q19/00
摘要： An NK1 receptor antagonist composition of the present invention uses maltooligosaccharide having an NK1 receptor antagonistic activity as an active ingredient. A suitable amount of the maltooligosaccharide to be blended in the NK1 receptor antagonist composition of the present invention is 0.000001 to 70% by weight. The NK1 receptor antagonist composition of the present invention is prepared for use into various forms of external agents, internal medicines, foods and beverages by blending various materials as the ingredients other than the active ingredient. The NK1 receptor antagonist composition of the present invention has high safety for being used for pharmaceuticals and has satisfactory therapeutic effects.
摘要翻译：本发明的NK1受体拮抗剂组合物使用具有NK1受体拮抗活性的麦芽低聚糖作为有效成分。本发明的NK1受体拮抗剂组合物中配合的麦芽低聚糖的适量为0.000001-70重量％。本发明的NK1受体拮抗剂组合物通过混合各种材料作为活性成分以外的成分而制备成各种形式的外用剂，内用药，食品和饮料。本发明的NK1受体拮抗剂组合物对药物的安全性高，具有令人满意的治疗效果。

8. 发明申请

US20070138169A1 Heat treatment apparatus and heat treatment method 审中-公开
标题翻译：热处理设备及热处理方法
公开(公告)号：US20070138169A1
公开(公告)日：2007-06-21
申请号：US10569001
申请日：2003-11-25
申请人： Yoshimasa Tanaka , Hisaki Koga , Kazuhiro Kawasaki
发明人： Yoshimasa Tanaka , Hisaki Koga , Kazuhiro Kawasaki
IPC分类号： H05B6/22
CPC分类号： C21D1/42 , C21D9/02 , C21D9/28 , C21D9/30 , Y02P10/253
摘要： A heat treatment apparatus 10 comprises a supporting unit 20 for supporting a columnar workpiece 12 turnably, and an induction-heating coil 30 for induction-heating the workpiece 12 supported turnably by the supporting unit 20. Below the workpiece 12 supported by the supporting unit 20, a cooling tank 50 is provided which contains a liquid coolant. The workpiece 12 is made of steel such as carbon steel for mechanical structure, and spring steel. The workpiece 12 is made of a material which has a magnetic transformation point at 770° C. The material is ferromagnetic below this temperature, and becomes paramagnetic above this temperature.
摘要翻译：热处理装置10包括用于支撑柱状工件12的可转动的支撑单元20，以及用于通过支撑单元20可转动地支撑工件12感应加热的感应加热线圈30。在由支撑单元20支撑的工件12的下方，设置有包含液体冷却剂的冷却箱50。工件12由用于机械结构的碳素钢和弹簧钢制成。工件12由具有770℃的磁相变点的材料制成。该材料在该温度以下是铁磁性的，并且在该温度以上变为顺磁性。

9. 发明授权

US07147731B2 Flanged parts producing method, and heat-treating device and heat treating method therefor 有权
标题翻译：法兰部件生产方法，热处理装置及其热处理方法
公开(公告)号：US07147731B2
公开(公告)日：2006-12-12
申请号：US10471517
申请日：2002-03-27
申请人： Yoshimasa Tanaka , Katsumi Ohmiya , Yoshiki Seto , Yoichi Mori
发明人： Yoshimasa Tanaka , Katsumi Ohmiya , Yoshiki Seto , Yoichi Mori
IPC分类号： C21D1/10
CPC分类号： B62D25/04 , B21D53/88 , C21D1/18 , C21D1/40 , C21D1/42 , C21D9/0068 , C21D2221/00 , Y02P10/253
摘要： A spacer 44 is inserted between an upper end face 44a of a contact column 40, and a lower face of a flange 14. The flange 14 is supported at plural positions by supporting columns 42. In heating a shoulder portion 16 to a hardening temperature, an electroconductive member 56 is placed close to the shoulder portion 16, and an AC current having a frequency which will cause mutual attraction between the current flowing through the elctroconductive member 56 and the current flowing through the shoulder portion 16 is applied to flow through the electroconductive member 56. The shoulder portion 16 having been heated to the hardening temperature is quenched by ejecting a liquid coolant through ejection outlets of a cooling jacket.
摘要翻译：间隔件44插入在接触柱40的上端面44a和凸缘14的下表面之间。凸缘14通过支撑柱42支撑在多个位置。在将肩部16加热到硬化温度时，导电部件56靠近肩部16放置，并且具有频率将导致流过导电部件56的电流与流过导电部件56的电流之间引起相互吸引的交流电流肩部16被施加以流过导电构件56。已经加热到硬化温度的肩部16通过冷却套的喷射出口喷射液体冷却剂来淬火。

10. 发明申请

US20060218326A1 Blade server system and method of managing same 有权
标题翻译：刀片服务器系统及其管理方法
公开(公告)号：US20060218326A1
公开(公告)日：2006-09-28
申请号：US11389021
申请日：2006-03-27
申请人： Yoshimasa Tanaka
发明人： Yoshimasa Tanaka
IPC分类号： G06F13/00 , H05K7/10
CPC分类号： H05K7/1459 , H05K7/1498
摘要： Each chassis includes a back plane having a plurality of slots and a CPU blade server and CMMs which are inserted in the slots, respectively. The back plane has a storage unit storing a housing number for identifying the housing, in-housing chassis numbers for identifying the chassis in the housing, and in-chassis slot IDs for identifying the slots. When the blade server is inserted into the corresponding slot, the blade server acquires the in-chassis slot ID from the back plane. When the CMMs are inserted into the corresponding slots, the CMMs acquire housing numbers and in-housing chassis numbers from the back plane, holds the housing number and the in-housing chassis numbers, and manages the configuration of the blade server through the back plane. One of the CMMs manages the other CMMs.
摘要翻译：每个底盘包括分别具有多个槽的背板和插入槽中的CPU刀片服务器和CMM。背板具有存储用于识别外壳的外壳编号的存储单元，用于识别外壳中的机箱的机箱内编号，以及用于识别时隙的机架内插槽ID。当刀片服务器插入到相应的插槽中时，刀片服务器从背板获取机箱内插槽ID。当CMM插入到相应的插槽中时，CMM从背板获取外壳编号和机箱底座编号，保持外壳编号和机箱底座编号，并通过后平面管理刀片服务器的配置。其中一个CMM管理其他CMM。

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