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1. 发明授权

US5838064A Supporting member for cooling means and electronic package using the same 失效
标题翻译：冷却装置的支撑构件和使用其的电子封装
公开(公告)号：US5838064A
公开(公告)日：1998-11-17
申请号：US423455
申请日：1995-04-19
申请人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
发明人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
IPC分类号： H01L21/48 , H01L23/40 , H01L23/495 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H05K3/36 , H01L23/10 , H01L23/34
CPC分类号： H01L21/486 , H01L23/4006 , H01L23/49572 , H01L23/4985 , H01L24/50 , H05K3/301 , H05K3/363 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2224/73253 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H05K1/0201 , H05K2201/062 , H05K2201/09827 , H05K2201/09854 , H05K2201/10568 , H05K2201/10666 , H05K2201/10681 , H05K3/3457
摘要： An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling is attached onto and supported by the upper surface of the plate.
摘要翻译：电子包装包括支撑部件，电子装置，载体，基板，冷却装置。支撑构件包括用于支撑板的板和底腿。底脚的第一端连接到板的下表面。载体具有用于接收底部支腿的孔。电子装置连接到载体上并附着到板的下表面。底脚的第二端插入托架的孔中。底脚的第二端连接到基底的上表面。电子设备位于支撑构件的板和基板之间。冷却被附着到板的上表面并由其支撑。

2. 发明授权

US5814535A Supporting member for cooling means, electronic package and method of making the same 失效
标题翻译：冷却装置的支撑构件，电子封装及其制造方法
公开(公告)号：US5814535A
公开(公告)日：1998-09-29
申请号：US573131
申请日：1995-12-15
申请人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
发明人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka
IPC分类号： H01L21/48 , H01L23/40 , H01L23/495 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H05K3/36 , H01L21/00 , H01L21/70 , H01L23/34
CPC分类号： H01L21/486 , H01L23/4006 , H01L23/49572 , H01L23/4985 , H01L24/50 , H05K3/301 , H05K3/363 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2224/73253 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H05K1/0201 , H05K2201/062 , H05K2201/09827 , H05K2201/09854 , H05K2201/10568 , H05K2201/10666 , H05K2201/10681 , H05K3/3457
摘要： An electronic package according to the present invention comprises a supporting member, an electronic device, a carrier, a substrate and cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling means is attached onto and supported by the upper surface of the plate.
摘要翻译：根据本发明的电子封装包括支撑构件，电子装置，载体，基板和冷却装置。支撑构件包括用于支撑板的板和底腿。底脚的第一端连接到板的下表面。载体具有用于接收底部支腿的孔。电子装置连接到载体上并附着到板的下表面。底脚的第二端插入托架的孔中。底脚的第二端连接到基底的上表面。电子设备位于支撑构件的板和基板之间。冷却装置附接到板的上表面并由板的上表面支撑。

3. 发明授权

US6087597A Connecting member and a connecting method with ball and tapered via 失效
标题翻译：连接构件和球形和锥形通孔的连接方法
公开(公告)号：US6087597A
公开(公告)日：2000-07-11
申请号：US505847
申请日：1995-07-24
申请人： Yuzo Shimada , Yoshimasa Tanaka , Shinichi Hasegawa , Takayuki Suyama
发明人： Yuzo Shimada , Yoshimasa Tanaka , Shinichi Hasegawa , Takayuki Suyama
IPC分类号： H01L23/495 , H01L23/498 , H05K3/34 , H05K3/36 , H01R9/09
CPC分类号： H05K3/3436 , H01L23/49572 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H05K3/363 , H01L2224/16237 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H05K2201/0209 , H05K2201/09827 , H05K2201/10234 , H05K2201/10666 , H05K2201/10681 , H05K2201/10992 , H05K2203/041 , Y02P70/613
摘要： An electronic device assembly (and method for forming the same) including a first substrate having a first surface, a second surface, and a first pad on the first surface thereof; a second substrate having a first surface, a second surface, and a second pad on the second surface thereof, the first pad facing the second pad; a rigid spherical core interposed between the first and second pads; and solder connecting the first and second pads. The first substrate has a through-hole which is provided through the first substrate at a position of the first pad, at least a part of the solder is positioned in the through-hole and at least a part of the spherical core is received in the through-hole. The through-hole has an inner wall which is continuously tapered from the first surface of the first substrate to the second surface of the first substrate.
摘要翻译：一种包括在其第一表面上具有第一表面，第二表面和第一焊盘的第一基板的电子器件组件（及其形成方法）; 第二基板，具有第一表面，第二表面和在其第二表面上的第二焊盘，所述第一焊盘面向所述第二焊盘; 插入在第一和第二垫之间的刚性球形芯; 以及焊接连接第一和第二焊盘。第一基板具有在第一焊盘的位置处通过第一基板提供的通孔，焊料的至少一部分位于通孔中，并且至少一部分球形芯被接收在通孔中通孔。通孔具有从第一基板的第一表面到第一基板的第二表面连续渐缩的内壁。

4. 发明授权

US5699610A Process for connecting electronic devices 失效
标题翻译：连接电子设备的过程
公开(公告)号：US5699610A
公开(公告)日：1997-12-23
申请号：US474019
申请日：1995-06-07
申请人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka , Shinichi Hasegawa
发明人： Yuzo Shimada , Takayuki Suyama , Yoshimasa Tanaka , Shinichi Hasegawa
IPC分类号： H01L21/48 , H01L23/40 , H01L23/495 , H01L23/498 , H05K1/02 , H05K3/30 , H05K3/34 , H05K3/36 , H05K13/34
CPC分类号： H01L21/486 , H01L23/4006 , H01L23/49572 , H01L23/4985 , H01L24/01 , H05K3/301 , H05K3/363 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H05K1/0201 , H05K2201/062 , H05K2201/09827 , H05K2201/09854 , H05K2201/10568 , H05K2201/10666 , H05K2201/10681 , H05K3/3457 , Y10T29/49144 , Y10T29/49165
摘要： In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the second substrate. In a third step, a solder is provided on the pad of the second substrate. In a fourth step, the through-hole of the first substrate is positioned on the solder. The second surface of the first substrate and the first surface of the second substrate face each other. In a fifth step, the solder is heated to flow the solder into the through-hole of the first substrate. In the sixth step, an appearance of the solder on the first surface of the first substrate may be confirmed for detection of a connection of the solder.
摘要翻译：在第一步骤中，制备第一衬底。第一基板具有第一表面，第二表面和它们之间的通孔。在第二步骤中，制备第二衬底。第二基板在第二基板的第一表面上具有第一表面，第二表面和焊盘。在第三步骤中，在第二基板的焊盘上设置焊料。在第四步骤中，第一基板的通孔位于焊料上。第一基板的第二表面和第二基板的第一表面彼此面对。在第五步骤中，焊料被加热以使焊料流入第一衬底的通孔中。在第六步骤中，可以确认第一基板的第一表面上的焊料的外观，以检测焊料的连接。

5. 发明授权

US5923535A Electronic device assembly 失效
标题翻译：电子设备组装
公开(公告)号：US5923535A
公开(公告)日：1999-07-13
申请号：US959270
申请日：1997-10-28
申请人： Yuzo Shimada , Takayuki Suyama , Shinichi Hasegawa
发明人： Yuzo Shimada , Takayuki Suyama , Shinichi Hasegawa
IPC分类号： H01L23/498 , H05K1/14 , H05K3/00 , H05K3/34 , H05K3/36 , H05K1/03
CPC分类号： H01L23/4985 , H05K3/3436 , H05K3/363 , H01L2224/16225 , H01L2224/73253 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H05K1/141 , H05K2201/096 , H05K2201/09827 , H05K2201/10234 , H05K2201/10666 , H05K2201/10681 , H05K2201/10992 , H05K2203/041 , H05K3/0058 , H05K3/3457 , H05K3/368 , Y02P70/613
摘要： An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.
摘要翻译：电子设备组件包括刚性的第一衬底和第二衬底。第一基板在上表面具有第一焊盘，在第一焊盘的位置具有通孔。第二衬底在其上表面上具有第二衬垫。第一和第二焊盘通过焊料连接。焊料的至少一部分位于第一基板的通孔中。第一基板可以包括柔性基板和刚性板。通孔设置在柔性基板中。第一衬垫设置在柔性衬底的下表面上。刚性板附着在柔性基板上。该板在通孔的位置处具有孔，以使第一垫可达。

6. 发明授权

US06999643B2 Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board 失效
标题翻译：制造光波导的方法及制造光电布线板的方法
公开(公告)号：US06999643B2
公开(公告)日：2006-02-14
申请号：US10303976
申请日：2002-11-26
申请人： Hideo Kikuchi , Mikio Oda , Hikaru Kouta , Sakae Kitajo , Yuzo Shimada
发明人： Hideo Kikuchi , Mikio Oda , Hikaru Kouta , Sakae Kitajo , Yuzo Shimada
IPC分类号： G02B6/12
CPC分类号： G02B6/4228 , G02B6/138 , G02B6/305 , G02B6/42 , G02B6/4202 , G02B6/4204 , G02B6/423 , G02B6/43 , G02B2006/12069 , G02B2006/1215 , G02B2006/12159 , H05K1/0274
摘要： After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.
摘要翻译：在将包括支撑基板的光波导基板粘附到电气布线板上之后，仅使用有机溶剂溶解支撑基板以进行除去。或者，单独的支撑衬底通过热处理熔化以除去。此外，使用具有与支撑基板的热膨胀系数基本相同的热膨胀系数的感光性树脂，在基板上形成光波导的芯层。

7. 发明授权

US5830563A Interconnection structures and method of making same 失效
标题翻译：互连结构及其制作方法
公开(公告)号：US5830563A
公开(公告)日：1998-11-03
申请号：US752798
申请日：1996-11-20
申请人： Tadanori Shimoto , Yoshitsugu Funada , Koji Matsui , Yuzo Shimada , Kazuaki Utsumi
发明人： Tadanori Shimoto , Yoshitsugu Funada , Koji Matsui , Yuzo Shimada , Kazuaki Utsumi
IPC分类号： H05K1/00 , H05K3/00 , H05K3/18 , H05K3/46 , B32B3/00
CPC分类号： H05K3/4661 , H05K3/465 , H05K2201/0195 , H05K2201/0355 , H05K2201/0394 , H05K3/0023 , H05K3/184 , H05K3/4676 , Y10S428/901 , Y10T428/24917 , Y10T428/3154
摘要： This invention relates to an interconnection structure comprising one or more insulating films and one or more layers of conductor electrode patterns, wherein at least one of the insulating films consists of a fluorene skeleton-containing epoxy acrylate resin, and to a method of making a multilayer interconnection structure including the steps of roughening the surface of an insulating resin layer and forming a conductor thereon by electroless plating, wherein the average roughness (Ra), maximum roughness (Ry) and conductor thickness (T) of the roughened surface of the insulating resin layer satisfy the following relations: 0.2.ltoreq.Ra.ltoreq.0.6 (unit: .mu.m) (1) 0.02.ltoreq.Ra/T.ltoreq.0.2 (2) 0.05.ltoreq.Ry/T.ltoreq.0.5 (3) and catalyst nuclei for electroless plating are supplied by applying a solution of a metallic salt to the roughened surface of the insulating resin layer or dipping the substrate in a solution of a metallic salt, drying and heat-treating the substrate, and then subjecting it to displacement palladium plating.
摘要翻译：本发明涉及一种互连结构，其包括一个或多个绝缘膜和一层或多层导体电极图案，其中绝缘膜中的至少一层由含芴骨架的环氧丙烯酸酯树脂组成，以及制备多层互连结构，包括通过无电解电镀使绝缘树脂层的表面粗糙化并在其上形成导体的步骤，其中绝缘树脂的粗糙表面的平均粗糙度（Ra），最大粗糙度（Ry）和导体厚度（T）层满足以下关系：0.2

8. 发明授权

US5793117A Semiconductor device and method of fabricating the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5793117A
公开(公告)日：1998-08-11
申请号：US684617
申请日：1996-07-22
申请人： Yuzo Shimada , Naoji Senba , Nobuaki Takahashi
发明人： Yuzo Shimada , Naoji Senba , Nobuaki Takahashi
IPC分类号： G01R1/06 , G01R1/073 , G01R31/28 , H01L21/60 , H01L21/66 , H01L29/41 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： G01R1/07314 , G01R31/2886 , H01L24/19 , H01L2924/12042 , H01L2924/14 , H01L2924/351
摘要： The invention provides a semiconductor device including a semiconductor substrate formed thereon with at least one recessed portion, an electrically conductive layer covering at least a surface of the recessed portion therewith, and a ball-bump formed on the electrically conductive layer within the recessed portion. The semiconductor device can act as a probe card by additionally having a tester device formed in the semiconductor substrate and provided with a function of testing electrical performances of a semiconductor device. Since the recessed portion can be formed by lithography technique, it is possible to arrange the greater number of pins in a smaller pitch, and in addition, it is also possible to locate ball-bumps in place with higher accuracy than a conventional semiconductor device.
摘要翻译：本发明提供了一种半导体器件，其包括在其上形成有至少一个凹部的半导体衬底，至少覆盖其凹部的表面的导电层，以及形成在凹部内的导电层上的球凸点。半导体器件可以通过另外具有形成在半导体衬底中的测试器器件并且具有测试半导体器件的电性能的功能而用作探针卡。由于可以通过光刻技术形成凹部，因此可以以更小的间距布置更多数量的销，另外也可以比现有的半导体装置更高精度地定位球形凸块。

9. 发明授权

US5283210A Low temperature sintering low dielectric inorganic composition 失效
标题翻译：低温烧结低介电无机组成
公开(公告)号：US5283210A
公开(公告)日：1994-02-01
申请号：US905376
申请日：1992-06-29
申请人： Keiichiro Kata , Yuzo Shimada
发明人： Keiichiro Kata , Yuzo Shimada
IPC分类号： C04B35/195 , C03C14/00 , C04B35/16 , H01B3/02 , H01B3/12 , H01L23/15 , H05K1/00 , H05K1/03 , C03C4/16
CPC分类号： C03C14/004 , H01L23/15 , C03C2214/04 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4676
摘要： A low temperature sintering, low dielectric inorganic composition is a ternary inorganic composition comprising cordierite, quartz glass and lead borosilicate glass, wherein if the amounts of the cordierite, quartz glass and lead borosilicate glass are represented by X, Y and Z (wt %) respectively, the composition of the ternary system falls within the range encircled by the following four points (a) to (d) including the lines between each neighboring two points:(X=35; Y=0; Z=65) (a)(X=65; Y=0; Z=35) (b)(X=0; Y=65; Z=35) (c)(X=0; Y=35; Z=65) (d)The inorganic composition has a dielectric constant substantially lower than that of the conventional composition while maintaining high reliability such as an ability of being sintered at a low temperature, high insulation properties and high resistance to water as well as excellent mechanical properties such as strength. The composition can be used for producing multilayer ceramic wiring boards for mounting very high speed VLSI elements and contributes to an increase in the packaging density and the production of fast transmitting devices.
摘要翻译：低温烧结低介电无机组合物是包含堇青石，石英玻璃和硼硅酸铅玻璃的三元无机组合物，其中如果堇青石，石英玻璃和硼硅酸铅玻璃的量由X，Y和Z（重量％）表示，（X = 35; Y = 0; Z = 65）（a）中的三个点（a）〜（d）所包围的范围内，（X = 65; Y = 0; Z = 35）（b）（X = 0; Y = 65; Z = 35）（c）（X = 0; Y = 35; Z = 65）（d）组合物的介电常数基本上低于常规组合物的介电常数，同时保持诸如在低温下烧结的能力，高绝缘性能和高耐水性等高可靠性以及优异的机械性能如强度。该组合物可用于生产用于安装超高速VLSI元件的多层陶瓷布线板，并有助于增加封装密度和快速传输器件的生产。

10. 发明授权

US07106426B2 Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk 有权
标题翻译：检测光波导基板以提高光速的方法，并检查光波导基板的串扰
公开(公告)号：US07106426B2
公开(公告)日：2006-09-12
申请号：US10322484
申请日：2002-12-19
申请人： Hideo Kikuchi , Mikio Oda , Hikaru Kouta , Sakae Kitajo , Yuzo Shimada , Yoshio Matsumoto , Shinichi Tamabayashi
发明人： Hideo Kikuchi , Mikio Oda , Hikaru Kouta , Sakae Kitajo , Yuzo Shimada , Yoshio Matsumoto , Shinichi Tamabayashi
IPC分类号： G01N21/00
CPC分类号： G01M11/35
摘要： There is disclosed a method of inspecting an optical waveguide substrate for optical conduction at an increased inspecting rate and also inspecting an optical waveguide substrate for cross-talk. According to the disclosed method, a laser beam is applied from a laser beam scanning optical system to one end face of an optical waveguide of an optical waveguide substrate which is an object to be inspected, and the laser beam emitted from the other end of the optical waveguide is detected by a CCD camera, which output detected result data. A light spot position confirming device compares the detected result data with stored data.
摘要翻译：公开了以更高的检查速度检查用于光导的光波导基板的方法，并且还检查用于串扰的光波导基板。根据所公开的方法，将激光束从激光束扫描光学系统施加到作为被检查对象的光波导基板的光波导的一个端面，从另一端发射的激光束光波导由CCD摄像机检测，其输出检测结果数据。光点位置确认装置将检测到的结果数据与存储的数据进行比较。

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