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1. 发明授权

US07263897B2 Three-axis motion table 失效
公开(公告)号：US07263897B2
公开(公告)日：2007-09-04
申请号：US10556774
申请日：2004-05-06
申请人： Yuzo Shimada , Kenji Uchiyama
发明人： Yuzo Shimada , Kenji Uchiyama
IPC分类号： G01M5/00
CPC分类号： B23Q1/5412
摘要： The present invention aims at providing a three-axis motion table capable of ensuring smooth rotations around three rotation axes orthogonal to each other and decreasing an overall weight.The three-axis motion table according to the present invention has an outside frame (3), an (e.g., approximately square) intermediate frame (5), and an (e.g., approximately square) inside frame (7). The outside frame (3) is rotatably mounted around a first rotation axis (2) by means of a pair of both-end supporting legs (1, 1). The intermediate frame (5) is rotatably mounted around a second rotation axis (4) by means of the outside frame (3). The inside frame (7) is rotatably mounted around a third rotation axis (6) by means of the intermediate frame (5). The inside frame (7) has a holding mechanism for a tested model (J). One of the both-end supporting legs (1, 1) is provided with a first motor (M1) to rotate the outside frame (3). The outside frame (3) is provided with a second motor (M2) to rotate the intermediate frame (5). The intermediate frame (5) is provided with a third motor (M3) to rotate the inside frame (7).According to the above-mentioned configuration, the first through third motors (M1 through M3)rotate. The inside frame (7) holding the tested model (J) rotates in the space inside the intermediate frame (5). The intermediate frame (5) rotates in the space inside the outside frame (3). In this maimer, rotations are provided around the three rotation axes (2, 4, 6) orthogonal to each other. The pair of both-end supporting legs (1, 1) works as a base for supporting the entire three-axis motion table (A). The pair of both-end supporting legs (1, 1) is more stable than a base (B in FIG. 10) according to the conventional technology using only one vertical rotation axis for supporting one end. The pair of both-end supporting legs (1, 1) is capable of miniaturization and weight saving.

2. 发明授权

US06926188B2 Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip 失效
标题翻译：用于在衬底和/或芯片上排列小导电凸块的转移装置
公开(公告)号：US06926188B2
公开(公告)日：2005-08-09
申请号：US10700438
申请日：2003-11-04
申请人： Ichiro Hazeyama , Sakae Kitajo , Yuzo Shimada , Akeo Katahira , Jun Ishida , Masaru Terashima , Kazuhiko Futakami
发明人： Ichiro Hazeyama , Sakae Kitajo , Yuzo Shimada , Akeo Katahira , Jun Ishida , Masaru Terashima , Kazuhiko Futakami
IPC分类号： H01L21/48 , H01L21/60 , H01L21/683 , H05K3/34 , B23K1/00 , B23K5/00 , B23K20/14 , B23K35/12
CPC分类号： H01L24/11 , H01L21/4853 , H01L21/6838 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H05K3/3478 , H01L2924/00 , H01L2224/05599
摘要： Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.
摘要翻译：导电球通过传送装置从托盘传送到半导体芯片上的导电焊盘阵列上; 转印装置包括形成有与导电垫阵列相同的凹槽阵列的托盘，形成有真空孔阵列的可移动头和用于将头从空闲位置移动到托盘上的驱动机构托盘到半导体芯片; 当头部移动到托盘上时，真空孔连接到凹部，以将导电球限制在狭窄的空间中; 真空开发; 然后导电球通过封闭空间行进到真空孔; 即使导电球已经被充电，导电球也不会被吸引到相邻的球，并且被真空孔确实地捕获。

3. 发明授权

US06829079B2 Optical path control apparatus with mirror section, and manufacturing method for the same 有权
标题翻译：具有镜面部分的光路控制装置及其制造方法
公开(公告)号：US06829079B2
公开(公告)日：2004-12-07
申请号：US10028238
申请日：2001-12-21
申请人： Mikio Oda , Mitsuru Yamamoto , Hikaru Kouta , Yasuhiro Sasaki , Sakae Kitajo , Yuzo Shimada
发明人： Mikio Oda , Mitsuru Yamamoto , Hikaru Kouta , Yasuhiro Sasaki , Sakae Kitajo , Yuzo Shimada
IPC分类号： G02F129
CPC分类号： G02B6/352 , G02B6/3548 , G02B6/357 , G02B6/3572 , G02B6/3574 , G02B6/3578 , G02B6/3598 , G02B6/43 , G02B2006/12145
摘要： An optical path control apparatus includes a first substrate. A second substrate is movably provided for the first substrate. A mirror section is provided on the second substrate. A driving section moves the second substrate such that a first optical path of input light to the mirror section is optically connected to one of a plurality of second optical paths.
摘要翻译：光路控制装置包括第一基板。可动地设置第二基板用于第一基板。在第二基板上设置镜部。驱动部移动第二基板，使得输入光的第一光路到镜部分光学连接到多个第二光路中的一个。

4. 发明授权

US06524905B2 Semiconductor device, and thin film capacitor 有权
标题翻译：半导体器件和薄膜电容器
公开(公告)号：US06524905B2
公开(公告)日：2003-02-25
申请号：US09903316
申请日：2001-07-11
申请人： Shintaro Yamamichi , Toru Mori , Akinobu Shibuya , Takao Yamazaki , Yuzo Shimada
发明人： Shintaro Yamamichi , Toru Mori , Akinobu Shibuya , Takao Yamazaki , Yuzo Shimada
IPC分类号： H01L218242
CPC分类号： H01L28/40 , H01L23/5223 , H01L24/05 , H01L27/0688 , H01L2221/68363 , H01L2224/04042 , H01L2224/4847 , H01L2924/14 , H01L2924/30107 , H01L2924/00
摘要： A semiconductor device provided with a thin film capacitor having a small equivalent series inductance is provided, which can be operated at a high frequency range and contributes to size reduction of the electronic devices. The semiconductor device comprises a device formed on a silicon substrate 1a, interlayer insulating films 3a, 3b, and 3c, wiring blocks including a power source wire block and a ground wire block, and a thin film capacitor 14 formed on an uppermost insulating layer. The thin film capacitor 14 comprises a lower electrode 6 connected to the ground wire block 4e through a contact 5d, an upper electrode 8 which is connected to the power source wire block 4d through a contact 5d, and which extends above the lower electrode 6, and a dielectric layer 7 which is inserted between the lower and the upper electrodes.
摘要翻译：提供了具有小等效串联电感的薄膜电容器的半导体器件，其可以在高频范围下操作并且有助于电子器件的尺寸减小。半导体器件包括形成在硅衬底1a，层间绝缘膜3a，3b和3c上的器件，包括电源线块和接地线块的布线块，以及形成在最上层绝缘层上的薄膜电容器14。薄膜电容器14包括通过接触件5d连接到接地线块4e的下电极6，通过接触件5d连接到电源线块4d并且在下电极6上方延伸的上电极8，以及插入在下电极和上电极之间的电介质层7。

5. 发明授权

US06378756B1 Solder ball arrangement device 有权
标题翻译：焊球装置
公开(公告)号：US06378756B1
公开(公告)日：2002-04-30
申请号：US09593385
申请日：2000-06-14
申请人： Nobuaki Takahashi , Naoji Senba , Yuzo Shimada
发明人： Nobuaki Takahashi , Naoji Senba , Yuzo Shimada
IPC分类号： B23K3102
CPC分类号： B23K35/0244 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L24/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2201/0116 , H05K2203/041 , H05K2203/082
摘要： A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside the housing member. A suction pump is provided to evacuate the air space and to receive an array of solder balls in the through-holes by suction. The through-holes are formed by etching, and the porous member reinforces the thin arrangement plate.
摘要翻译：焊球配置装置具有薄排列板，其具有多个截锥形通孔，接合到排列板的多孔构件，以及用于容纳布置板的壳体构件和用于限定空间的多孔构件在壳体内。提供抽吸泵以抽空空气空间并通过抽吸在通孔中容纳焊球阵列。通孔是通过蚀刻形成的，并且多孔构件加强了薄排列板。

6. 发明授权

US6130111A Packaged semiconductor device and method of manufacturing the same 有权
标题翻译：封装半导体器件及其制造方法
公开(公告)号：US6130111A
公开(公告)日：2000-10-10
申请号：US333578
申请日：1999-06-15
申请人： Kazuhiro Ikuina , Yuzo Shimada , Kazuaki Utsumi
发明人： Kazuhiro Ikuina , Yuzo Shimada , Kazuaki Utsumi
IPC分类号： H01L23/12 , H01L21/60 , H01L21/768 , H01L23/13 , H01L23/48 , H01L21/44
CPC分类号： H01L24/80 , H01L21/76898 , H01L23/13 , H01L23/481 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15787
摘要： A packaged semiconductor device includes an LSI chip, a chip size package integrally bonded to the LSI chip to mount and hold the LSI chip thereon in order to connect an electrode of a board on which the LSI chip is to be mounted and an electrode of the LSI chip to each other, an electrode formed on a surface of the package opposite to a surface thereof which is bonded to the LSI chip, so as to be connected to the electrode of the board, at least one through hole formed to extend through the LSI chip and the package, and a connecting conductor formed to extend through the through hole in order to connect the electrode of the package and the electrode of the LSI package to each other.
摘要翻译：封装半导体器件包括：LSI芯片，与LSI芯片整体接合的芯片尺寸封装，以将LSI芯片安装和保持在其上，以便将要安装LSI芯片的板的电极和 LSI芯片彼此之间形成有与其与LSI芯片接合的表面的与其表面相反的表面形成的电极，以与板的电极连接，至少一个通孔形成为延伸通过 LSI芯片和封装，以及形成为延伸穿过通孔的连接导体，以将封装的电极和LSI封装的电极彼此连接。

7. 发明授权

US6111479A Laminate printed circuit board with a magnetic layer 失效
标题翻译：具有磁性层的层压印刷电路板
公开(公告)号：US6111479A
公开(公告)日：2000-08-29
申请号：US33554
申请日：1998-03-02
申请人： Osamu Myohga , Shiro Yoshida , Mitsuo Saito , Yuzo Shimada , Hirokazu Tohya , Ryo Maniwa
发明人： Osamu Myohga , Shiro Yoshida , Mitsuo Saito , Yuzo Shimada , Hirokazu Tohya , Ryo Maniwa
IPC分类号： H05K9/00 , H03H7/01 , H05K1/00 , H05K1/02 , H05K3/46
CPC分类号： H05K1/0233 , H03H7/01 , H05K1/0216 , H05K1/0298
摘要： A laminate printed circuit board loaded with transistors, ICs (Integrated Circuits) or LSIs (Large Scale Integrated Circuits) and a method of producing the same are disclosed. The circuit board includes a signal layer, a ground layer and a power supply layer sequentially laminated with the intermediary of insulation layers. An impedance adding circuit is formed in the power supply layer. A magnetic layer is positioned at least above or at least blow the impedance adding circuit. The circuit board with this configuration reduces power supply noise to a noticeable degree.
摘要翻译：公开了一种装载有晶体管，集成电路（IC）或LSI（大规模集成电路）的叠层印刷电路板及其制造方法。电路板包括信号层，接地层和依次层叠有绝缘层中间的电源层。在电源层中形成阻抗加法电路。磁性层至少位于或至少使阻抗加法电路吹过。具有这种配置的电路板可以显着降低电源噪声。

8. 发明授权

US5989484A Multilayer glass ceramic substrate and process for producing the same 失效
标题翻译：多层玻璃陶瓷基板及其制造方法
公开(公告)号：US5989484A
公开(公告)日：1999-11-23
申请号：US998292
申请日：1997-12-24
申请人： Kazuhiro Ikuina , Yuzo Shimada
发明人： Kazuhiro Ikuina , Yuzo Shimada
IPC分类号： C03C14/00 , C03C17/36 , H01L23/15 , B32B17/02
CPC分类号： C03C17/361 , C03C14/004 , C03C17/36 , C03C17/3639 , C03C17/3642 , H01L23/15 , C03C2214/04 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10T428/24851 , Y10T428/24917 , Y10T428/24926
摘要： A multilayer glass ceramic substrate having a plurality of conductor layers each laminated through a glass ceramic layer. The glass ceramic layer has a composition comprising of alumina, borosilicate magnesium glass and cordierite crystal produced by chemical reaction between alumina and borosilicate magnesium glass. The content of alumina is 12 to 59.6 wt %, the content of borosilicate magnesium glass is 18 to 69.6 wt %, the content of the cordierite crystal is 1 to 50 wt % and the sum of components is 100 wt %. The multilayer glass ceramic substrate shows improved mechanical strength.
摘要翻译：一种多层玻璃陶瓷基板，具有通过玻璃陶瓷层层叠的多个导体层。玻璃陶瓷层具有由氧化铝，硼硅酸镁玻璃和氧化铝与硼硅酸镁玻璃之间的化学反应制造的堇青石晶体的组成。氧化铝的含量为12〜59.6重量％，硼硅酸镁玻璃的含量为18〜69.6重量％，堇青石结晶的含量为1〜50重量％，成分总量为100重量％。多层玻璃陶瓷基板显示出改进的机械强度。

9. 发明授权

US5978231A Printed wiring board with integrated coil inductor 失效
标题翻译：带集成线圈电感的印刷电路板
公开(公告)号：US5978231A
公开(公告)日：1999-11-02
申请号：US82800
申请日：1998-05-21
申请人： Hirokazu Tohya , Shiro Yoshida , Yuzo Shimada
发明人： Hirokazu Tohya , Shiro Yoshida , Yuzo Shimada
IPC分类号： H01F1/34 , H01F17/00 , H01F27/00 , H05K1/02 , H05K1/11 , H05K1/16 , H05K7/06 , H05K9/00
CPC分类号： H01F17/0013 , H05K1/0233 , H05K1/165 , H05K2201/0187 , H05K2201/086 , H05K2201/09309 , H05K2201/09336 , H05K2201/097 , H05K3/4688
摘要： An insulative magnetic layer is disposed between a power source conductor layer and a ground conductor layer of a printed-wiring board. Two pieces of conductors are formed by cutting out a part of the power source conductor layer. Another two pieces of conductors are formed by cutting out a part of the ground conductor layer. The former conductors and the latter conductors are connected by five viaholes. A spiral coil inductor of a spiral form is formed in this way. This inductor has the strengthened inductance owing to the insulative magnetic layer provided therein.
摘要翻译：绝缘磁性层设置在印刷电路板的电源导体层和接地导体层之间。通过切掉电源导体层的一部分来形成两个导体。通过切掉接地导体层的一部分来形成另外两个导体。前导体和后导体通过五个通孔连接。以这种方式形成螺旋形螺旋线圈电感器。该电感器由于其中提供的绝缘磁性层而具有增强的电感。

10. 发明授权

US5923535A Electronic device assembly 失效
标题翻译：电子设备组装
公开(公告)号：US5923535A
公开(公告)日：1999-07-13
申请号：US959270
申请日：1997-10-28
申请人： Yuzo Shimada , Takayuki Suyama , Shinichi Hasegawa
发明人： Yuzo Shimada , Takayuki Suyama , Shinichi Hasegawa
IPC分类号： H01L23/498 , H05K1/14 , H05K3/00 , H05K3/34 , H05K3/36 , H05K1/03
CPC分类号： H01L23/4985 , H05K3/3436 , H05K3/363 , H01L2224/16225 , H01L2224/73253 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H05K1/141 , H05K2201/096 , H05K2201/09827 , H05K2201/10234 , H05K2201/10666 , H05K2201/10681 , H05K2201/10992 , H05K2203/041 , H05K3/0058 , H05K3/3457 , H05K3/368 , Y02P70/613
摘要： An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.
摘要翻译：电子设备组件包括刚性的第一衬底和第二衬底。第一基板在上表面具有第一焊盘，在第一焊盘的位置具有通孔。第二衬底在其上表面上具有第二衬垫。第一和第二焊盘通过焊料连接。焊料的至少一部分位于第一基板的通孔中。第一基板可以包括柔性基板和刚性板。通孔设置在柔性基板中。第一衬垫设置在柔性衬底的下表面上。刚性板附着在柔性基板上。该板在通孔的位置处具有孔，以使第一垫可达。

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