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    • 3. 发明授权
    • Semiconductor device and manufacturing method of the same
    • 半导体器件及其制造方法相同
    • US08384153B2
    • 2013-02-26
    • US13177707
    • 2011-07-07
    • Tsuyoshi YamamotoMasakiyo SumitomoHitoshi YamaguchiNozomu AkagiYuma Kagata
    • Tsuyoshi YamamotoMasakiyo SumitomoHitoshi YamaguchiNozomu AkagiYuma Kagata
    • H01L21/336
    • H01L29/7813H01L29/0623H01L29/0634H01L29/0696H01L29/1095H01L29/66734H01L29/7811
    • A semiconductor device includes: a substrate; multiple first and second conductive type regions on the substrate for providing a super junction structure; a channel layer on the super junction structure; a first conductive type layer in the channel layer; a contact second conductive type region in the channel layer; a gate electrode on the channel layer via a gate insulation film; a surface electrode on the channel layer; a backside electrode on the substrate opposite to the super junction structure; and an embedded second conductive type region. The embedded second conductive type region is disposed in a corresponding second conductive type region, protrudes into the channel layer, and contacts the contact second conductive type region. The embedded second conductive type region has an impurity concentration higher than the channel layer, and has a maximum impurity concentration at a position in the corresponding second conductive type region.
    • 半导体器件包括:衬底; 用于提供超结结构的衬底上的多个第一和第二导电类型区域; 超级结结构上的沟道层; 沟道层中的第一导电类型层; 沟道层中的接触第二导电类型区域; 通过栅极绝缘膜在沟道层上形成栅电极; 沟道层上的表面电极; 衬底上的与超结结构相反的背面电极; 和嵌入式第二导电类型区域。 嵌入的第二导电类型区域设置在相应的第二导电类型区域中,突出到沟道层中,并且与接触第二导电类型区域接触。 嵌入的第二导电类型区域的杂质浓度高于沟道层,并且在相应的第二导电类型区域的位置具有最大的杂质浓度。