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    • 5. 发明授权
    • Transient gate tunneling current control
    • 瞬态栅极隧道电流控制
    • US06577178B1
    • 2003-06-10
    • US10064504
    • 2002-07-23
    • Kerry BernsteinPeter E. CottrellEdward J. NowakNorman J. RohrerDouglas W. Stout
    • Kerry BernsteinPeter E. CottrellEdward J. NowakNorman J. RohrerDouglas W. Stout
    • H03K1730
    • H03K19/00361H03K19/0948
    • A circuit includes a resistance-capacitance (RC) structure connected to a first set of transistors and a second set of transistors that perform the same logical function as the first set of transistors. The first set of transistors have thinner gate oxides than the second set of transistors. The RC structure drains an electric field from the first set of transistors, such that the first set of transistors are on only during initial transistor switching. In other words, the RC structure turns off the first set of transistors after transistor switching is completed. Also, the first set of transistors and the second set of transistors share common inputs and outputs. The first set of transistors exhibit higher tunneling currents than the second set of transistors. The thinner gate oxides of the first set of transistors cause the first set of transistors to exhibit higher device currents than the second set of transistors. The RC structure includes a capacitor connected to a gate of the first set of transistors and a resistor connected to the capacitor and to ground.
    • 电路包括连接到第一组晶体管的电阻 - 电容(RC)结构和执行与第一组晶体管相同的逻辑功能的第二组晶体管。 第一组晶体管具有比第二组晶体管更薄的栅极氧化物。 RC结构从第一组晶体管引出电场,使得第一组晶体管仅在初始晶体管切换期间导通。 换句话说,在晶体管切换完成之后,RC结构关闭第一组晶体管。 此外,第一组晶体管和第二组晶体管共享公共输入和输出。 第一组晶体管表现出比第二组晶体管更高的隧穿电流。 第一组晶体管的较薄的栅极氧化物导致第一组晶体管表现出比第二组晶体管更高的器件电流。 RC结构包括连接到第一组晶体管的栅极的电容器和连接到电容器并接地的电阻器。
    • 8. 发明授权
    • SOI radio frequency switch with enhanced electrical isolation
    • SOI射频开关具有增强的电气隔离
    • US08866226B2
    • 2014-10-21
    • US13345871
    • 2012-01-09
    • Alan B. BotulaAlvin J. JosephEdward J. NowakYun ShiJames A. Slinkman
    • Alan B. BotulaAlvin J. JosephEdward J. NowakYun ShiJames A. Slinkman
    • H01L27/12H01L21/84H01L21/762
    • H01L21/84H01L21/76264H01L27/1203
    • At least one conductive via structure is formed from an interconnect-level metal line through a middle-of-line (MOL) dielectric layer, a shallow trench isolation structure in a top semiconductor layer, and a buried insulator layer to a bottom semiconductor layer. The shallow trench isolation structure laterally abuts at least two field effect transistors that function as a radio frequency (RF) switch. The at least one conductive via structure and the at interconnect-level metal line may provide a low resistance electrical path from the induced charge layer in a bottom semiconductor layer to electrical ground, discharging the electrical charge in the induced charge layer. The discharge of the charge in the induced charge layer thus reduces capacitive coupling between the semiconductor devices and the bottom semiconductor layer, and thus secondary coupling between components electrically disconnected by the RF switch is reduced.
    • 至少一个导电通孔结构由通过中间线(MOL)电介质层的互连级金属线,顶部半导体层中的浅沟槽隔离结构和到半导体层的掩埋绝缘体层形成。 浅沟槽隔离结构横向邻接用作射频(RF)开关的至少两个场效应晶体管。 所述至少一个导电通孔结构和所述互连级金属线可以提供从底部半导体层中的感应电荷层到电接地的低电阻电路径,从而对感应电荷层中的电荷进行放电。 感应电荷层中的电荷的放电因此减小了半导体器件与底部半导体层之间的电容耦合,因此降低了由RF开关电断开的部件之间的二次耦合。