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    • 3. 发明授权
    • Transient gate tunneling current control
    • 瞬态栅极隧道电流控制
    • US06577178B1
    • 2003-06-10
    • US10064504
    • 2002-07-23
    • Kerry BernsteinPeter E. CottrellEdward J. NowakNorman J. RohrerDouglas W. Stout
    • Kerry BernsteinPeter E. CottrellEdward J. NowakNorman J. RohrerDouglas W. Stout
    • H03K1730
    • H03K19/00361H03K19/0948
    • A circuit includes a resistance-capacitance (RC) structure connected to a first set of transistors and a second set of transistors that perform the same logical function as the first set of transistors. The first set of transistors have thinner gate oxides than the second set of transistors. The RC structure drains an electric field from the first set of transistors, such that the first set of transistors are on only during initial transistor switching. In other words, the RC structure turns off the first set of transistors after transistor switching is completed. Also, the first set of transistors and the second set of transistors share common inputs and outputs. The first set of transistors exhibit higher tunneling currents than the second set of transistors. The thinner gate oxides of the first set of transistors cause the first set of transistors to exhibit higher device currents than the second set of transistors. The RC structure includes a capacitor connected to a gate of the first set of transistors and a resistor connected to the capacitor and to ground.
    • 电路包括连接到第一组晶体管的电阻 - 电容(RC)结构和执行与第一组晶体管相同的逻辑功能的第二组晶体管。 第一组晶体管具有比第二组晶体管更薄的栅极氧化物。 RC结构从第一组晶体管引出电场,使得第一组晶体管仅在初始晶体管切换期间导通。 换句话说,在晶体管切换完成之后,RC结构关闭第一组晶体管。 此外,第一组晶体管和第二组晶体管共享公共输入和输出。 第一组晶体管表现出比第二组晶体管更高的隧穿电流。 第一组晶体管的较薄的栅极氧化物导致第一组晶体管表现出比第二组晶体管更高的器件电流。 RC结构包括连接到第一组晶体管的栅极的电容器和连接到电容器并接地的电阻器。
    • 7. 发明授权
    • Method for FEOL and BEOL wiring
    • FEOL和BEOL接线方法
    • US07790611B2
    • 2010-09-07
    • US11749898
    • 2007-05-17
    • Brent A. AndersonJohn J. Ellis-MonaghanEdward J. NowakJed H. Rankin
    • Brent A. AndersonJohn J. Ellis-MonaghanEdward J. NowakJed H. Rankin
    • H01L21/44
    • H01L21/76885H01L21/76843H01L21/76844H01L21/76867H01L21/76895H01L28/91H01L2924/0002H01L2924/00
    • A method for forming a conductive structure of sub-lithographic dimension suitable for FEOL and BEOL semiconductor fabrication applications. The method includes forming a topographic feature of silicon-containing material on a substrate; forming a dielectric cap on the topographic feature; applying a mask structure to expose a pattern on a sidewall of the topographic feature, the exposed pattern corresponding to a conductive structure to be formed; depositing a metal at the exposed portions of the sidewall and forming one or more metal silicide conductive structures at the exposed sidewall portions; removing the dielectric cap layer; and removing the silicon-containing topographic feature. The result is the formation of one or more metal silicide conductor structures formed for a single lithographically defined feature. In example embodiments, the formed metal silicide conductive structures have a high aspect ratio, e.g., ranging from 1:1 to 20:1 (height to width dimension).
    • 一种用于形成适用于FEOL和BEOL半导体制造应用的亚光刻尺寸的导电结构的方法。 该方法包括在衬底上形成含硅材料的形貌特征; 在地形特征上形成介电帽; 施加掩模结构以暴露所述地形特征的侧壁上的图案,所述暴露图案对应于要形成的导电结构; 在所述侧壁的暴露部分处沉积金属并在所述暴露的侧壁部分处形成一个或多个金属硅化物导电结构; 去除所述电介质盖层; 并去除含硅的地形特征。 结果是形成一个或多个金属硅化物导体结构,其形成用于单个光刻定义的特征。 在示例性实施例中,形成的金属硅化物导电结构具有高纵横比,例如从1:1至20:1(高度与宽度尺寸)。
    • 9. 发明申请
    • IMAGERS HAVING ELECTRICALLY ACTIVE OPTICAL ELEMENTS
    • 具有电动活性光学元件的图像
    • US20090065834A1
    • 2009-03-12
    • US11850798
    • 2007-09-06
    • Brent A. AndersonJohn J. Ellis-MonaghanEdward J. Nowak
    • Brent A. AndersonJohn J. Ellis-MonaghanEdward J. Nowak
    • H01L27/146
    • H01L27/14636H01L27/14625
    • A CMOS image sensor comprising an array of active pixel cells. Each active pixel cell includes a substrate; a photosensing device formed at or below a substrate surface for collecting charge carriers in response to incident light; and, one or more light transmissive conductive wire structures formed above the photosensing device, the one or more conductive wire structures being located in an optical path above the photosensing device. The formed light transmissive conductive wire structures provide both an electrical and optical functions. An optical function is provided by tailoring the thickness of the conductive wire layer to filter light according to a pixel color scheme. Alternately, the light transmissive conductive wire structures may be formed as a microlens structure providing a light focusing function. Electrical functions for the conductive wire layer include use as a capacitor plate, as a resistor or as an interconnect.
    • 一种包括有源像素单元阵列的CMOS图像传感器。 每个有源像素单元包括衬底; 形成在基板表面处或下方的光敏装置,用于响应于入射光收集电荷载体; 以及形成在光敏器件上方的一个或多个透光导线结构,所述一个或多个导电线结构位于光敏器件上方的光路中。 形成的透光导线结构提供电和光学功能。 通过根据像素配色方案调整导线层的厚度以过滤光,提供光学功能。 或者,透光导线结构可以形成为提供光聚焦功能的微透镜结构。 用于导线层的电气功能包括用作电容器板,电阻器或互连件。
    • 10. 发明申请
    • Method for FEOL and BEOL Wiring
    • FEOL和BEOL接线方法
    • US20080284021A1
    • 2008-11-20
    • US11749898
    • 2007-05-17
    • Brent A. AndersonJohn J. Ellis-MonaghanEdward J. NowakJed H. Rankin
    • Brent A. AndersonJohn J. Ellis-MonaghanEdward J. NowakJed H. Rankin
    • H01L21/44H01L23/48
    • H01L21/76885H01L21/76843H01L21/76844H01L21/76867H01L21/76895H01L28/91H01L2924/0002H01L2924/00
    • A method for forming a conductive structure of sub-lithographic dimension suitable for FEOL and BEOL semiconductor fabrication applications. The method includes forming a topographic feature of silicon-containing material on a substrate; forming a dielectric cap on the topographic feature; applying a mask structure to expose a pattern on a sidewall of the topographic feature, the exposed pattern corresponding to a conductive structure to be formed; depositing a metal at the exposed portions of the sidewall and forming one or more metal silicide conductive structures at the exposed sidewall portions; removing the dielectric cap layer; and removing the silicon-containing topographic feature. The result is the formation of one or more metal silicide conductor structures formed for a single lithographically defined feature. In example embodiments, the formed metal silicide conductive structures have a high aspect ratio, e.g., ranging from 1:1 to 20:1 (height to width dimension).
    • 一种用于形成适用于FEOL和BEOL半导体制造应用的亚光刻尺寸的导电结构的方法。 该方法包括在衬底上形成含硅材料的形貌特征; 在地形特征上形成介电帽; 施加掩模结构以暴露所述地形特征的侧壁上的图案,所述暴露图案对应于要形成的导电结构; 在所述侧壁的暴露部分处沉积金属并在所述暴露的侧壁部分处形成一个或多个金属硅化物导电结构; 去除所述电介质盖层; 并去除含硅的地形特征。 结果是形成一个或多个金属硅化物导体结构,其形成用于单个光刻定义的特征。 在示例性实施例中,形成的金属硅化物导电结构具有高纵横比,例如从1:1至20:1(高度与宽度尺寸)。