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    • 4. 发明授权
    • Low-power DC voltage generator system
    • US06337595B1
    • 2002-01-08
    • US09627599
    • 2000-07-28
    • Louis L. HsuRajiv V. JoshiRussell J. HoughtonWayne F. EllisJeffrey H. Dreibelbis
    • Louis L. HsuRajiv V. JoshiRussell J. HoughtonWayne F. EllisJeffrey H. Dreibelbis
    • G05F302
    • G05F3/265
    • A low-voltage, low-power DC voltage generator system is provided having two negative voltage pump circuits for generating voltages for operating negative wordline and substrate bias charge pump circuits, a reference generator for generating a reference voltage, and a two-stage cascaded positive pump system having a first stage pump circuit and a second stage pump circuit. The first stage converts a supply voltage to a higher voltage level, e.g., one volt to 1.5 volts, to be used for I/O drivers, and the second stage converts the output voltage from the first stage to a higher voltage level, e.g., from 1.5 volts to about 2.5 volts, for operating a boost wordline charge pump circuit. The DC voltage generator system further includes a micro pump circuit for providing a voltage level which is greater than one-volt to be used as reference voltages, even when an operating voltage of the DC voltage generator system is at or near one-volt. A one-volt negative voltage pump circuit is also included for pumping the voltages of at least one corresponding charge pump circuit, even when an operating voltage of the DC generator system is at or near one-volt. The DC voltage generator system is specifically designed to be implemented within battery-operated devices having at least one memory unit. The low-power consumption feature of the DC voltage generator system extends battery lifetime and data retention time of the cells of the at least one memory unit.
    • 6. 发明授权
    • Low-power DC voltage generator system
    • US06507237B2
    • 2003-01-14
    • US10039874
    • 2002-01-03
    • Louis L. HsuRajiv V. JoshiRussell J. HoughtonWayne F. EllisJeffrey H. Dreibelbis
    • Louis L. HsuRajiv V. JoshiRussell J. HoughtonWayne F. EllisJeffrey H. Dreibelbis
    • G05F110
    • G05F3/265
    • A low-voltage, low-power DC voltage generator system is provided having two negative voltage pump circuits for generating voltages for operating negative wordline and substrate bias charge pump circuits, a reference generator for generating a reference voltage, and a two-stage cascaded positive pump system having a first stage pump circuit and a second stage pump circuit. The first stage converts a supply voltage to a higher voltage level, e.g., one volt to 1.5 volts, to be used for I/O drivers, and the second stage converts the output voltage from the first stage to a higher voltage level, e.g., from 1.5 volts to about 2.5 volts, for operating a boost wordline charge pump circuit. The DC voltage generator system further includes a micro pump circuit for providing a voltage level which is greater than one-volt to be used as reference voltages, even when an operating voltage of the DC voltage generator system is at or near one-volt. A one-volt negative voltage pump circuit is also included for pumping the voltages of at least one corresponding charge pump circuit, even when an operating voltage of the DC generator system is at or near one-volt. The DC voltage generator system is specifically designed to be implemented within battery-operated devices having at least one memory unit. The low-power consumption feature of the DC voltage generator system extends battery lifetime and data retention time of the cells of the at least one memory unit.
    • 8. 发明授权
    • Air channel interconnects for 3-D integration
    • 空气通道互连用于3-D集成
    • US08198174B2
    • 2012-06-12
    • US12536176
    • 2009-08-05
    • Louis L. HsuBrian L. JiFei LiuConal E. Murray
    • Louis L. HsuBrian L. JiFei LiuConal E. Murray
    • H01L21/44
    • H01L23/467H01L21/76898H01L23/481H01L25/0657H01L25/50H01L2225/06513H01L2225/06541H01L2225/06589H01L2924/0002H01L2924/00
    • A three-dimensional (3D) chip stack structure and method of fabricating the structure thereof are provided. The 3D chip stack structure includes a plurality of vertically stacked chips which are interconnected and bonded together, wherein each of the vertically stacked chips include one or more IC device strata. The 3D chip stack structure further includes an air channel interconnect network embedded within the chip stack structure, and wherein the air channel interconnect network is formed in between at least two wafers bonded to each other of the vertically stacked wafers and in between at least two bonded wafers of the vertically stacked wafers at a bonding interface thereof. In addition, the 3D chip stack structure further includes one or more openings in a peripheral region of the chip stack structure that lead into and out of the air channel interconnect network, so that air can flow into and out of the air channel interconnect network through the one or more openings to remove heat from the chip stack structure.
    • 提供三维(3D)芯片堆叠结构及其结构的制造方法。 3D芯片堆叠结构包括互连并结合在一起的多个垂直堆叠的芯片,其中每个垂直堆叠的芯片包括一个或多个IC器件层。 3D芯片堆叠结构还包括嵌入在芯片堆叠结构内的空气通道互连网络,并且其中空气通道互连网络形成在至少两个晶片之间,所述至少两个晶片彼此接合在垂直堆叠的晶片之间,并且在至少两个结合 在其接合界面处的垂直堆叠的晶片的晶片。 此外,3D芯片堆叠结构还包括在芯片堆叠结构的外围区域中的一个或多个开口,其引入和流出空气通道互连网络,使得空气可以流入和流出空气通道互连网络,通过 一个或多个开口以从芯片堆叠结构移除热量。
    • 10. 发明授权
    • Content addressable memory having reduced power consumption
    • 内容可寻址存储器具有降低的功耗
    • US07216284B2
    • 2007-05-08
    • US10145018
    • 2002-05-15
    • Louis L. HsuBrian L. JiLi-Kong Wang
    • Louis L. HsuBrian L. JiLi-Kong Wang
    • G11C29/00
    • G11C15/04G11C15/043
    • A content addressable memory (CAM). A data portion of the CAM array includes word data storage. Each word line includes CAM cells (dynamic or static) in the data portion and a common word match line. An error correction (e.g., parity) portion of the CAM array contains error correction cells for each word line. Error correction cells at each word line are connected to an error correction match line. A match on an error correction match line enables precharging a corresponding data match line. Only data on word lines with a corresponding match on an error correction match line are included in a data compare. Precharge power is required only for a fraction (inversely exponentially proportional to the bit length of error correction employed) of the full array.
    • 内容可寻址存储器(CAM)。 CAM阵列的数据部分包括字数据存储。 每个字线包括数据部分中的CAM单元(动态或静态)和公共字匹配线。 CAM阵列的纠错(例如,奇偶校验)部分包含每个字线的纠错单元。 每个字线处的误差校正单元连接到纠错匹配线。 纠错匹配线上的匹配可以对相应的数据匹配线进行预充电。 在数据比较中仅包括在纠错匹配行上具有对应匹配的字线上的数据。 预充电功率只需要一个分数(与所使用的误差校正的位长度成反比成正比)的整数组。