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    • 1. 发明授权
    • Low-power DC voltage generator system
    • US06337595B1
    • 2002-01-08
    • US09627599
    • 2000-07-28
    • Louis L. HsuRajiv V. JoshiRussell J. HoughtonWayne F. EllisJeffrey H. Dreibelbis
    • Louis L. HsuRajiv V. JoshiRussell J. HoughtonWayne F. EllisJeffrey H. Dreibelbis
    • G05F302
    • G05F3/265
    • A low-voltage, low-power DC voltage generator system is provided having two negative voltage pump circuits for generating voltages for operating negative wordline and substrate bias charge pump circuits, a reference generator for generating a reference voltage, and a two-stage cascaded positive pump system having a first stage pump circuit and a second stage pump circuit. The first stage converts a supply voltage to a higher voltage level, e.g., one volt to 1.5 volts, to be used for I/O drivers, and the second stage converts the output voltage from the first stage to a higher voltage level, e.g., from 1.5 volts to about 2.5 volts, for operating a boost wordline charge pump circuit. The DC voltage generator system further includes a micro pump circuit for providing a voltage level which is greater than one-volt to be used as reference voltages, even when an operating voltage of the DC voltage generator system is at or near one-volt. A one-volt negative voltage pump circuit is also included for pumping the voltages of at least one corresponding charge pump circuit, even when an operating voltage of the DC generator system is at or near one-volt. The DC voltage generator system is specifically designed to be implemented within battery-operated devices having at least one memory unit. The low-power consumption feature of the DC voltage generator system extends battery lifetime and data retention time of the cells of the at least one memory unit.
    • 2. 发明授权
    • Low-power DC voltage generator system
    • US06507237B2
    • 2003-01-14
    • US10039874
    • 2002-01-03
    • Louis L. HsuRajiv V. JoshiRussell J. HoughtonWayne F. EllisJeffrey H. Dreibelbis
    • Louis L. HsuRajiv V. JoshiRussell J. HoughtonWayne F. EllisJeffrey H. Dreibelbis
    • G05F110
    • G05F3/265
    • A low-voltage, low-power DC voltage generator system is provided having two negative voltage pump circuits for generating voltages for operating negative wordline and substrate bias charge pump circuits, a reference generator for generating a reference voltage, and a two-stage cascaded positive pump system having a first stage pump circuit and a second stage pump circuit. The first stage converts a supply voltage to a higher voltage level, e.g., one volt to 1.5 volts, to be used for I/O drivers, and the second stage converts the output voltage from the first stage to a higher voltage level, e.g., from 1.5 volts to about 2.5 volts, for operating a boost wordline charge pump circuit. The DC voltage generator system further includes a micro pump circuit for providing a voltage level which is greater than one-volt to be used as reference voltages, even when an operating voltage of the DC voltage generator system is at or near one-volt. A one-volt negative voltage pump circuit is also included for pumping the voltages of at least one corresponding charge pump circuit, even when an operating voltage of the DC generator system is at or near one-volt. The DC voltage generator system is specifically designed to be implemented within battery-operated devices having at least one memory unit. The low-power consumption feature of the DC voltage generator system extends battery lifetime and data retention time of the cells of the at least one memory unit.
    • 5. 发明授权
    • Structures for wafer level test and burn-in
    • 晶圆级测试和老化的结构
    • US06233184B1
    • 2001-05-15
    • US09191954
    • 1998-11-13
    • John E. BarthClaude L. BertinJeffrey H. DreibelbisWayne F. EllisWayne J. HowellErik L. HedbergHoward L. KalterWilliam R. TontiDonald L. Wheater
    • John E. BarthClaude L. BertinJeffrey H. DreibelbisWayne F. EllisWayne J. HowellErik L. HedbergHoward L. KalterWilliam R. TontiDonald L. Wheater
    • G11C2900
    • G01R31/2855G01R31/2806G01R31/2831G01R31/31905H01L2224/05624H01L2224/13H01L2224/45144H01L2224/45147H01L2924/00014
    • Wafer test and burn-in is accomplished with state machine or programmable test engines located on the wafer being tested. Each test engine requires less than 10 connections and each test engine can be connected to a plurality of chips, such as a row or a column of chips on the wafer. Thus, the number of pads of the wafer that must be connected for test is substantially reduced while a large degree of parallel testing is still provided. The test engines also permit on-wafer allocation of redundancy in parallel so that failing chips can be repaired after burn-in is complete. In addition, the programmable test engines can have their code altered so test programs can be modified to account for new information after the wafer has been fabricated. The test engines are used during burn-in to provide high frequency write signals to DRAM arrays that provide a higher effective voltage to the arrays, lowering the time required for burn-in. Connections to the wafer and between test engines and chips are provided along a membrane attached to the wafer. Membrane connectors can be formed or opened after the membrane is connected to the wafer so shorted chips can be disconnected. Preferably the membrane remains on the wafer after test, burn-in and dicing to provide a chip scale package. Thus, the very high cost of TCE matched materials, such as glass ceramic contactors, for wafer burn-in is avoided while providing benefit beyond test and burn-in for packaging.
    • 晶圆测试和老化是通过位于被测晶片上的状态机或可编程测试引擎完成的。 每个测试引擎需要少于10个连接,并且每个测试引擎可以连接到多个芯片,例如晶片上的行或一列芯片。 因此,仍然提供必须连接用于测试的晶片的焊盘数量,同时还提供大量的并行测试。 测试引擎还允许并行的片上分配冗余,以便在老化完成后可以修复故障的芯片。 此外,可编程测试引擎可以对其代码进行更改,因此可以修改测试程序以在晶圆制造之后考虑新的信息。 在老化期间使用测试引擎向DRAM阵列提供高频写入信号,为阵列提供更高的有效电压,从而降低老化所需的时间。 沿着连接到晶片的膜提供与晶片和测试引擎与芯片之间的连接。 膜连接器可以在膜连接到晶片之后形成或打开,因此短路芯片可以断开。 优选地,膜在测试之后保留在晶片上,老化和切割以提供芯片级封装。 因此,避免了TCE匹配材料(例如玻璃陶瓷接触器)用于晶片老化的非常高的成本,同时提供超出测试和包装封装的优点。
    • 6. 发明授权
    • Structures for wafer level test and burn-in
    • 晶圆级测试和老化的结构
    • US06426904B2
    • 2002-07-30
    • US09803500
    • 2001-03-09
    • John E. BarthClaude L. BertinJeffrey H. DreibelbisWayne F. EllisWayne J. HowellErik L. HedbergHoward L. KalterWilliam R. TontiDonald L. Wheater
    • John E. BarthClaude L. BertinJeffrey H. DreibelbisWayne F. EllisWayne J. HowellErik L. HedbergHoward L. KalterWilliam R. TontiDonald L. Wheater
    • G11C2900
    • G01R31/2855G01R31/2806G01R31/2831G01R31/31905H01L2224/05624H01L2224/13H01L2224/45144H01L2224/45147H01L2924/00014
    • Wafer test and burn-in is accomplished with state machine or programmable test engines located on the wafer being tested. Each test engine requires less than 10 connections and each test engine can be connected to a plurality of chips, such as a row or a column of chips on the wafer. Thus, the number of pads of the wafer that must be connected for test is substantially reduced while a large degree of parallel testing is still provided. The test engines also permit on-wafer allocation of redundancy in parallel so that failing chips can be repaired after burn-in is complete. In addition, the programmable test engines can have their code altered so test programs can be modified to account for new information after the wafer has been fabricated. The test engines are used during burn-in to provide high frequency write signals to DRAM arrays that provide a higher effective voltage to the arrays, lowering the time required for burn-in. Connections to the wafer and between test engines and chips are provided along a membrane attached to the wafer. Membrane connectors can be formed or opened after the membrane is connected to the wafer so shorted chips can be disconnected. Preferably the membrane remains on the wafer after test, burn-in and dicing to provide a chip scale package. Thus, the very high cost of TCE matched materials, such as glass ceramic contactors, for wafer burn-in is avoided while providing benefit beyond test and burn-in for packaging.
    • 晶圆测试和老化是通过位于被测晶片上的状态机或可编程测试引擎完成的。 每个测试引擎需要少于10个连接,并且每个测试引擎可以连接到多个芯片,例如晶片上的行或一列芯片。 因此,仍然提供必须连接用于测试的晶片的焊盘数量,同时还提供大量的并行测试。 测试引擎还允许并行的片上分配冗余,以便在老化完成后可以修复故障的芯片。 此外,可编程测试引擎可以对其代码进行更改,因此可以修改测试程序以在晶圆制造之后考虑新的信息。 在老化期间使用测试引擎向DRAM阵列提供高频写入信号,为阵列提供更高的有效电压,从而降低了老化所需的时间。 沿着连接到晶片的膜提供与晶片和测试引擎与芯片之间的连接。 膜连接器可以在膜连接到晶片之后形成或打开,因此短路芯片可以断开。 优选地,膜在测试之后保留在晶片上,老化和切割以提供芯片级封装。 因此,避免了TCE匹配材料(例如玻璃陶瓷接触器)用于晶片老化的非常高的成本,同时提供超出测试和包装封装的优点。
    • 7. 发明授权
    • Power up detection circuits
    • 上电检测电路
    • US5463335A
    • 1995-10-31
    • US969594
    • 1992-10-30
    • Sridhar DivakaruniJeffrey H. DreibelbisWayne F. EllisAnatol FurmanHoward L. Kalter
    • Sridhar DivakaruniJeffrey H. DreibelbisWayne F. EllisAnatol FurmanHoward L. Kalter
    • H01L27/00H03K17/22
    • H03K17/223
    • A power up detection circuit is provided which includes a power supply terminal, an output terminal, an impedance device coupling the output terminal to the power supply terminal and a latch including a first inverter having a first device connected between the output terminal and a point of reference potential and a second device connected between the output terminal and the power supply terminal, the devices are designed so that subthreshold current passing through the first device is greater than the effective subthreshold current passing through the impedance device and the second device, and a second inverter including third and fourth devices which are designed so that a smaller subthreshold current passes through the third device than the subthreshold current passing through the fourth device. The power up circuit may further include a capacitor connected between the power supply terminal and gate electrodes of the first and second devices.
    • 提供了一种上电检测电路,其包括电源端子,输出端子,将输出端子耦合到电源端子的阻抗装置和包括第一反相器的锁存器,第一反相器具有连接在输出端子与点 参考电位和连接在输出端子和电源端子之间的第二器件,器件被设计成使得通过第一器件的亚阈值电流大于通过阻抗器件和第二器件的有效亚阈值电流,并且第二器件 逆变器包括第三和第四器件,其被设计为使得比通过第四器件的亚阈值电流更小的亚阈值电流通过第三器件。 上电电路还可以包括连接在第一和第二器件的电源端子和栅电极之间的电容器。