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1. 发明授权

US4831721A Mounting head exchange arrangement for part mounting machine 失效
标题翻译：零件安装机的安装头更换装置
公开(公告)号：US4831721A
公开(公告)日：1989-05-23
申请号：US70823
申请日：1987-07-06
申请人： Wataru Hirai , Koji Fujiwara
发明人： Wataru Hirai , Koji Fujiwara
IPC分类号： H05K13/04
CPC分类号： H05K13/0408 , Y10S414/125 , Y10S483/902 , Y10T29/5191 , Y10T29/53178 , Y10T483/19
摘要： A mounting head exchange apparatus for a part mounting machine includes a moving unit as a part mounting portion for mounting parts onto a circuit board and the like, head holding portions, and a plurality of mounting heads provided at the head holding portions. Each of the mounting heads has a suction nozzle for attracting parts, and sets of position regulating claws for effecting positioning of the attracted parts. The mounting heads provided at the holding portions are so arranged that a predetermined mounting head is selected from them and detachably mounted to the moving unit. Thus, the mounting heads each provided with the position regulating claws and the suction nozzle may be exchanged as one unit.
摘要翻译：用于零件安装机的安装头更换装置包括作为用于将部件安装到电路板等上的部件安装部分的移动单元，头部保持部分和设置在头部保持部分的多个安装头。每个安装头具有用于吸引部件的吸嘴和用于实现吸引部件的定位的一组位置调节爪。设置在保持部分的安装头被布置成从其中选择预定的安装头并且可拆卸地安装到移动单元。因此，每个设置有位置调节爪和吸嘴的安装头可以作为一个单元更换。

2. 发明授权

US5727311A Method and apparatus for mounting component 失效
标题翻译：组件安装方法和装置
公开(公告)号：US5727311A
公开(公告)日：1998-03-17
申请号：US587460
申请日：1996-01-17
申请人： Akiko Ida , Wataru Hirai , Muneyoshi Fujiwara , Osamu Okuda , Hirokazu Honkawa
发明人： Akiko Ida , Wataru Hirai , Muneyoshi Fujiwara , Osamu Okuda , Hirokazu Honkawa
IPC分类号： B23P21/00 , H05K13/00 , H05K13/02 , H05K13/04 , H05K3/30
CPC分类号： H05K13/0434 , H05K13/021 , H05K13/0408 , Y10T29/4913 , Y10T29/53178 , Y10T29/53261
摘要： A method for mounting components, includes a first step for feeding to a component feed unit a plurality of stacked-in-stages trays on which components are accommodated, a second step for taking out the components of a Top-stage tray sequentially one by one to mount them onto a board, and a third step for, when the components on the tray are exhausted, removing the empty top-stage tray, and then returning to the second step. An apparatus for mounting Components includes a component feed unit for feeding a plurality of stacked-in-stages trays on which components are accommodated, and a pickup device which can selectively hold either a component pickup nozzle or a tray transfer nozzle. The pickup device is movable between the component feed unit and a specified position of a substrate or between the component feed unit and a tray removal box. A nozzle replacement unit is provided for performing replacement of the pickup nozzle and the tray Transfer nozzle. Also, a control unit is provided for deciding whether or not a component is present on the tray, and controlling the pickup head and the nozzle replacement units in such a manner that, if a component is present, picking up the component by the pickup nozzle and placing it onto the substrate, and if no component is present, replacing the pickup nozzle with the tray transfer nozzle, and picking up the tray and removing it to the tray removal box.
摘要翻译：一种用于安装部件的方法，包括：第一步骤，用于向部件供给单元馈送多个堆叠在其中的堆叠的托盘，其上容纳有部件;第二步骤，用于逐一地取出顶级托盘的部件将它们安装到板上，第三步骤，当托盘上的部件被耗尽时，移除空的顶级托盘，然后返回到第二步骤。一种用于安装组件的装置包括：用于馈送多个堆叠在其中的层叠托盘的部件供给单元，以及可以选择性地容纳组件拾取喷嘴或托盘传送喷嘴的拾取装置。拾取装置可在部件供给单元和基板的指定位置之间或部件供给单元和托盘移除盒之间移动。提供喷嘴更换单元，用于执行拾取喷嘴和托盘传送喷嘴的更换。而且，提供一种控制单元，用于确定托盘上是否存在部件，并且以这样的方式控制拾取头和喷嘴更换单元，使得如果存在组件，则通过拾取喷嘴拾取部件并将其放置在基板上，如果不存在部件，则用托盘传送喷嘴代替拾取喷嘴，并拾取托盘并将其移除到托盘移除盒。

3. 发明授权

US07464838B2 Viscous material application apparatus 失效
标题翻译：粘性材料施用装置
公开(公告)号：US07464838B2
公开(公告)日：2008-12-16
申请号：US10800748
申请日：2004-03-16
申请人： Toshinori Mimura , Hiroshi Yamauchi , Wataru Hirai , Hiroaki Onishi , Koichi Nagai
发明人： Toshinori Mimura , Hiroshi Yamauchi , Wataru Hirai , Hiroaki Onishi , Koichi Nagai
IPC分类号： B67D5/42
CPC分类号： B05C11/1047 , B05C5/0254 , B05C11/00 , B41F15/42 , H05K3/1233 , H05K2203/0126
摘要： A viscous material application apparatus includes a main body having a pressurized chamber which connects through to a discharge port and stores a viscous material, a viscous material supply device for transferring the viscous material to the pressurized chamber, and a discharge pressure regulating device for regulating the discharge pressure of the viscous material when the viscous material inside the pressurized chamber is pressurized and discharged by increasing or decreasing the capacity of the pressurized chamber, the discharge pressure regulating device being provided either inside the pressurized chamber or facing the pressurized chamber.
摘要翻译：粘性材料施加装置包括：主体，其具有连接到排出口并且存储粘性材料的加压室，用于将粘性材料传送到加压室的粘性材料供给装置和用于调节粘性材料的排出压力调节装置当加压室内的粘性材料通过增加或减小加压室的容量而被加压和排出时，粘性物质的排出压力，排放压力调节装置设置在加压室内或面向加压室内。

4. 发明授权

US06336268B1 Electronic part mounting machine 失效
标题翻译：电子零件安装机
公开(公告)号：US06336268B1
公开(公告)日：2002-01-08
申请号：US09355749
申请日：1999-11-01
申请人： Ryoji Inutsuka , Wataru Hirai , Muneyoshi Fujiwara , Kunio Ohe , Yoshiyuki Nagai , Hideo Sakon
发明人： Ryoji Inutsuka , Wataru Hirai , Muneyoshi Fujiwara , Kunio Ohe , Yoshiyuki Nagai , Hideo Sakon
IPC分类号： H05K330
CPC分类号： H05K13/0413 , Y10T29/4913 , Y10T29/49131 , Y10T29/53178
摘要： It is an object of the invention to suck the central position of an electronic part precisely, and enhance the successful suction rate of electronic parts. To achieve the object, the central position of the suction opening 14 provided in the nozzle tip end 13 for sucking an electronic part is deviated from the central position of rotation of the nozzle tip end 13 by a specified amount, and the rotation amount of the nozzle tip end 13 and the positioning position of the part supply portion are controlled.
摘要翻译：本发明的目的是精确地吸收电子部件的中心位置，并提高电子部件的成功吸入率。为了实现该目的，设置在用于吸引电子部件的喷嘴前端13中的吸入口14的中心位置从喷嘴前端13的旋转中心位置偏离指定量，并且旋转量喷嘴前端13和部件供给部的定位位置被控制。

5. 发明授权

US5740604A Component-mounting apparatus and method 失效
标题翻译：组件安装设备和方法
公开(公告)号：US5740604A
公开(公告)日：1998-04-21
申请号：US510679
申请日：1995-08-03
申请人： Naoyuki Kitamura , Hiroshi Ohta , Muneyoshi Fujiwara , Wataru Hirai
发明人： Naoyuki Kitamura , Hiroshi Ohta , Muneyoshi Fujiwara , Wataru Hirai
IPC分类号： H05K13/00 , H05K13/04 , H05K3/30 , B23P19/00
CPC分类号： H05K13/0452 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261
摘要： A component-mounting apparatus includes a component supply mechanism for supplying components to be mounted on a circuit board, a circuit board positioning device for placing in position the circuit board on which the components are to be mounted, and a mounting head for taking out one of the components at a predetermined component take-out position of the component supply mechanism, thus mounting the component on the circuit board. The component supply mechanism includes a plurality of supply tables on which a plurality of component supply devices have been arranged at predetermined intervals, a driving device for moving the supply tables in a direction in which the component supply devices have been arranged, thus placing the desired component supply device at the predetermined component take-out position, and a table exchange device provided at one end of a movable range of the supply tables to be driven by the driving device and allow the supply tables to be placed thereon and allow positions of the desired supply table to be switched by the driving device.
摘要翻译：部件安装装置包括用于提供要安装在电路板上的部件的部件供给机构，用于将要安装部件的电路板放置在其上的电路板定位装置，以及用于取出一个在部件供给机构的预定部件取出位置处的部件，从而将部件安装在电路板上。部件供给机构包括多个供给台，多个部件供给装置以预定的间隔配置在该供给台上，驱动装置用于沿供给部件供给装置的排列方向移动供给台，零件供给装置，以及在所述供给台的可移动范围的一端设置成由所述驱动装置驱动的台面更换装置，并且允许所述供给台被放置在其上，所需供应台由驱动装置切换。

6. 发明申请

US20060053624A1 Method and equipment for mounting part 审中-公开
标题翻译：安装零件的方法和设备
公开(公告)号：US20060053624A1
公开(公告)日：2006-03-16
申请号：US10523262
申请日：2003-08-06
申请人： Takashi Maeda , Osamu Okuda , Hiroshi Uchiyama , Takashi Yazawa , Hiroaki Imagawa , Yosuke Nagasawa , Wataru Hirai , Makoto Nakashima , Naoto Kouketsu
发明人： Takashi Maeda , Osamu Okuda , Hiroshi Uchiyama , Takashi Yazawa , Hiroaki Imagawa , Yosuke Nagasawa , Wataru Hirai , Makoto Nakashima , Naoto Kouketsu
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/0409 , H05K13/082 , Y10T29/49004 , Y10T29/4913 , Y10T29/49131 , Y10T29/53174 , Y10T29/53191
摘要： The present invention is to provide a method and an apparatus for mounting components having a feature of detecting with high accuracy component pick up failure by the nozzle at component pick up stage, and/or component carrying back by the nozzle at component mounting stage. Achieved vacuum pressure is initialized to zero after completion of component pick up by the nozzle 25, and vacuum pressure decrease of the nozzle 25 is detected from the initialized zero point. If the detected value is bigger than the predetermined threshold, it may be judged that at least one of the nozzles failed to pick up a component. The failed nozzle may be identified by using a component recognition device 37. Blowing air blow volume flowing through the nozzle 25 is measured upon completion of component mounting. If the blowing air flow is smaller that the predetermined threshold, it is judged that the nozzle 25 carries back a component 30. Two thresholds may be used, and it may be judged that the component has been properly mounted if the measurement value is bigger than both thresholds, filter 22 is clogged if the measurement value is in between the two thresholds, and the nozzle 25 carries back the component if the measurement value is smaller than both thresholds.
摘要翻译：本发明提供一种用于安装部件的方法和装置，其具有在部件拾取阶段由喷嘴以高精度的部件拾取故障检测的特征，和/或在部件安装阶段由喷嘴承载的部件。在由喷嘴25完成部件拾取之后，实现真空压力初始化为零，并且从初始化的零点检测喷嘴25的真空压力降低。如果检测值大于预定阈值，则可以判断出至少一个喷嘴未能拾取部件。可以通过使用部件识别装置37来识别故障喷嘴。在部件安装完成时测量流经喷嘴25的吹气量。如果吹送空气流量小于预定阈值，则判断喷嘴25承载组件30。如果测量值大于两个阈值，则可以使用两个阈值，并且如果测量值大于两个阈值，则可以判断该部件已正确安装，如果测量值在两个阈值之间，则过滤器22被堵塞，并且喷嘴25承载如果测量值小于两个阈值，则分量。

7. 发明申请

US20050060883A1 Part mounting apparatus and part mounting method 失效
标题翻译：零件安装装置和零件安装方法
公开(公告)号：US20050060883A1
公开(公告)日：2005-03-24
申请号：US10501218
申请日：2002-09-20
申请人： Kazunobu Sakai , Makoto Nakashima , Wataru Hirai , Yasuyuki Ishitani
发明人： Kazunobu Sakai , Makoto Nakashima , Wataru Hirai , Yasuyuki Ishitani
IPC分类号： H01L21/50 , H01L21/52 , H05K13/04 , H05K13/08 , B23P19/00
CPC分类号： H05K13/041 , H05K13/0812 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： A component mounting apparatus and a component mounting method which improve an accuracy and a rate of placement of components on a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation ΔL of the component from a normal suction status is determined on the basis of component recognition information obtained from the recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding the placement of the component is controlled on basis of a magnitude of the deviation. By the control, the accuracy and rate of placement of the components on the circuit-formed member can be improved.
摘要翻译：一种部件安装装置和部件安装方法，其提高部件在电路形成部件上的准确度和放置率。在部件识别位置处识别由吸嘴吸入的部件，根据从部件的识别获得的部件识别信息来确定部件与正常吸入状态的偏差DeltaL，并且传送速度基于偏差的大小来控制组件识别之后的时间段以及组件的放置之前的时间段。通过控制，可以提高部件在电路形成部件上的配置的精度和速度。

8. 发明授权

US06839959B1 Component mounting apparatus 失效
标题翻译：组件安装设备
公开(公告)号：US06839959B1
公开(公告)日：2005-01-11
申请号：US09959756
申请日：2000-05-01
申请人： Naoto Hosotani , Youichi Nakamura , Wataru Hirai , Kunio Sakurai
发明人： Naoto Hosotani , Youichi Nakamura , Wataru Hirai , Kunio Sakurai
IPC分类号： H01L21/00 , H01L21/683 , H05K13/04 , H05K3/30
CPC分类号： H01L21/67144 , H05K13/0409 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/53091 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process time by performing picking up, delivering and receiving of components between heads, and mounting of the components onto the circuit board in parallel. A plurality of reverse-supply heads are mounted on a component supply holder for performing indexing rotation, while a plurality of mounting heads are mounted on a component mounting holder for performing indexing rotation in synchronization with the indexing rotation of the component supply holder. By (i) picking up an electronic component, (ii) delivering the electronic component from the reverse-supply head to the mounting head, and (iii) mounting the electronic component onto the circuit board at prescribed positions, operations from (i) to (iii) can be carried out in parallel. Thus, the electronic components can be mounted onto the circuit board in a short process time.
摘要翻译：公开了一种用于安装电子部件的装置，电子部件可以通过其在头部之间的拾取，传送和接收以及头部之间的部件的拾取，传送和接收而在短时间内上下颠倒并安装到电路板上的组件并联到电路板上。多个反向供给头安装在用于进行转位旋转的部件供给保持器上，同时多个安装头安装在与部件供应保持器的分度旋转同步的分度旋转的部件安装保持器上。通过（i）拾取电子元件，（ii）将电子元件从反向供给头传送到安装头，以及（iii）将电子元件安装在电路板上的规定位置，操作从（i）到（iii）可以并行进行。因此，电子部件可以在短的处理时间内安装到电路板上。

9. 发明授权

US06736291B1 Viscous material application apparatus 失效
标题翻译：粘性材料施用装置
公开(公告)号：US06736291B1
公开(公告)日：2004-05-18
申请号：US09926588
申请日：2001-11-21
申请人： Toshinori Mimura , Hiroshi Yamauchi , Wataru Hirai , Hiroaki Onishi , Koichi Nagai
发明人： Toshinori Mimura , Hiroshi Yamauchi , Wataru Hirai , Hiroaki Onishi , Koichi Nagai
IPC分类号： B67D556
CPC分类号： B05C11/1047 , B05C5/0254 , B05C11/00 , B41F15/42 , H05K3/1233 , H05K2203/0126
摘要： A viscous material application apparatus includes a main body having a pressurized chamber which connects through to a discharge port and stores a viscous material, a viscous material supply device for transferring the viscous material to the pressurized chamber, and a discharge pressure regulating device for regulating the discharge pressure of the viscous material when the viscous material inside the pressurized chamber is pressurized and discharged by increasing or decreasing the capacity of the pressurized chamber, the discharge pressure regulating device being provided either inside the pressurized chamber or facing the pressurized chamber.
摘要翻译：粘性材料施加装置包括：主体，其具有连接到排出口并且存储粘性材料的加压室，用于将粘性材料传送到加压室的粘性材料供给装置和用于调节粘性材料的排出压力调节装置当加压室内的粘性材料通过增加或减小加压室的容量而被加压和排出时，粘性物质的排出压力，排放压力调节装置设置在加压室内或面向加压室内。

10. 发明授权

US5850689A Method and apparatus for supporting printed board 失效
标题翻译：支撑印刷电路板的方法和装置
公开(公告)号：US5850689A
公开(公告)日：1998-12-22
申请号：US586314
申请日：1996-01-17
申请人： Seiichi Mogi , Wataru Hirai , Muneyoshi Fujiwara , Osamu Okuda , Hirokazu Honkawa
发明人： Seiichi Mogi , Wataru Hirai , Muneyoshi Fujiwara , Osamu Okuda , Hirokazu Honkawa
IPC分类号： B23P19/00 , H05K13/00 , H05K13/04 , H05K3/30
CPC分类号： H05K13/0061 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178 , Y10T29/53261
摘要： A method for supporting a printed board. Includes a first step of conveying to a specified position by a conveying a printed board having a first reference hole and a second reference hole device a for setting a position and posture thereof. A second step stops the conveyed printed board at the specified position with a stop member. A third step inserts a first reference pin provided at the specified position into the first reference hole of the stopped printed board. A fourth step inserts a second reference pin into the second reference hole of the printed board. The second reference pin is movable in parallel to a mounting surface of the printed board and in any arbitrary direction relative to the first reference pin. A fifth step pinches the printed board to hold the position and posture thereof of a holding device with the first reference pin and the second reference pin both inserted. A sixth step draws out, after the fifth step, at least one reference pin of the first reference pin and the second reference pin from its corresponding reference hole. A seventh step mounts after the sixth step, an electronic component onto the printed board under the control of a control unit.
摘要翻译：一种用于支撑印刷电路板的方法。包括通过输送具有第一参考孔的印刷电路板和用于设定其位置和姿势的第二参考孔装置a来输送到指定位置的第一步骤。第二步将停止部件的输送印刷板停留在指定位置。第三步将设置在指定位置的第一基准销插入已停止的印刷电路板的第一基准孔中。第四步骤将第二参考销插入到印刷电路板的第二参考孔中。第二参考销可平行于印刷电路板的安装表面并相对于第一参考销在任意任意方向上移动。第五步骤夹住印刷板以保持其中插入有第一参考销和第二参考销的保持装置的位置和姿势。在第五步骤之后，第六步骤从其相应的参考孔至少引出第一参考引脚和第二参考引脚的参考引脚。在第六步骤之后，在控制单元的控制下，将电子部件安装到印刷电路板上。

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