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1. 发明授权

US06736291B1 Viscous material application apparatus 失效
标题翻译：粘性材料施用装置
公开(公告)号：US06736291B1
公开(公告)日：2004-05-18
申请号：US09926588
申请日：2001-11-21
申请人： Toshinori Mimura , Hiroshi Yamauchi , Wataru Hirai , Hiroaki Onishi , Koichi Nagai
发明人： Toshinori Mimura , Hiroshi Yamauchi , Wataru Hirai , Hiroaki Onishi , Koichi Nagai
IPC分类号： B67D556
CPC分类号： B05C11/1047 , B05C5/0254 , B05C11/00 , B41F15/42 , H05K3/1233 , H05K2203/0126
摘要： A viscous material application apparatus includes a main body having a pressurized chamber which connects through to a discharge port and stores a viscous material, a viscous material supply device for transferring the viscous material to the pressurized chamber, and a discharge pressure regulating device for regulating the discharge pressure of the viscous material when the viscous material inside the pressurized chamber is pressurized and discharged by increasing or decreasing the capacity of the pressurized chamber, the discharge pressure regulating device being provided either inside the pressurized chamber or facing the pressurized chamber.
摘要翻译：粘性材料施加装置包括：主体，其具有连接到排出口并且存储粘性材料的加压室，用于将粘性材料传送到加压室的粘性材料供给装置和用于调节粘性材料的排出压力调节装置当加压室内的粘性材料通过增加或减小加压室的容量而被加压和排出时，粘性物质的排出压力，排放压力调节装置设置在加压室内或面向加压室内。

2. 发明授权

US07464838B2 Viscous material application apparatus 失效
标题翻译：粘性材料施用装置
公开(公告)号：US07464838B2
公开(公告)日：2008-12-16
申请号：US10800748
申请日：2004-03-16
申请人： Toshinori Mimura , Hiroshi Yamauchi , Wataru Hirai , Hiroaki Onishi , Koichi Nagai
发明人： Toshinori Mimura , Hiroshi Yamauchi , Wataru Hirai , Hiroaki Onishi , Koichi Nagai
IPC分类号： B67D5/42
CPC分类号： B05C11/1047 , B05C5/0254 , B05C11/00 , B41F15/42 , H05K3/1233 , H05K2203/0126
摘要： A viscous material application apparatus includes a main body having a pressurized chamber which connects through to a discharge port and stores a viscous material, a viscous material supply device for transferring the viscous material to the pressurized chamber, and a discharge pressure regulating device for regulating the discharge pressure of the viscous material when the viscous material inside the pressurized chamber is pressurized and discharged by increasing or decreasing the capacity of the pressurized chamber, the discharge pressure regulating device being provided either inside the pressurized chamber or facing the pressurized chamber.
摘要翻译：粘性材料施加装置包括：主体，其具有连接到排出口并且存储粘性材料的加压室，用于将粘性材料传送到加压室的粘性材料供给装置和用于调节粘性材料的排出压力调节装置当加压室内的粘性材料通过增加或减小加压室的容量而被加压和排出时，粘性物质的排出压力，排放压力调节装置设置在加压室内或面向加压室内。

3. 发明授权

US06772937B2 Method and apparatus for applying viscous material 失效
标题翻译：用于粘贴材料的方法和装置
公开(公告)号：US06772937B2
公开(公告)日：2004-08-10
申请号：US09840073
申请日：2001-04-24
申请人： Toshinori Mimura , Hiroaki Onishi , Hiroshi Yamauchi , Toshiaki Yamauchi , Jun Shirai , Yoshiyuki Nagai , Muneyoshi Fujiwara
发明人： Toshinori Mimura , Hiroaki Onishi , Hiroshi Yamauchi , Toshiaki Yamauchi , Jun Shirai , Yoshiyuki Nagai , Muneyoshi Fujiwara
IPC分类号： B23K3102
CPC分类号： H05K3/1233 , B23K3/0607 , H05K2203/0126
摘要： By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material feeding device with a pressure smaller than the discharge pressure imparted by the discharge-pressure adjusting device.
摘要翻译：通过使用具有：用于粘性材料的储存室的应用单元; 用于粘性材料的排出孔设置成与储存室连通，其中用于将粘性材料供给到储存室的粘性材料供给装置联接到施加单元; 以及用于对存储在存储室中的粘性材料施加排出压力的排出压力调节装置，具有与施加对象或应用对象本身对应的开口的屏幕掩模和施加单元的排出孔与彼此之间，应用单元和屏幕掩模或应用单元和应用对象相对于彼此移动，同时将排出压力赋予存储室中的粘性材料，并且将粘性材料施加到施加物体上同时通过粘性材料供给装置一直用粘性材料补充储存室，其压力小于由排出压力调节装置施加的排出压力。

4. 发明授权

US06923117B1 Solder paste printing apparatus and printing method 有权
公开(公告)号：US06923117B1
公开(公告)日：2005-08-02
申请号：US10031852
申请日：2000-07-25
申请人： Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
发明人： Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
IPC分类号： B41F15/46 , H05K1/02 , H05K3/00 , H05K3/12 , H05K3/26 , B41F15/03 , B41F15/42
CPC分类号： B41F15/46 , H05K1/0269 , H05K3/0008 , H05K3/1216 , H05K3/1233 , H05K3/26 , H05K2201/09918 , H05K2203/0139 , H05K2203/0278 , H05K2203/082 , H05K2203/163 , H05K2203/167
摘要： When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

5. 发明授权

US5693559A Method for printing solder paste 失效
标题翻译：焊膏印刷方法
公开(公告)号：US5693559A
公开(公告)日：1997-12-02
申请号：US631021
申请日：1996-04-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , H01L21/48
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的方法，所述方法包括以一个方向移动印刷电路板和屏蔽掩模板之一的步骤：在印刷焊膏之后与另一个分离，并且直到印刷电路板和屏蔽掩模板上移动的一个到达屏幕掩模板和印刷电路板之前的位置的板分离位置是完全的并且当印刷电路板和屏蔽掩模板中的移动的一个到达分隔位置时，将第一移动速度改变到高于第一移动速度的第二移动速度。

6. 发明授权

US07032513B2 Printing screen cleaning method and apparatus 失效
标题翻译：印刷丝网清洗方法和装置
公开(公告)号：US07032513B2
公开(公告)日：2006-04-25
申请号：US10641016
申请日：2003-08-15
申请人： Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
发明人： Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
IPC分类号： B41F35/00 , B41L41/00
CPC分类号： B41F15/46 , H05K1/0269 , H05K3/0008 , H05K3/1216 , H05K3/1233 , H05K3/26 , H05K2201/09918 , H05K2203/0139 , H05K2203/0278 , H05K2203/082 , H05K2203/163 , H05K2203/167
摘要： A printing screen cleaning apparatus and a method for cleaning a printing screen by employing the cleaning apparatus which includes a cleaning head having a wiping member and a backup member for sucking the paste via a wiping member while sliding the wiping member on a lower surface of the printing screen. The backup member includes a suction port provided in a suction region of a backup surface of the backup member. The backup member also has a groove that extends parallel to the suction region and approximately perpendicular to the sliding direction of the wiping member. The groove partially releases the backup of the wiping member.
摘要翻译：一种印刷丝网清洁装置和一种通过采用清洁装置来清洁印刷丝网的方法，所述清洁装置包括具有擦拭部件的清洁头和用于通过擦拭部件吸附膏体的支撑部件，同时沿着所述擦拭部件的下表面滑动擦拭部件印刷屏幕。支撑构件包括设置在支撑构件的支撑表面的吸入区域中的吸入口。支撑构件还具有平行于吸入区域并且大致垂直于擦拭构件的滑动方向延伸的凹槽。凹槽部分地释放擦拭构件的支撑。

7. 发明授权

US06935232B2 Solder paste printing apparatus and printing method 有权
标题翻译：焊膏印刷装置及印刷方法
公开(公告)号：US06935232B2
公开(公告)日：2005-08-30
申请号：US10641082
申请日：2003-08-15
申请人： Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
发明人： Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
IPC分类号： B41F15/46 , H05K1/02 , H05K3/00 , H05K3/12 , H05K3/26 , B05C17/06 , B05C17/08 , B41L13/00 , B41M1/12
CPC分类号： B41F15/46 , H05K1/0269 , H05K3/0008 , H05K3/1216 , H05K3/1233 , H05K3/26 , H05K2201/09918 , H05K2203/0139 , H05K2203/0278 , H05K2203/082 , H05K2203/163 , H05K2203/167
摘要： When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.
摘要翻译：当焊膏在焊膏印刷期间通过位于加压构件和印刷掩模之间的第一间隙时，从加压构件向焊膏施加朝向印刷掩模的压力。

8. 发明授权

US5735203A Apparatus for printing solder paste to a printed circuit board and separating a screen mask plate from the printed circuit board 失效
标题翻译：用于将焊膏印刷到印刷电路板并将屏蔽掩模板与印刷电路板分离的装置
公开(公告)号：US5735203A
公开(公告)日：1998-04-07
申请号：US762872
申请日：1996-12-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , B41F15/26
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： An apparatus for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee. The apparatus includes a device for moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and a controller for changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的设备。该装置包括：在印刷焊膏之后，以与第一移动速度相对应的方向移动印刷电路板和屏蔽掩模板中的一个的装置，并且直到移动的印刷电路板屏幕掩模板到达位于屏幕掩模板之前的位置和印刷电路板完全分离的平板分离位置，以及控制器，用于将第一移动速度改变为高于当移动的印刷电路板和屏幕掩模板之一到达平板分离位置时的第一移动速度。

9. 发明申请

US20110303737A1 JET SOLDERING DEVICE AND SOLDERING METHOD 审中-公开
标题翻译：喷射焊接装置和焊接方法
公开(公告)号：US20110303737A1
公开(公告)日：2011-12-15
申请号：US13202905
申请日：2010-06-04
申请人： Toshinori Mimura , Hiroshi Yamauchi , Shinji Yoshino
发明人： Toshinori Mimura , Hiroshi Yamauchi , Shinji Yoshino
IPC分类号： B23K1/20 , B23K3/06
CPC分类号： H05K3/3468 , B23K3/0653 , H05K3/3447 , H05K2203/0746
摘要： A jet soldering device of the present invention includes: a solder bath (11) containing melted solder; a jet nozzle (15) that includes an end face for ejecting the melted solder, a cutout (30) provided on the end face, and a recovery wall (32) provided on the end face; a solder feeding mechanism (13, 20, 21, 22) that feeds the melted solder contained in the solder bath (11) to the jet nozzle (15); a tank moving mechanism (23, 24, 25, 26) that moves the solder bath (11); a solder receiving wall (42) that surrounds the jet nozzle (15) with a predetermined clearance and is connected to the jet nozzle (15); and a rotating mechanism (44, 45, 46) that transmits a drive force from the outside of the solder receiving wall (42) to rotate the solder receiving wall (42) and the jet nozzle (15).
摘要翻译：本发明的喷射焊接装置包括：含有熔融焊料的焊料槽（11）包括用于喷射熔融焊料的端面的喷嘴（15），设置在端面上的切口（30）和设置在端面上的回收壁（32）; 将包含在焊料槽（11）中的熔融焊料供给到喷嘴（15）的焊料供给机构（13,20,21,22）。移动焊料槽（11）的罐移动机构（23,24,25,26）; 焊接接收壁（42），其以预定间隙围绕喷嘴（15）并连接到喷嘴（15）; 以及从焊料接收壁（42）的外部传递驱动力以旋转焊料接收壁（42）和喷嘴（15）的旋转机构（44,45,46）。

10. 发明授权

US06371017B1 Printing method and printing apparatus 失效
标题翻译：印刷方法和印刷装置
公开(公告)号：US06371017B1
公开(公告)日：2002-04-16
申请号：US09708415
申请日：2000-11-09
申请人： Osamu Yamazaki , Kimihito Kuwabara , Kazumi Ishimoto , Toshiaki Yamauchi , Toshinori Mimura
发明人： Osamu Yamazaki , Kimihito Kuwabara , Kazumi Ishimoto , Toshiaki Yamauchi , Toshinori Mimura
IPC分类号： B41F1508
CPC分类号： B41F15/0813 , B41M1/12 , H05K3/1233 , H05K3/3484 , H05K2203/0783 , H05K2203/101 , H05K2203/1105
摘要： The temperature of a portion that belongs to a stencil and is located in the vicinity of a portion retaining a printing paste is increased to reduce the viscosity of printing paste that adheres to the portion retaining the printing paste, thereby allowing the printing paste to be easily separated from the retaining portion for the achievement of easy printing on an object on which a print is to be formed.
摘要翻译：属于模版的位于保持印刷浆料的部分附近的部分的温度增加，以降低粘附到保持印刷浆料的部分的印刷浆料的粘度，从而允许印刷浆料容易与保持部分分离，以便在要形成印刷品的物体上实现容易的印刷。

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