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    • 3. 发明授权
    • Solid film growth apparatus
    • 固体膜生长装置
    • US5025751A
    • 1991-06-25
    • US366185
    • 1989-06-14
    • Shinichiro TakataniShigeo GotoMasahiko KawataKenji Hiruma
    • Shinichiro TakataniShigeo GotoMasahiko KawataKenji Hiruma
    • C23C16/44C23C16/455C30B25/02C30B25/14
    • C23C16/4551C30B25/02C30B25/14C30B29/40Y10S148/169
    • A solid film forming apparatus, e.g., an MO-MBE (Metal-Organic Molecular Beam Epitaxy) apparatus, wherein evacuatable containers isolated from a growth chamber by a switching device and connected to raw material gas introduction pipings are provided between the growth chamber for a solid film, e.g., a compound semiconductor, and raw material gas introduction pipings. Growth of the solid film is controlled by opening and closing the switching device and evacuating the container at least while the switching device is closed during the growth of the solid film. An undesired influence on the growing film due to residual gas in the containers which are not used for growth can be prevented and, hence, interception and introduction of the raw material gas into the growth chamber can be performed with remarkably high controllability, and films of superior abruptness of the interface between films, e.g., the heterojunction of the compound semiconductor, can be obtained.
    • 一种固体成膜装置,例如MO-MBE(金属有机分子束外延)装置,其中通过开关装置从生长室隔离并连接到原料气体导入管的可排出容器设置在生长室之间用于 固体膜,例如化合物半导体和原料气体导入管。 至少在固体膜生长期间开关装置关闭时,通过打开和关闭开关装置并抽出容器来控制固体膜的生长。 可以防止由于不用于生长的容器中的残留气体对生长的膜产生不期望的影响,因此可以以非常高的可控性进行原料气体截留和引入生长室,并且可以进行膜的 可以获得膜之间的界面的优异的突变性,例如化合物半导体的异质结。
    • 4. 发明授权
    • Compound semiconductor having a doped layer between the gate and an ohmic contact of an active region
    • 化合物半导体在栅极与有源区的欧姆接触之间具有掺杂层
    • US06787817B2
    • 2004-09-07
    • US10318244
    • 2002-12-13
    • Hiroyuki TakazawaShinichiro TakataniMasao YamaneMasayoshi Kobayashi
    • Hiroyuki TakazawaShinichiro TakataniMasao YamaneMasayoshi Kobayashi
    • H01L310328
    • H01L29/66462H01L29/0657H01L29/7783
    • The present invention provides a semiconductor device for high frequency application having a high breakdown voltage and the method of manufacturing thereof. A region including a first conductivity type high impurity concentration semiconductor and a region including a first conductivity type low impurity concentration semiconductor are provided from an ohmic layer side at the side far from a semiconductor substrate of the end surface of a barrier layer opposite the semiconductor substrate and between the ohmic layer and a gate electrode. The sheet impurity concentration of the region including a first conductivity type low impurity concentration semiconductor is set to be lower than that between the bottom surface of the gate electrode at the side of the semiconductor substrate and the end surface of the channel layer opposite the semiconductor substrate. The sheet impurity concentration of the region including a first conductivity type high impurity concentration semiconductor is set to be higher than that of the region including a first conductivity type low impurity concentration semiconductor.
    • 本发明提供一种具有高击穿电压的高频应用的半导体器件及其制造方法。 包括第一导电型高杂质浓度半导体的区域和包括第一导电型低杂质浓度半导体的区域从远离半导体衬底的阻挡层的端面的半导体衬底的一侧的欧姆层侧提供 并且在欧姆层和栅电极之间。 包括第一导电型低杂质浓度半导体的区域的片状杂质浓度被设定为低于半导体衬底侧的栅电极的底表面和与半导体衬底相对的沟道层的端面之间的片状杂质浓度 。 将包括第一导电型高杂质浓度半导体的区域的片状杂质浓度设定为高于包含第一导电型低杂质浓度半导体的区域的片状杂质浓度。