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    • 9. 发明申请
    • GAS SENSOR
    • 气体传感器
    • US20120217550A1
    • 2012-08-30
    • US13508082
    • 2010-10-01
    • Toshiyuki Usagawa
    • Toshiyuki Usagawa
    • H01L27/088
    • G01N27/4141G01N27/4148G01N33/005
    • A MISFET-type hydrogen gas sensor having low power consumption which can be operated for one year or longer at a low voltage power source (for example, 1.5 to 3 V) is achieved. A sensor FET is formed in a MEMS region 34 where a Si substrate 22 of a SOI substrate is bored, and a heater wiring 32 is arranged so as to be folded between a Pi-Ti—O gate 28 and a source electrode 31S of the sensor FET and between the Pt—Ti—O gate 28 and a drain electrode 31D thereof, respectively. Further, a plurality of through-holes 36 obtained by removing a protective film so as to expose an embedded insulation layer of the SOI substrate are formed in a region where an intrinsic FET region 35 where the sensor FET is formed does not overlap with the MEMS region 34 and except for bridge regions 90, 90S, 90G, and 90H where lead-out wirings 20S, 20D, 20G, and 20H are formed and except for reinforced regions 91.
    • 实现了在低电压电源(例如,1.5至3V)下可以操作一年或更长时间的具有低功耗的MISFET型氢气传感器。 传感器FET形成在MEMS区域34中,其中SOI衬底的Si衬底22被钻孔,并且加热器布线32被布置成折叠在Pi-Ti-O门28和源极电极31S之间 传感器FET和Pt-Ti-O栅极28和漏电极31D之间。 此外,在形成传感器FET的固有FET区域35的区域中形成有通过去除保护膜以暴露SOI衬底的嵌入绝缘层而获得的多个通孔36,其中MEMS本体不与MEMS 区域34,除了形成引出配线20S,20D,20G和20H的桥接区90,90S,90G和90H之外,除了加强区域91之外。
    • 10. 发明授权
    • PN-junction gate FET
    • PN结栅极FET
    • US5670804A
    • 1997-09-23
    • US501956
    • 1995-07-13
    • Toshiyuki UsagawaAkemi SawadaKenichi Tominaga
    • Toshiyuki UsagawaAkemi SawadaKenichi Tominaga
    • H01L29/417H01L29/80H01L27/088H01L31/0328
    • H01L29/41758H01L29/802Y10S257/90
    • A semiconductor device is diclosed which has a PN-junction gate field effect transistor constituting a PN-junction gate with a semiconductor layer of opposite conductivity, an undoped semiconductor layer, and an active layer by depositing sources and drains made of semiconductor layers on the active layer of uniconductivity, depositing an undoped semiconductor layer whose band gap is greater than that of the active layer on the active layer between the opposing end surfaces of the sources and drains, and depositing a semiconductor layer of opposite conductivity on the undoped semiconductor layer away from the sources and drains. In particular, the present invention is effective for an enhancement type PN-junction power FET using compound semiconductors such as GaAs and capable of running with a single power supply and for a semi-conductor device integrating the enhancement type PN-junction power FET and a high-frequency low noise amplifier mono-lithically.
    • 一种半导体器件被封闭,其具有PN结栅极场效应晶体管,其构成具有相反导电性的半导体层的PN结栅极,未掺杂的半导体层和通过在半导体层上沉积源极和漏极的有源层 沉积非掺杂半导体层的非掺杂半导体层,所述非掺杂半导体层的带隙大于源极和漏极的相对端面之间的有源层上的有源层的带隙,并且在未掺杂半导体层上沉积具有相反导电性的半导体层 来源和渠道。 特别地,本发明对于使用诸如GaAs的化合物半导体并且能够使用单个电源运行的增强型PN结功率FET以及集成增强型PN结功率FET的半导体器件和 单频高频低噪声放大器。