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    • 6. 发明授权
    • Method for making insulated-gate semiconductor element
    • 制造绝缘栅半导体元件的方法
    • US06228720B1
    • 2001-05-08
    • US09507714
    • 2000-02-18
    • Makoto KitabatakeMasao UchidaKunimasa TakahashiTakeshi Uenoyama
    • Makoto KitabatakeMasao UchidaKunimasa TakahashiTakeshi Uenoyama
    • H01L21336
    • H01L29/7813H01L21/049H01L29/66068
    • An insulated-gate semiconductor element with a trench structure is provided, which has a high breakdown voltage even though a silicon carbide substrate is used that is preferable to obtain a semiconductor element with favorable properties. The surface of a silicon carbide substrate is etched to form a concave portion. Then, a particle beam, for example an ion beam, is irradiated from above, and a defect layer is formed at least in a bottom surface of the concave portion. The substrate is heated in an oxidation atmosphere, and an oxide film is formed at least on a side surface and the bottom surface of the concave portion. Then, a gate electrode is formed on the oxide film. With this method, the oxide film at the bottom surface of the concave portion is thicker than the oxide film at the side surfaces of the concave portion, so that a high breakdown voltage can be ensured, even when the surface of the silicon carbide layer is a face with which a superior epitaxial layer can be attained, such as the (111) Si-face of &bgr;-SiC or the (0001) Si-face of &agr;-SiC.
    • 提供了具有沟槽结构的绝缘栅半导体元件,即使使用优选获得具有良好特性的半导体元件的碳化硅衬底,其具有高的击穿电压。 蚀刻碳化硅衬底的表面以形成凹部。 然后,从上方照射粒子束,例如离子束,至少在凹部的底面形成有缺陷层。 在氧化气氛中加热基板,至少在凹部的侧面和底面形成氧化膜。 然后,在氧化膜上形成栅电极。 通过该方法,凹部底面的氧化膜比凹部的侧面的氧化膜厚,因此即使当碳化硅层的表面为 可以获得优异的外延层的面,例如β-SiC的(111)Si面或α-SiC的(0001)Si面。
    • 7. 发明授权
    • Electron-emitting device
    • 电子发射器件
    • US06350999B1
    • 2002-02-26
    • US09449525
    • 1999-11-29
    • Takeshi UenoyamaTakao TohdaMasahiro DeguchiMakoto KitabatakeKentaro Setsune
    • Takeshi UenoyamaTakao TohdaMasahiro DeguchiMakoto KitabatakeKentaro Setsune
    • H01L310328
    • H01J1/308
    • In an electron-emitting device, an electron supplying layer for supplying electrons is composed of an n-GaN layer. An electron transferring layer for moving electrons toward the surface is composed of non-doped (intrinsic) AlxGa1−xN (0≦x≦1) having a graded composition for the Al concentration x. A surface layer is composed of non-doped AlN having a negative electron affinity (NEA). The electron transferring layer composed of AlxGa1−xN has a band gap which is enlarged nearly continuously from the electron supplying layer to the surface layer and a negative electron affinity or a positive electron affinity close to zero. If such a voltage V as to render the surface electrode side positive is applied, the band of AlxGa1−xN is bent, whereby a current derived mainly from a diffused current flows from the electron supplying layer to the surface layer through the electron transferring layer. Thereby excellent electron emitting characteristic is obtained.
    • 在电子发射器件中,用于提供电子的电子供应层由n-GaN层组成。 用于向表面移动电子的电子转移层由具有Al浓度x的梯度组成的非掺杂(本征)Al x Ga 1-x N(0 <= x <= 1)组成。 表面层由具有负电子亲和力(NEA)的非掺杂AlN组成。 由Al x Ga 1-x N组成的电子转移层具有从电子供给层到表面层几乎连续扩大的带隙,接近零的负电子亲和力或正电子亲和力。 如果施加使表面电极侧为正的电压V,则Al x Ga 1-x N的带被弯曲,主要由扩散电流导出的电流从电子供给层通过电子转移层流向表面层。 由此获得优异的电子发射特性。