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    • 1. 发明授权
    • Radiation imaging device and radiation detector
    • 辐射成像装置和辐射探测器
    • US06339219B1
    • 2002-01-15
    • US09335782
    • 1999-06-18
    • Tohru IshizuyaMotoo Koyama
    • Tohru IshizuyaMotoo Koyama
    • G02F101
    • G01J5/40
    • An imaging device is provided for efficient and accurate conversion of invisible infrared radiation into a visible optical image. In an example, the image device employs an improved configuration of a substrate transmissive to infrared radiation, an infrared lens system, an optical readout radiation/displacement conversion unit for converting the infrared radiation into displacements, a readout optical system for directing readout light towards reflectors of the optical readout radiation/displacement conversion unit. The image device also provides for ease in assembly and calibration by adopting an improved arrangement of the parts.
    • 提供了一种成像装置,用于将不可见的红外辐射有效且准确地转换成可见光学图像。 在一个示例中,图像装置采用对红外辐射透射的基板的改进配置,红外透镜系统,用于将红外辐射转换成位移的光学读出辐射/位移转换单元,用于将读出光引导到反射器的读出光学系统 的光读出辐射/位移转换单元。 图像装置还通过采用改进的部件布置来提供组装和校准的容易性。
    • 3. 发明申请
    • Three-demensional structure element and method of manufacturing the element, optical switch, and micro device
    • 三维结构元件和元件制造方法,光开关和微型器件
    • US20050238282A1
    • 2005-10-27
    • US10523267
    • 2003-07-31
    • Tohru Ishizuya
    • Tohru Ishizuya
    • B81B3/00B81C1/00G02B6/35G02B26/08G02B6/26H01L29/22G02B5/08
    • B81B3/0072B81C2201/0108G02B6/3518G02B6/3546G02B6/3572G02B6/3584G02B6/3596Y10S438/926
    • A three-dimensional structure element having a plurality of three-dimensional structural bodies and capable of being uniformly formed without producing a dispersion in shape of the three-dimensional structural bodies, comprising a substrate (11) and the three-dimensional structural bodies (1) disposed in a predetermined effective area (20) on the substrate (11), the three-dimensional structural bodies (1) further comprising space parts formed in the clearances thereof from the substrate (11) by removing sacrificing layers, the substrate (11) further comprising a dummy area (21) having dummy structural bodies (33) so as to surround the effective area (20), the dummy structural body (33) further comprising space parts formed in the clearances thereof from the substrate (11) by removing the sacrificing layers, whereby since the dummy area (21) is heated merely to approx. the same temperature as the effective area (20) in an ashing process for removing the sacrificing layers to prevent a temperature distribution from occurring in the effective area (20).
    • 一种具有多个三维结构体并能够均匀形成而不产生三维结构体形状分散的三维结构元件,包括基底(11)和三维结构体(1) ),所述三维结构体(1)还包括通过去除牺牲层从所述基板(11)形成在其间隙中的空间部分,所述基板(11)被布置在所述基板(11)上的预定有效区域(20) )还包括具有虚拟结构体(33)以围绕所述有效区域(20)的虚拟区域(21),所述虚拟结构体(33)还包括通过所述基板(11)从所述基板(11)的间隙形成的空间部分, 去除牺牲层,由此由于虚拟区域(21)被加热到约 在用于去除牺牲层的灰化过程中与有效区域(20)相同的温度以防止在有效区域(20)中发生温度分布。
    • 5. 发明授权
    • Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device
    • 三维结构元件和元件制造方法,光开关和微型器件
    • US07298015B2
    • 2007-11-20
    • US10523267
    • 2003-07-31
    • Tohru Ishizuya
    • Tohru Ishizuya
    • H01L29/82
    • B81B3/0072B81C2201/0108G02B6/3518G02B6/3546G02B6/3572G02B6/3584G02B6/3596Y10S438/926
    • A three-dimensional structure element having a plurality of three-dimensional structural bodies and capable of being uniformly formed without producing a dispersion in shape of the three-dimensional structural bodies, comprising a substrate (11) and the three-dimensional structural bodies (1) disposed in a predetermined effective area (20) on the substrate (11), the three-dimensional structural bodies (1) further comprising space parts formed in the clearances thereof from the substrate (11) by removing sacrificing layers, the substrate (11) further comprising a dummy area (21) having dummy structural bodies (33) so as to surround the effective area (20), the dummy structural body (33) further comprising space parts formed in the clearances thereof from the substrate (11) by removing the sacrificing layers, whereby since the dummy area (21) is heated merely to approx. the same temperature as the effective area (20) in an ashing process for removing the sacrificing layers to prevent a temperature distribution from occurring in the effective area (20).
    • 一种具有多个三维结构体并能够均匀形成而不产生三维结构体形状分散的三维结构元件,包括基底(11)和三维结构体(1) ),所述三维结构体(1)还包括通过去除牺牲层从所述基板(11)形成在其间隙中的空间部分,所述基板(11)被布置在所述基板(11)上的预定有效区域(20) )还包括具有虚拟结构体(33)以围绕所述有效区域(20)的虚拟区域(21),所述虚拟结构体(33)还包括通过所述基板(11)从所述基板(11)的间隙形成的空间部分, 去除牺牲层,由此由于虚拟区域(21)被加热到约 在用于去除牺牲层的灰化过程中与有效区域(20)相同的温度以防止在有效区域(20)中发生温度分布。
    • 6. 发明授权
    • Micro actuator and optical switch using the actuator
    • 微动执行器和光开关使用执行器
    • US07116192B2
    • 2006-10-03
    • US10947530
    • 2004-09-22
    • Tohru IshizuyaJunji Suzuki
    • Tohru IshizuyaJunji Suzuki
    • H01H51/22
    • G02B6/3566G02B6/3512G02B6/3546G02B6/357G02B6/3584G02B6/3596G02B26/0833G02B26/0841
    • The movable part is constructed from a bridge part 13 with a cantilever structure in which the fixed end is fastened via a leg part 12. The bridge part 13 has two bridge constituent parts 14 and 15 that are connected in series between the fixed end and the free end. The bridge constituent part 14 on the side of the fixed end is a plate spring part. The bridge constituent part 15 on the side of the free end is a rigid part that possesses rigidity. The bridge constituent part 14 is bent toward the opposite side from the substrate 11 in a state in which the bridge part 13 receives no force. The mirror 2 is disposed on the free end side of the bridge constituent part 15. As a result, a microactuator can be obtained which can be operated by a small driving force.
    • 可移动部分由具有悬臂结构的桥部13构成,其中固定端经由腿部12固定。桥部13具有两个桥构成部分14和15,其串联连接在固定端和 自由结束 固定端侧的桥构成部14是板簧部。 自由端侧的桥构成部15是具有刚性的刚性部。 桥结构部14在桥接部13不受力的状态下朝向与基板11相反的一侧弯曲。 反射镜2设置在桥构成部件15的自由端侧。结果,可以获得可以通过小的驱动力操作的微型致动器。
    • 9. 发明授权
    • Radiation detectors including thermal-type displaceable element with increased responsiveness
    • 辐射检测器,包括具有增加的响应性的热式可位移元件
    • US06469301B1
    • 2002-10-22
    • US09570767
    • 2000-05-12
    • Junji SuzukiTohru Ishizuya
    • Junji SuzukiTohru Ishizuya
    • G01J520
    • G01J5/38
    • Radiation detector arrays are provided that include one or more thermal-type displaceable elements having reduced thickness without compromising mechanical strength or sensitivity of the displaceable elements to incident radiation. An exemplary displaceable element includes first and second membrane layers made of materials having different coefficients of thermal expansion. The layers are supported relative to a substrate by a leg. The displaceable element can also serve as an absorbing member for the incident radiation to be detected. Each element can also include a reflector of signal light. When the displaceable element incident radiation (such as infrared radiation) to be detected, it undergoes heating which bends the element. Displacement of the element is detected as a change in signal light or as a change in capacitance. If the displaceable member includes a signal-light reflector, the reflector includes a planar portion including “dropped” edges serving to strengthen the planar portion and allow the thickness of the planar portion to be reduced.
    • 提供辐射检测器阵列,其包括具有减小的厚度的一个或多个热型可位移元件,而不会影响可移位元件对入射辐射的机械强度或灵敏度。 示例性可移位元件包括由具有不同热膨胀系数的材料制成的第一和第二膜层。 这些层通过腿部相对于基底支撑。 可移动元件还可以用作待检测的入射辐射的吸收构件。 每个元件还可以包括信号光的反射器。 当可移动元件入射辐射(例如红外辐射)被检测时,它经历加热使元件弯曲。 元件的位移被检测为信号光的变化或电容的变化。 如果可移动部件包括信号光反射器,则反射器包括平面部分,其包括用于加强平面部分的“下落”边缘,并允许平坦部分的厚度减小。