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1. 发明专利

JP2017116317A センサ装置审中-公开
公开(公告)号：JP2017116317A
公开(公告)日：2017-06-29
申请号：JP2015249684
申请日：2015-12-22
申请人：株式会社豊田中央研究所 , Toyota Central R&D Labs Inc , トヨタ自動車株式会社 , Toyota Motor Corp , 国立大学法人東北大学 , Tohoku Univ
发明人： HATA YOSHIYUKI , FUJIYOSHI MOTOHIRO , NONOMURA YUTAKA , NAKAYAMA TAKAHIRO , BITO KOJI , ESASHI MASAKI , MUROYAMA MASANORI , TANAKA SHUJI
IPC分类号： G01L1/14 , G01L5/00
摘要：【課題】接触センシング面から見て側面側から直接、外力を受けることなく、センサ構造部及び信号処理用集積回路の欠損及び故障を低減すること。【解決手段】センサ装置は、検出対象物と直接に接触する接触センシング面を外部に露出する一面に有するとともに、接触センシング面の変化に感応してセンサ信号を出力するセンサ構造部と、一方の面に第1凹状部が形成され、該一方の面の反対側の面に第2凹状部が形成された基板と、センサ構造部が出力するセンサ信号を処理する信号処理用集積回路と、を備えている。センサ構造部は、基板の第1凹状部内に配置されている。信号処理用集積回路は、基板の第2凹状部内に配置されている。【選択図】図1

2. 发明专利

JP2014115267A Dynamic quantity sensor and dynamic quantity sensor system 有权
标题翻译：动态数量传感器和动态数量传感器系统
公开(公告)号：JP2014115267A
公开(公告)日：2014-06-26
申请号：JP2013109119
申请日：2013-05-23
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社 , Tohoku Univ , 国立大学法人東北大学
发明人： HATA YOSHIYUKI , NONOMURA YUTAKA , FUJIYOSHI MOTOHIRO , FUNAHASHI HIROFUMI , AKASHI TERUHISA , OMURA YOSHITERU , NAKAYAMA TAKAHIRO , YAMAGUCHI TAKATADA , YAMADA HITOSHI , TANAKA HIDEJI , ESASHI MASAKI , MUROYAMA MASANORI , MAKIHATA MITSUTOSHI
IPC分类号： G01L5/16 , G01L1/14 , G01P15/125 , G01P15/18
CPC分类号： G01L1/144 , G01L1/148 , G01P15/125 , G01P15/18 , G01P2015/084
摘要： PROBLEM TO BE SOLVED: To provide a dynamic quantity sensor and a dynamic quantity sensor system capable of accurately detecting the dynamic quantity.SOLUTION: A force sensor 100 comprises: a force receiver 40 for receiving force in a Z direction and in an X direction; a seesaw part 30A rotating in a first rotation direction according to the dynamic quantity in the Z direction that the force receiver 40 receives, and rotating in the first rotation direction according to the dynamic quantity in the X direction that the force receiver 40 receives; and a seesaw part 30C rotating in a second rotation direction according to the dynamic quantity in the Z direction that the force receiver 40 receives, and rotating in the opposite direction from the second direction according to the dynamic quantity in the X direction that the force receiver 40 receives.
摘要翻译：要解决的问题：提供能够精确地检测动态量的动态量传感器和动态量传感器系统。解决方案：力传感器100包括：用于在Z方向和X方向上接收力的力接收器40; 根据动力接收器40接收的Z方向的动量，沿着第一旋转方向旋转的跷跷板部30A，并且根据受力部40接收的X方向的动量，沿第一旋转方向旋转; 以及跷跷板部30C，其按照受力器40接收的Z方向上的动态量沿第二旋转方向旋转，并且根据X方向上的动量向与第二方向相反的方向旋转， 40收到。

3. 发明专利

JP2012081554A Tactile sensor system 有权
标题翻译： TACTILE传感器系统
公开(公告)号：JP2012081554A
公开(公告)日：2012-04-26
申请号：JP2010229761
申请日：2010-10-12
申请人： Tohoku Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人東北大学 , 株式会社豊田中央研究所
发明人： MUROYAMA MASANORI , ESASHI MASAKI , TANAKA HIDEJI , MATSUZAKI SAKAE , MAKIHATA MITSUTOSHI , NAKANO YOSHIHIRO , NONOMURA YUTAKA , FUJIYOSHI MOTOHIRO , YAMADA HITOSHI , NAKAYAMA TAKAHIRO , YAMAGUCHI TAKATADA , MIMA KAZUHIRO
IPC分类号： B25J19/02
摘要： PROBLEM TO BE SOLVED: To provide a robot in which the arrangement density of tactile sensor systems for each part is different, and which has an arrangement mode suitable for a relay device when arranging the relay device for relaying an output signal from a tactile sensor system to an information integration device.SOLUTION: The tactile sensor system 100 of a humanoid robot 1 includes: a plurality of sensor nodes 200 disposed on the surface of the robot body 2 of the humanoid robot 1; relay nodes 120 having relays 401 for relaying the output signals from the plurality of sensors nodes 200; and a host node 140 for receiving and processing the output signals relayed by the relays 401 of the relay nodes 120. The plurality of sensor nodes 200 are divided into at least two sections or more depending on the part of the robot body of the humanoid robot 1, and the relay nodes 120 are arranged at each section.
摘要翻译：要解决的问题：提供一种机器人，其中每个部件的触觉传感器系统的布置密度不同，并且当布置用于中继来自一个或多个的输出信号的中继装置时，具有适合于中继装置的布置模式触觉传感器系统到信息集成设备。人形机器人1的触觉传感器系统100包括：设置在人形机器人1的机器人主体2的表面上的多个传感器节点200; 具有用于中继来自多个传感器节点200的输出信号的中继器401的中继节点120; 以及用于接收和处理由中继节点120的中继器401中继的输出信号的主机节点140.多个传感器节点200根据类人机器人的机器人主体的一部分被划分为至少两个部分或更多部分中继节点120被布置在每个部分。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2013211365A Integrated device 有权
标题翻译：集成设备
公开(公告)号：JP2013211365A
公开(公告)日：2013-10-10
申请号：JP2012079811
申请日：2012-03-30
申请人： Tohoku Univ , 国立大学法人東北大学 , Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： MAKIHATA MITSUTOSHI , ESASHI MASAKI , TANAKA HIDEJI , MUROYAMA MASANORI , FUNABASHI HIROBUMI , NONOMURA YUTAKA , HATA YOSHIYUKI , YAMADA HITOSHI , NAKAYAMA TAKAHIRO , YAMAGUCHI TAKATADA
IPC分类号： H01L21/76 , G01L9/00 , H01L21/02 , H01L21/3205 , H01L21/683 , H01L21/768 , H01L21/8234 , H01L23/522 , H01L25/04 , H01L25/065 , H01L25/07 , H01L25/18 , H01L27/06 , H01L27/088 , H01L27/12 , H01L29/84
CPC分类号： H01L23/552 , B81B7/008 , B81C1/00238 , B81C2203/0792 , H01L21/3043 , H01L21/30625 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L21/78 , H01L23/5386 , H01L25/072 , H01L25/16 , H01L25/18 , H01L25/50 , H01L27/0611 , H01L29/0657 , H01L2221/68327 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an integrated device having excellent insulation resistance.SOLUTION: A groove having a side face consisting of an inclined surface is provided between adjoining devices. When the side provided with an electronic circuit or an MEMS device is the front face, the groove is made narrower from the front face toward the back face by the inclined surface. Since a mold material (insulation material) exists in the groove, a plurality of devices are bonded mechanically while being insulated electrically from each other. A wiring material for electrically conducting the adjoining devices is formed along the side face and bottom face of the groove. When taking out the wiring to the back face, a hole is formed in the bottom face of the groove so that the wiring material is exposed from the hole to the back face.
摘要翻译：要解决的问题：提供具有优异的绝缘电阻的集成装置。解决方案：在相邻的装置之间设置具有由倾斜表面组成的侧面的凹槽。当设置有电子电路或MEMS装置的一侧是前表面时，通过倾斜表面使凹槽从前表面朝向后表面变窄。由于在槽中存在模具材料（绝缘材料），所以多个装置在彼此电绝缘的同时机械地结合。沿着槽的侧面和底面形成用于导电邻接装置的布线材料。当将布线取出到背面时，在槽的底面形成孔，使得布线材料从孔暴露到背面。

5. 发明专利

JP2011085435A Tactile sensor system 有权
标题翻译： TACTILE传感器系统
公开(公告)号：JP2011085435A
公开(公告)日：2011-04-28
申请号：JP2009236913
申请日：2009-10-14
申请人： Tohoku Univ , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 国立大学法人東北大学 , 株式会社豊田中央研究所
发明人： MUROYAMA MASANORI , ESASHI MASAKI , TANAKA HIDEJI , MATSUZAKI SAKAE , MAKIHATA MITSUTOSHI , NONOMURA YUTAKA , FUJIYOSHI MOTOHIRO , NAKAYAMA TAKAHIRO , YAMAGUCHI TAKATADA , YAMADA HITOSHI
IPC分类号： G01L5/00 , G01K1/14 , G01V9/00
CPC分类号： B25J13/084 , G01L1/146 , G01L5/228 , H01L24/32 , H01L2224/32221 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To allow sensor characteristics to differ according to applications of a sensor device. SOLUTION: A sensor system includes a plurality of sensor devices. The sensor devices include: a sensor element; an outer-layer section for composing an outer surface; and an inner-layer section provided between the sensor element and the outer-layer section. By changing a combination of shapes of the inner-layer section and the outer-layer section, or a combination of physical properties of the inner-layer section and the outer-layer section, detection characteristics differ for each sensor device according to detection targets or applications of the respective sensor devices. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：根据传感器设备的应用，允许传感器特性不同。传感器系统包括多个传感器装置。传感器装置包括：传感器元件; 用于构成外表面的外层部分; 以及设置在传感器元件和外层部分之间的内层部分。通过改变内层部分和外层部分的形状的组合或内层部分和外层部分的物理组合的组合，根据检测目标或每个传感器装置的检测特性不同，每个传感器装置相应传感器设备的应用。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2014205235A 機能デバイス审中-公开
标题翻译：功能设备
公开(公告)号：JP2014205235A
公开(公告)日：2014-10-30
申请号：JP2014114444
申请日：2014-06-02
申请人：国立大学法人東北大学 , Tohoku Univ
发明人： TANAKA SHUJI , ESASHI MASAKI
IPC分类号： B81B7/02 , H01G5/16 , H01L23/02 , H03H9/24
摘要：【課題】ウェハレベルで集積回路基板及びマイクロマシン、さらにはカバーとなるLTCC基板等を集積化することができるようにした、機能デバイス及びその製造方法を提供する。【解決手段】機能デバイス10は、集積回路が配設されている集積回路基板11と、集積回路基板を覆うカバー基板13と、集積回路基板11とカバー基板13とを封止する周状の封止部14と、集積回路基板11とカバー基板13との間に配設され集積回路基板11とカバー基板13の何れかに電気的に接続されるマイクロマシン12と、を備えて構成されている。【選択図】図1
摘要翻译：要解决的问题：提供一种能够集成集成电路基板，微机和LTCC基板以在晶片级上用作盖等的功能器件，以及用于功能器件的制造方法解决方案：功能装置10包括：集成电路基板11，集成电路安装在该集成电路基板11上; 用于覆盖集成电路基板的盖基板13; 用于密封集成电路基板11和盖基板13的周边密封部14; 以及安装在集成电路基板11和盖基板13之间并与集成电路基板11或盖基板13电连接的微型机器12。

7. 发明专利

JP2013214843A Integration acoustic device and manufacturing method of the same 审中-公开
标题翻译：集成声学设备及其制造方法
公开(公告)号：JP2013214843A
公开(公告)日：2013-10-17
申请号：JP2012083408
申请日：2012-03-31
申请人： Tohoku Univ , 国立大学法人東北大学 , Chiba Univ , 国立大学法人千葉大学
发明人： TANAKA HIDEJI , ESASHI MASAKI , HASHIMOTO KIYONARI
IPC分类号： H03H9/02 , B81B7/02 , B81C3/00 , H01L21/822 , H01L27/04 , H03H3/02 , H03H3/08 , H03H9/145 , H03H9/17
摘要： PROBLEM TO BE SOLVED: To provide an integration acoustic device which enables an acoustic device to be manufactured at low costs while preventing the damage to an integrated circuit with a simple structure, and to provide a manufacturing method of the integration acoustic device.SOLUTION: An integration acoustic device 10 is formed so as to include an integrated circuit board 11 including an integrated circuit formed therein, a resin layer 13 provided on the integrated circuit board, and an acoustic device 12 formed on the resin layer 13. A clearance 16 may be defined between the resin layer 13 and the acoustic device 12. A base layer 17 may be placed between the resin layer 13 and the acoustic device 12. The acoustic device 12 may cooperate with the integrated circuit in the integrated circuit board to function as a frequency reference oscillator or a resonance type sensor.
摘要翻译：要解决的问题：提供一种能够以低成本制造声学装置的集成声学装置，同时以简单的结构防止对集成电路的损坏，并提供一体化声学装置的制造方法。解决方案：集成声学装置10形成为包括形成有集成电路的集成电路板11，设置在集成电路板上的树脂层13和形成在树脂层13上的声学装置12.间隙16可以是限定在树脂层13和声学装置12之间。基底层17可以放置在树脂层13和声学装置12之间。声学装置12可以与集成电路板中的集成电路协作起作用的频率参考振荡器或共振型传感器。

8. 发明专利

JP2013165174A Electron beam irradiation device, multi electron beam irradiation device, electron beam exposure system, and electron beam irradiation method 有权
标题翻译：电子束辐射装置，多电子束辐射装置，电子束曝光系统和电子束辐照方法
公开(公告)号：JP2013165174A
公开(公告)日：2013-08-22
申请号：JP2012027499
申请日：2012-02-10
申请人： Tohoku Univ , 国立大学法人東北大学 , Tokyo Univ Of Agriculture & Technology , 国立大学法人東京農工大学 , Crestec Inc , 株式会社クレステック
发明人： ESASHI MASAKI , IKEGAMI NAOKATSU , KOJIMA AKIRA
IPC分类号： H01L21/027 , G03F7/20 , H01J1/312 , H01J37/06 , H01J37/305
摘要： PROBLEM TO BE SOLVED: To provide a compact electron beam irradiation device in which throughput of an electron beam exposure device is enhanced.SOLUTION: The electron beam irradiation device outputing a plurality of electron beams includes a surface electron beam source having a plurality of electron emission parts which focuses electrons emitted, respectively, from the plurality of electron emission parts while accelerating and outputs as a plurality of electron beams, and an electron lens for irradiating an object with a drawing pattern formed of the plurality of electron beams output from the surface electron beam source with a predetermined magnification.
摘要翻译：要解决的问题：提供一种电子束曝光装置的生产量提高的小型电子束照射装置。解决方案：输出多束电子束的电子束照射装置包括具有多个电子发射的表面电子束源分别从多个电子发射部分发射的电子的加热和输出作为多个电子束的部分，以及用于从由表面电子输出的多个电子束形成的绘制图案照射物体的电子透镜光束源以预定的倍率。

9. 发明专利

JP2013092437A Ic chip provided with plurality of electrodes 有权
标题翻译： IC芯片提供多种电极
公开(公告)号：JP2013092437A
公开(公告)日：2013-05-16
申请号：JP2011234459
申请日：2011-10-25
申请人： Tohoku Univ , 国立大学法人東北大学 , Japan Aviation Electronics Industry Ltd , 日本航空電子工業株式会社 , Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SUENAGA TOMOKAZU , INOUE HISAMI , MATSUDAIRA MASAAKI , ESASHI MASAKI , SUDA ATSUSHI , KIMURA TATSUO , KUNIKATA RYOTA , SHIOTANI TOSHITO , TSURUMI RYOTA
IPC分类号： G01N27/30 , G01N27/333 , G01N27/416
摘要： PROBLEM TO BE SOLVED: To provide an IC chip provided with a plurality of working electrodes which can perform desired electrochemical measurement in a plurality of measurement points in a short period of time according to each of the measurement points, and cause an electrochemical reaction due to a minute electric signal by using an arbitrary working electrode out of the plurality of working electrodes or can detect a detection signal even when it is the detection signal whose movement of charges associated with the electrochemical reaction is minute.SOLUTION: In an IC chip 10, a switch group 12, an operational amplifier 13 connected to the switch group 12, and a capacitor 17 connected between one input terminal and an output terminal of the operational amplifier 13 are provided on each of working electrodes 11. The switch group 12 switches among an offset voltage measuring mode of measuring an offset voltage of the operational amplifier 13, a mode of measuring a potential of the working electrode 11, a mode of measuring an electric current passing when the working electrode 11 is set to a predetermined potential, and a mode of measuring an electric current passing through the working electrode 11 when the working electrode 11 is set to an offset potential rather than the predetermined potential.
摘要翻译：要解决的问题：提供一种设置有多个工作电极的IC芯片，其可以根据每个测量点在短时间内在多个测量点中进行所需的电化学测量，并且引起电化学即使是与电化学反应相关的电荷的运动微小的检测信号，也可以通过使用多个工作电极中的任意工作电极而产生微小电信号的反应。解决方案：在IC芯片10中，分别设置有开关组12，与开关组12连接的运算放大器13和连接在运算放大器13的一个输入端子和输出端子之间的电容器17 工作电极11.开关组12在测量运算放大器13的偏移电压的偏移电压测量模式，测量工作电极11的电位的模式，测量工作电极 11被设定为预定电位，并且当工作电极11被设定为偏移电位而不是预定电位时，测量通过工作电极11的电流的模式。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2012049298A Device using porous metal for electrical connection and wiring connection method 审中-公开
标题翻译：使用多孔金属进行电气连接和接线连接方法的设备
公开(公告)号：JP2012049298A
公开(公告)日：2012-03-08
申请号：JP2010189433
申请日：2010-08-26
申请人： Nikko Co , Tanaka Kikinzoku Kogyo Kk , Tohoku Univ , ニッコー株式会社 , 国立大学法人東北大学 , 田中貴金属工業株式会社
发明人： TANAKA HIDEJI , FUKUSHI HIDEYUKI , ESASHI MASAKI , MORI MAMORU , NAKAMURA DAISUKE , OKADA ATSUSHI , KOGASHIWA TOSHINORI , NISHIMORI TAKASHI , TANAKA KATSUHISA , KUSAMORI HIROYUKI
IPC分类号： H01L23/02 , B81B3/00 , B81C3/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring connection method which can surely electrically-connects a substrate having a device structure formed thereon and a substrate for sealing the substrate when anodically-bonding the substrates.SOLUTION: A device 4 comprises a first substrate 40 and a second substrate 45 which are anodically-bonded and electrically-connected via porous metals 51 and 52 which comprise one or more metals selected from gold, silver, platinum and palladium having a purity of 99.9 mass% or more and an average grain diameter of 0.005-1.0 μm. The wiring connection method comprises: forming the porous metal (bump) on at least one of a connection electrode part of the first substrate and a connection electrode part of the second substrate; superposing the first and second substrates so that the connection electrode parts of the first and second substrates face each other while sandwiching the bump; then anodically-bonding the both substrates and simultaneously electrically-connecting the connection electrode parts of the first and second substrates via the porous metal.
摘要翻译：要解决的问题：提供一种布线连接方法，其可以可靠地电连接其上形成有器件结构的衬底和用于在阳极接合衬底时密封衬底的衬底。解决方案：装置4包括第一基板40和第二基板45，第一基板40和第二基板45通过多孔金属51和52阳极结合并电连接，多孔金属51和52包括一种或多种选自金，银，铂和钯的金属，纯度为99.9质量％以上，平均粒径为0.005〜1.0μm。布线连接方法包括：在第一基板的连接电极部分和第二基板的连接电极部分中的至少一个上形成多孔金属（凸块）; 叠置第一和第二基板，使得第一和第二基板的连接电极部分彼此面对同时夹住凸块; 然后阳极接合两个基板，同时通过多孔金属电连接第一和第二基板的连接电极部分。版权所有（C）2012，JPO＆INPIT

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