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1. 发明专利

JP2013239839A Tunable filter 有权
标题翻译： TUNABLE过滤器
公开(公告)号：JP2013239839A
公开(公告)日：2013-11-28
申请号：JP2012110793
申请日：2012-05-14
申请人： Murata Mfg Co Ltd , 株式会社村田製作所 , Tohoku Univ , 国立大学法人東北大学 , Chiba Univ , 国立大学法人千葉大学
发明人： KADOTA MICHIO , KIMURA TETSUYA , TANAKA HIDEJI , ESASHI MASAKI , HASHIMOTO KIYONARI , INABA MAO
IPC分类号： H03H9/64 , H03H7/075 , H03H7/12 , H03H9/56 , H03H9/58
摘要： PROBLEM TO BE SOLVED: To provide a tunable filter that inexpensively and compactly reduces the number of variable elements for changing characteristics.SOLUTION: A tunable filter 1 has a resonator section 4 and a series variable reactance element 5 connected in series on a signal path connecting an input terminal 2 and an output terminal 3 to constitute a first circuit element, and has a parallel variable reactance element 6 connected to the first circuit element. The resonator section 4 comprises either an n-tuple mode resonator (n is an integer of two or greater) or a plurality of resonators.
摘要翻译：要解决的问题：提供一种可变滤波器，其可以廉价和紧凑地减少用于改变特性的可变元件的数量。解决方案：可调谐滤波器1具有谐振器部分4和串联可变电抗元件5，其串联连接在信号路径上输入端子2和输出端子3构成第一电路元件，并具有连接到第一电路元件的并联可变电抗元件6。谐振器部分4包括n元组模式谐振器（n为2或更大的整数）或多个谐振器。

2. 发明专利

JP2013214843A Integration acoustic device and manufacturing method of the same 审中-公开
标题翻译：集成声学设备及其制造方法
公开(公告)号：JP2013214843A
公开(公告)日：2013-10-17
申请号：JP2012083408
申请日：2012-03-31
申请人： Tohoku Univ , 国立大学法人東北大学 , Chiba Univ , 国立大学法人千葉大学
发明人： TANAKA HIDEJI , ESASHI MASAKI , HASHIMOTO KIYONARI
IPC分类号： H03H9/02 , B81B7/02 , B81C3/00 , H01L21/822 , H01L27/04 , H03H3/02 , H03H3/08 , H03H9/145 , H03H9/17
摘要： PROBLEM TO BE SOLVED: To provide an integration acoustic device which enables an acoustic device to be manufactured at low costs while preventing the damage to an integrated circuit with a simple structure, and to provide a manufacturing method of the integration acoustic device.SOLUTION: An integration acoustic device 10 is formed so as to include an integrated circuit board 11 including an integrated circuit formed therein, a resin layer 13 provided on the integrated circuit board, and an acoustic device 12 formed on the resin layer 13. A clearance 16 may be defined between the resin layer 13 and the acoustic device 12. A base layer 17 may be placed between the resin layer 13 and the acoustic device 12. The acoustic device 12 may cooperate with the integrated circuit in the integrated circuit board to function as a frequency reference oscillator or a resonance type sensor.
摘要翻译：要解决的问题：提供一种能够以低成本制造声学装置的集成声学装置，同时以简单的结构防止对集成电路的损坏，并提供一体化声学装置的制造方法。解决方案：集成声学装置10形成为包括形成有集成电路的集成电路板11，设置在集成电路板上的树脂层13和形成在树脂层13上的声学装置12.间隙16可以是限定在树脂层13和声学装置12之间。基底层17可以放置在树脂层13和声学装置12之间。声学装置12可以与集成电路板中的集成电路协作起作用的频率参考振荡器或共振型传感器。

3. 发明专利

JP2014205235A 機能デバイス审中-公开
标题翻译：功能设备
公开(公告)号：JP2014205235A
公开(公告)日：2014-10-30
申请号：JP2014114444
申请日：2014-06-02
申请人：国立大学法人東北大学 , Tohoku Univ
发明人： TANAKA SHUJI , ESASHI MASAKI
IPC分类号： B81B7/02 , H01G5/16 , H01L23/02 , H03H9/24
摘要：【課題】ウェハレベルで集積回路基板及びマイクロマシン、さらにはカバーとなるLTCC基板等を集積化することができるようにした、機能デバイス及びその製造方法を提供する。【解決手段】機能デバイス10は、集積回路が配設されている集積回路基板11と、集積回路基板を覆うカバー基板13と、集積回路基板11とカバー基板13とを封止する周状の封止部14と、集積回路基板11とカバー基板13との間に配設され集積回路基板11とカバー基板13の何れかに電気的に接続されるマイクロマシン12と、を備えて構成されている。【選択図】図1
摘要翻译：要解决的问题：提供一种能够集成集成电路基板，微机和LTCC基板以在晶片级上用作盖等的功能器件，以及用于功能器件的制造方法解决方案：功能装置10包括：集成电路基板11，集成电路安装在该集成电路基板11上; 用于覆盖集成电路基板的盖基板13; 用于密封集成电路基板11和盖基板13的周边密封部14; 以及安装在集成电路基板11和盖基板13之间并与集成电路基板11或盖基板13电连接的微型机器12。

4. 发明专利

JP2014115267A Dynamic quantity sensor and dynamic quantity sensor system 有权
标题翻译：动态数量传感器和动态数量传感器系统
公开(公告)号：JP2014115267A
公开(公告)日：2014-06-26
申请号：JP2013109119
申请日：2013-05-23
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社 , Tohoku Univ , 国立大学法人東北大学
发明人： HATA YOSHIYUKI , NONOMURA YUTAKA , FUJIYOSHI MOTOHIRO , FUNAHASHI HIROFUMI , AKASHI TERUHISA , OMURA YOSHITERU , NAKAYAMA TAKAHIRO , YAMAGUCHI TAKATADA , YAMADA HITOSHI , TANAKA HIDEJI , ESASHI MASAKI , MUROYAMA MASANORI , MAKIHATA MITSUTOSHI
IPC分类号： G01L5/16 , G01L1/14 , G01P15/125 , G01P15/18
CPC分类号： G01L1/144 , G01L1/148 , G01P15/125 , G01P15/18 , G01P2015/084
摘要： PROBLEM TO BE SOLVED: To provide a dynamic quantity sensor and a dynamic quantity sensor system capable of accurately detecting the dynamic quantity.SOLUTION: A force sensor 100 comprises: a force receiver 40 for receiving force in a Z direction and in an X direction; a seesaw part 30A rotating in a first rotation direction according to the dynamic quantity in the Z direction that the force receiver 40 receives, and rotating in the first rotation direction according to the dynamic quantity in the X direction that the force receiver 40 receives; and a seesaw part 30C rotating in a second rotation direction according to the dynamic quantity in the Z direction that the force receiver 40 receives, and rotating in the opposite direction from the second direction according to the dynamic quantity in the X direction that the force receiver 40 receives.
摘要翻译：要解决的问题：提供能够精确地检测动态量的动态量传感器和动态量传感器系统。解决方案：力传感器100包括：用于在Z方向和X方向上接收力的力接收器40; 根据动力接收器40接收的Z方向的动量，沿着第一旋转方向旋转的跷跷板部30A，并且根据受力部40接收的X方向的动量，沿第一旋转方向旋转; 以及跷跷板部30C，其按照受力器40接收的Z方向上的动态量沿第二旋转方向旋转，并且根据X方向上的动量向与第二方向相反的方向旋转， 40收到。

5. 发明专利

JP2013165174A Electron beam irradiation device, multi electron beam irradiation device, electron beam exposure system, and electron beam irradiation method 有权
标题翻译：电子束辐射装置，多电子束辐射装置，电子束曝光系统和电子束辐照方法
公开(公告)号：JP2013165174A
公开(公告)日：2013-08-22
申请号：JP2012027499
申请日：2012-02-10
申请人： Tohoku Univ , 国立大学法人東北大学 , Tokyo Univ Of Agriculture & Technology , 国立大学法人東京農工大学 , Crestec Inc , 株式会社クレステック
发明人： ESASHI MASAKI , IKEGAMI NAOKATSU , KOJIMA AKIRA
IPC分类号： H01L21/027 , G03F7/20 , H01J1/312 , H01J37/06 , H01J37/305
摘要： PROBLEM TO BE SOLVED: To provide a compact electron beam irradiation device in which throughput of an electron beam exposure device is enhanced.SOLUTION: The electron beam irradiation device outputing a plurality of electron beams includes a surface electron beam source having a plurality of electron emission parts which focuses electrons emitted, respectively, from the plurality of electron emission parts while accelerating and outputs as a plurality of electron beams, and an electron lens for irradiating an object with a drawing pattern formed of the plurality of electron beams output from the surface electron beam source with a predetermined magnification.
摘要翻译：要解决的问题：提供一种电子束曝光装置的生产量提高的小型电子束照射装置。解决方案：输出多束电子束的电子束照射装置包括具有多个电子发射的表面电子束源分别从多个电子发射部分发射的电子的加热和输出作为多个电子束的部分，以及用于从由表面电子输出的多个电子束形成的绘制图案照射物体的电子透镜光束源以预定的倍率。

6. 发明专利

JP2013092437A Ic chip provided with plurality of electrodes 有权
标题翻译： IC芯片提供多种电极
公开(公告)号：JP2013092437A
公开(公告)日：2013-05-16
申请号：JP2011234459
申请日：2011-10-25
申请人： Tohoku Univ , 国立大学法人東北大学 , Japan Aviation Electronics Industry Ltd , 日本航空電子工業株式会社 , Toppan Printing Co Ltd , 凸版印刷株式会社
发明人： SUENAGA TOMOKAZU , INOUE HISAMI , MATSUDAIRA MASAAKI , ESASHI MASAKI , SUDA ATSUSHI , KIMURA TATSUO , KUNIKATA RYOTA , SHIOTANI TOSHITO , TSURUMI RYOTA
IPC分类号： G01N27/30 , G01N27/333 , G01N27/416
摘要： PROBLEM TO BE SOLVED: To provide an IC chip provided with a plurality of working electrodes which can perform desired electrochemical measurement in a plurality of measurement points in a short period of time according to each of the measurement points, and cause an electrochemical reaction due to a minute electric signal by using an arbitrary working electrode out of the plurality of working electrodes or can detect a detection signal even when it is the detection signal whose movement of charges associated with the electrochemical reaction is minute.SOLUTION: In an IC chip 10, a switch group 12, an operational amplifier 13 connected to the switch group 12, and a capacitor 17 connected between one input terminal and an output terminal of the operational amplifier 13 are provided on each of working electrodes 11. The switch group 12 switches among an offset voltage measuring mode of measuring an offset voltage of the operational amplifier 13, a mode of measuring a potential of the working electrode 11, a mode of measuring an electric current passing when the working electrode 11 is set to a predetermined potential, and a mode of measuring an electric current passing through the working electrode 11 when the working electrode 11 is set to an offset potential rather than the predetermined potential.
摘要翻译：要解决的问题：提供一种设置有多个工作电极的IC芯片，其可以根据每个测量点在短时间内在多个测量点中进行所需的电化学测量，并且引起电化学即使是与电化学反应相关的电荷的运动微小的检测信号，也可以通过使用多个工作电极中的任意工作电极而产生微小电信号的反应。解决方案：在IC芯片10中，分别设置有开关组12，与开关组12连接的运算放大器13和连接在运算放大器13的一个输入端子和输出端子之间的电容器17 工作电极11.开关组12在测量运算放大器13的偏移电压的偏移电压测量模式，测量工作电极11的电位的模式，测量工作电极 11被设定为预定电位，并且当工作电极11被设定为偏移电位而不是预定电位时，测量通过工作电极11的电流的模式。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2012049298A Device using porous metal for electrical connection and wiring connection method 审中-公开
标题翻译：使用多孔金属进行电气连接和接线连接方法的设备
公开(公告)号：JP2012049298A
公开(公告)日：2012-03-08
申请号：JP2010189433
申请日：2010-08-26
申请人： Nikko Co , Tanaka Kikinzoku Kogyo Kk , Tohoku Univ , ニッコー株式会社 , 国立大学法人東北大学 , 田中貴金属工業株式会社
发明人： TANAKA HIDEJI , FUKUSHI HIDEYUKI , ESASHI MASAKI , MORI MAMORU , NAKAMURA DAISUKE , OKADA ATSUSHI , KOGASHIWA TOSHINORI , NISHIMORI TAKASHI , TANAKA KATSUHISA , KUSAMORI HIROYUKI
IPC分类号： H01L23/02 , B81B3/00 , B81C3/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring connection method which can surely electrically-connects a substrate having a device structure formed thereon and a substrate for sealing the substrate when anodically-bonding the substrates.SOLUTION: A device 4 comprises a first substrate 40 and a second substrate 45 which are anodically-bonded and electrically-connected via porous metals 51 and 52 which comprise one or more metals selected from gold, silver, platinum and palladium having a purity of 99.9 mass% or more and an average grain diameter of 0.005-1.0 μm. The wiring connection method comprises: forming the porous metal (bump) on at least one of a connection electrode part of the first substrate and a connection electrode part of the second substrate; superposing the first and second substrates so that the connection electrode parts of the first and second substrates face each other while sandwiching the bump; then anodically-bonding the both substrates and simultaneously electrically-connecting the connection electrode parts of the first and second substrates via the porous metal.
摘要翻译：要解决的问题：提供一种布线连接方法，其可以可靠地电连接其上形成有器件结构的衬底和用于在阳极接合衬底时密封衬底的衬底。解决方案：装置4包括第一基板40和第二基板45，第一基板40和第二基板45通过多孔金属51和52阳极结合并电连接，多孔金属51和52包括一种或多种选自金，银，铂和钯的金属，纯度为99.9质量％以上，平均粒径为0.005〜1.0μm。布线连接方法包括：在第一基板的连接电极部分和第二基板的连接电极部分中的至少一个上形成多孔金属（凸块）; 叠置第一和第二基板，使得第一和第二基板的连接电极部分彼此面对同时夹住凸块; 然后阳极接合两个基板，同时通过多孔金属电连接第一和第二基板的连接电极部分。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2011022045A Inspection device for integrated circuit board, and inspection method of integrated circuit board 有权
标题翻译：集成电路板检测装置及集成电路板检测方法
公开(公告)号：JP2011022045A
公开(公告)日：2011-02-03
申请号：JP2009168311
申请日：2009-07-16
申请人： Pioneer Electronic Corp , Tohoku Univ , パイオニア株式会社 , 国立大学法人東北大学
发明人： ESASHI MASAKI , TAKAHASHI HIROKAZU , YABE TOMOTAKA , ONOE ATSUSHI
IPC分类号： G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide an inspection device for an integrated circuit board and an inspection method of the integrated circuit board, capable of correctly inspecting whether the integrated circuit board has a specified performance, prior to loading a MEMS element on the integrated circuit board on which an integrated circuit is disposed. SOLUTION: The inspection device for the integrated circuit board 110 having on the surface, electrode pads 111A, 111B to be connected to an electrode section of the MEMS element is constituted of an inspection element 12 having the same constitution and size as the MEMS element, by including connecting sections 12A, 12B for inspection, having rigidity with the same size as that the electrode section of the MEMS element; a pressing means 16 for pressing the connecting sections 12A, 12B for inspection of the inspection element 12 onto the electrode pads 111A, 111B on the integrated circuit board 110; and a support section 15 for supporting the pressing means 16 relatively movably with respect to the integrated circuit board 110. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供集成电路板的检查装置和集成电路板的检查方法，能够在将MEMS元件加载到所述集成电路板之前正确检查集成电路板是否具有指定的性能设置有集成电路的集成电路板。解决方案：具有表面的集成电路板110的检查装置，与MEMS元件的电极部分连接的电极焊盘111A，111B由具有与所述MEMS元件相同的结构和尺寸的检查元件12构成 MEMS元件通过包括用于检查的连接部分12A，12B，具有与MEMS元件的电极部分相同尺寸的刚性; 用于将用于检查元件12的连接部分12A，12B按压到集成电路板110上的电极焊盘111A，111B上的按压装置16; 以及用于相对于集成电路板110相对移动地支撑按压装置16的支撑部分15.版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010177341A Method for cutting laminate 审中-公开
标题翻译：切割层压板的方法
公开(公告)号：JP2010177341A
公开(公告)日：2010-08-12
申请号：JP2009016613
申请日：2009-01-28
申请人： Laser Gijutsu Sogo Kenkyusho , Panasonic Electric Works Co Ltd , Tohoku Univ , パナソニック電工株式会社 , 国立大学法人東北大学 , 財団法人レーザー技術総合研究所
发明人： FUJITA MASAYUKI , YOSHIDA KAZUJI , TOMII KAZUYUKI , ESASHI MASAKI , TANAKA HIDEJI
IPC分类号： H01L21/301 , B23K26/00 , B23K26/38
摘要： PROBLEM TO BE SOLVED: To provide a method for cutting a laminate, which is capable of more easily cutting the laminate formed by direct bonding of an Si substrate and a glass substrate and is capable of enhancing smoothness of a cut cross-section of the glass surface. SOLUTION: In the method for cutting the laminate 10 wherein a single crystal Si substrate 11 and a glass substrate 11 are directly bonded to each other, a stress concentration portion forming step is performed wherein a stress concentration portion 20 is formed on the side of the glass substrate 12 of the Si substrate 11 along a cutting scheduled line L as shown in Fig.1(a). Subsequently, a laser irradiation step is performed wherein a laser beam LBb from an infrared laser is radiated along the stress concentration portion 20 as shown in Fig.1(b) to give a temperature change to the stress concentration portion 20, and then, an expanding step of expanding an adhesive resin tape having the laminate 10 stuck thereto is performed. The laser irradiation step and the expanding step constitute a cutting step of applying stress to the stress concentration portion 20 of the laminate 10 to cut the laminate 10. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种能够更容易地切割由Si基板和玻璃基板直接接合形成的层叠体的层叠体切断方法，能够提高切断面的平滑性的玻璃表面。解决方案：在将单晶Si衬底11和玻璃衬底11彼此直接接合的层压体10的切割方法中，应力集中部分形成步骤被执行，其中应力集中部分20形成在如图1（a）所示，沿着切断预定线L，Si基板11的玻璃基板12的侧面。随后，如图1（b）所示，沿着应力集中部20照射来自红外线激光的激光束LBb，对应力集中部20进行温度变化，进行激光照射工序，进行使贴附有层叠体10的粘合树脂带膨胀的膨胀工序。激光照射步骤和扩展步骤构成对层压体10的应力集中部分20施加应力以切割层压体10的切割步骤。（C）2010，JPO＆INPIT

10. 发明专利

JP2007183400A Micromirror and micromirror device 有权
标题翻译： MICROMIRROR和MICROMIRROR设备
公开(公告)号：JP2007183400A
公开(公告)日：2007-07-19
申请号：JP2006001331
申请日：2006-01-06
申请人： Pentax Corp , Tohoku Univ , ペンタックス株式会社 , 国立大学法人東北大学
发明人： ESASHI MASAKI , KIKUCHI NAOKI
IPC分类号： G02B26/08 , B81B3/00 , G02B26/10
CPC分类号： G02B26/0841 , B81B3/0062 , B81B2201/042 , B81B2203/0109 , B81B2203/058
摘要： PROBLEM TO BE SOLVED: To provide a micromirror capable of dual axis scanning in which a pattern formation on torsion bars is unnecessary. SOLUTION: The micromirror includes: a pair of first torsion bars formed to project from a reflecting mirror; a first supporting frame which supports the reflecting mirror rockably around a first axis via the pair of first torsion bars; a pair of second torsion bars so formed to project from the first supporting frame and intersect with the pair of the first torsion bars at right angle; and a second supporting frame which supports the first supporting frame rockably around a second axis which intersect with the first axis at right angle via the pair of the second torsion bars, wherein the respective second torsion bars are composed of first and second signal transmitting members which are insulated from each other. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够进行双轴扫描的微镜，其中不需要在扭杆上形成图案。解决方案：微镜包括：形成为从反射镜突出的一对第一扭杆; 第一支撑框架，其通过所述一对第一扭杆将所述反射镜可摆动地绕第一轴线摆动; 一对第二扭杆，其形成为从第一支撑框架突出并且与所述一对第一扭杆以直角相交; 以及第二支撑框架，所述第二支撑框架通过所述一对所述第二扭杆以直角与所述第一轴线相交的第二轴线可摆动地支撑所述第一支撑框架，其中所述第二扭杆由第一和第二信号传递构件彼此绝缘。版权所有（C）2007，JPO＆INPIT

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