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1. 发明授权

US5063582A Liquid cooled X-ray lithographic exposure apparatus 失效
标题翻译：液体冷却X射线光刻曝光装置
公开(公告)号：US5063582A
公开(公告)日：1991-11-05
申请号：US658434
申请日：1991-02-20
申请人： Tetsuzo Mori , Eiji Sakamoto , Shinichi Hara , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa
发明人： Tetsuzo Mori , Eiji Sakamoto , Shinichi Hara , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa
IPC分类号： G03F7/20
CPC分类号： G03F7/709 , G03F7/707 , G03F7/70716 , G03F7/70866 , G03F7/70875
摘要： The present invention relates to a temperature control system for a lithographic exposure apparatus wherein a mask and wafer are closely disposed, and predetermined exposure energy is applied to respective shot areas of the wafer through the mask. The exposure energy is a soft-X-ray source, for example. The pattern of the mask is transferred onto the respective shot areas in a step-and-repeat manner. In the apparatus, a temperature control medium liquid is supplied into the wafer chuck which supports the wafer at the exposure position. The flow rate of the temperature control liquid is different during an exposure operation than during a non-exposure-operation. The flow control is determined in consideration of the wafer chuck vibration attributable to the supply of the liquid medium and also, of the heat generation in the wafer by the exposure energy, so that the vibration of the wafer chuck during the exposure operation is suppressed. Simultaneously the temperature rise of the wafer can also be suppressed. The pattern transfer from the mask to the wafer thus be precisely performed.

2. 发明授权

US5610965A Exposure method 失效
标题翻译：曝光方法
公开(公告)号：US5610965A
公开(公告)日：1997-03-11
申请号：US197569
申请日：1994-02-17
申请人： Makiko Mori , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Eiji Sakamoto
发明人： Makiko Mori , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Eiji Sakamoto
IPC分类号： G03F1/76 , G03F7/20 , H01L21/027 , G21K5/00
CPC分类号： G03F7/70866 , G03F7/70875
摘要： A method of exposing a wafer to exposure energy such as ultraviolet rays or X-rays through a mask to transfer a pattern of the mask onto the wafer, for example. The temperature of the mask and/or the wafer increases during the exposure operation by absorption of the exposure energy. While the wafer is being exposed, the temperature of the mask and/or the wafer is detected. If the temperature is going to exceed an exposable temperature range determined on the basis of the line width of the pattern to be transferred, the exposure operation is interrupted. Then, the heat accumulated in the mask and/or the wafer is removed. Thereafter, the exposure operation is resumed. This is repeated until the predetermined or required amount of exposure is reached, for one shot. By this, thermal expansion of the mask and the wafer during the exposure operation is prevented to assure the precision of the pattern transfer.
摘要翻译：例如，通过掩模将晶片暴露于诸如紫外线或X射线的曝光能量以将掩模的图案转印到晶片上的方法。掩模和/或晶片的温度在曝光操作期间通过吸收曝光能量而增加。当晶片被暴露时，检测掩模和/或晶片的温度。如果温度超过基于要传送的图案的线宽确定的可曝光温度范围，则曝光操作被中断。然后，除去积存在掩模和/或晶片中的热量。此后，恢复曝光操作。一直重复直到达到预定或所需的曝光量。由此，防止曝光操作期间的掩模和晶片的热膨胀，从而确保图案转印的精度。

3. 发明授权

US5157700A Exposure apparatus for controlling intensity of exposure radiation 失效
标题翻译：用于控制接触辐射强度的曝光装置
公开(公告)号：US5157700A
公开(公告)日：1992-10-20
申请号：US401615
申请日：1989-08-31
申请人： Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
发明人： Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
IPC分类号： G03F7/20
CPC分类号： G03F7/70691 , G03F7/70058 , G03F7/70091 , G03F7/702
摘要： An exposure apparatus usable with synchrotron radiation source wherein the synchrotron radiation is generated by electron injection into a ring. The exposure apparatus is to transfer a semiconductor element pattern of a mask onto a semiconductor wafer by the synchrotron radiation. The apparatus includes a shutter for controlling the exposure of the wafer. The shutter controls the exposure with the illuminance distribution on the wafer surface taken into account. The illuminance distribution is determined in response to the electron injection, and thereafter, the illuminance distribution is corrected in a predetermined manner. By this, the illuminance distribution data for controlling the shutter always correspond to the actual illuminance distribution. The entire shot areas of the semiconductor wafer are exposed with high precision.

4. 发明授权

US5008703A Exposure apparatus and control of the same 失效
标题翻译：曝光装置和控制相同
公开(公告)号：US5008703A
公开(公告)日：1991-04-16
申请号：US407434
申请日：1989-09-06
申请人： Eigo Kawakami , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa
发明人： Eigo Kawakami , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa
IPC分类号： G03F7/20 , H01L21/027 , H01L21/30
CPC分类号： G03F7/7075 , G03F7/709
摘要： Exposure apparatus and control of the same, for exposing a semiconductor wafer to a mask with a predetermined radiation energy, for manufacture of semiconductor devices, is disclosed. During a time period in which the mask-to-wafer alignment or the exposure of the wafer to the mask is made, the operation of any other driving device that has no participation in the aligning operation or the exposure operation, is prohibited. This ensures high-precision pattern printing.

5. 发明授权

US5001734A SOR exposure system 失效
标题翻译： SOR曝光系统
公开(公告)号：US5001734A
公开(公告)日：1991-03-19
申请号：US401791
申请日：1989-09-01
申请人： Koji Uda , Yutaka Tanaka , Tetsuzo Mori , Isamu Shimoda , Shunichi Uzawa
发明人： Koji Uda , Yutaka Tanaka , Tetsuzo Mori , Isamu Shimoda , Shunichi Uzawa
IPC分类号： H05H13/04 , G03F7/20 , H01L21/027 , H01L21/30
CPC分类号： G03F7/70525 , G03F7/70808 , G03F7/70841 , G03F7/70883 , G03F7/709 , G03F7/70991
摘要： Synchrotron orbital radiation (SOR) exposure system includes a SOR ring and a plurality of exposure apparatus each being coupled to the SOR ring and being arranged to expose a wafer to a mask pattern with X-rays contained in synchrotron radiation from the SOR ring to thereby print the mask pattern on the wafer. Specific arrangement is provided to allow communication of a control of the SOR ring and respective controls of the exposure apparatuses. If any abnormality such as vacuum leakage occurs in one exposure apparatus, the information is transmitted to all the controls to start, in all the exposure apparatuses, appropriate operations to protect the exposure apparatuses against the abnormality. This makes it possible to prevent stoppage of the SOR exposure system as a whole even when any abnormality occurs in one exposure apparatus.

6. 发明授权

US5231291A Wafer table and exposure apparatus with the same 失效
标题翻译：晶圆台和曝光装置相同
公开(公告)号：US5231291A
公开(公告)日：1993-07-27
申请号：US821888
申请日：1992-01-17
申请人： Mitsuaki Amemiya , Eiji Sakamoto , Koji Uda , Kunitaka Ozawa , Kazunori Iwamoto , Shunichi Uzawa , Mitsuji Marumo
发明人： Mitsuaki Amemiya , Eiji Sakamoto , Koji Uda , Kunitaka Ozawa , Kazunori Iwamoto , Shunichi Uzawa , Mitsuji Marumo
IPC分类号： G03F7/20 , H01L21/00 , H01L21/687
CPC分类号： H01L21/67109 , G03F7/2041 , G03F7/707 , G03F7/70866 , G03F7/70875
摘要： A wafer table includes a wafer holding surface for holding a wafer by attraction; a flow passageway through which a temperature adjusting medium flows to remove any heat in the wafer table; a temperature measuring system for measuring the temperature of the wafer held by the wafer holding surface; a temperature adjusting system disposed between the wafer holding surface and the flow passageway; a temperature setting system for setting a temperature related to the wafer held by the wafer holding surface; a flow rate controlling system for controlling the flow rate of the temperature adjusting medium to be circulated through the flow passageway; and a temperature controlling system for controlling the operation of the temperature adjusting system related to heat, on the basis of a value set by the temperature setting system and a value measured by the temperature measuring system.
摘要翻译：晶片台包括用于通过吸引保持晶片的晶片保持表面; 流动通道，温度调节介质通过该通道流动以去除晶片台中的任何热量; 用于测量由晶片保持表面保持的晶片的温度的温度测量系统; 设置在晶片保持表面和流动通道之间的温度调节系统; 用于设定与晶片保持面保持的晶片有关的温度的温度设定系统; 流量控制系统，用于控制温度调节介质流过所述流动通道的流量; 以及温度控制系统，用于基于由温度设定系统设定的值和由温度测量系统测量的值来控制与热量相关的温度调节系统的操作。

7. 发明授权

US4969168A Wafer supporting apparatus 失效
标题翻译：晶圆支撑装置
公开(公告)号：US4969168A
公开(公告)日：1990-11-06
申请号：US401654
申请日：1989-08-31
申请人： Eiji Sakamoto , Shinichi Hara , Isamu Shimoda , Shunichi Uzawa
发明人： Eiji Sakamoto , Shinichi Hara , Isamu Shimoda , Shunichi Uzawa
IPC分类号： G03F7/20 , H01L21/027 , H01L21/30 , H01L21/683
CPC分类号： G03F7/707 , G03F7/70866 , G03F7/70875 , H01L21/6833 , H01L21/6838
摘要： A wafer chuck usable with a semiconductor exposure apparatus wherein a mask and a semiconductor wafer are placed in a vacuum ambience or a pressure-reduced gas ambience, and wherein the wafer is exposed through the mask to radiation energy such as X-rays contained in a synchrotron radiation beam, by which the pattern of the mask is transferred onto the wafer. The wafer is first attracted on the wafer supporting surface of the chuck by vacuum attraction, and thereafter, the wafer is attracted by the electrostatic attraction force. Thereafter, the vacuum attraction is broken by supplying a gas. When the pattern of the mask is transferred onto the wafer, the wafer is retained on the wafer supporting surface by the electrostatic attraction force only. By this, the sheet-like member (wafer) supporting apparatus can correctly contact the wafer supporting surface to the wafer without being influenced by the undulation of the wafer. In addition, the heat produced in the wafer during exposure can be removed efficiently by temperature controlled water supplied to the wafer supporting apparatus.

8. 发明授权

US5498501A Exposure method 失效
标题翻译：曝光方法
公开(公告)号：US5498501A
公开(公告)日：1996-03-12
申请号：US416503
申请日：1995-04-04
申请人： Isamu Shimoda , Takao Kariya , Nobutoshi Mizusawa , Kunitaka Ozawa , Shunichi Uzawa
发明人： Isamu Shimoda , Takao Kariya , Nobutoshi Mizusawa , Kunitaka Ozawa , Shunichi Uzawa
IPC分类号： G03F7/20 , G03F9/00
CPC分类号： G03F7/70066 , G03F7/2022 , G03F7/7045 , Y10S438/949
摘要： A method of manufacturing of semiconductor devices, includes exposing different portions of a semiconductor substrate with a first exposure apparatus having a first exposure range; placing and aligning the semiconductor substrate with respect to a second exposure range of a second exposure apparatus, which range is larger than the first exposure range of the first exposure apparatus; detecting an alignment error of each of the portions of the semiconductor substrate as covered by the second exposure range of the second exposure apparatus; calculating an overall alignment error of those portions of the semiconductor substrate with respect to the entire second exposure range of the second exposure apparatus, on the basis of the detected alignment errors; and controlling the exposure operation of the second exposure apparatus on the basis of the calculated overall alignment error.
摘要翻译：一种半导体器件的制造方法，包括用具有第一曝光范围的第一曝光装置曝光半导体衬底的不同部分; 将半导体衬底相对于第二曝光装置的第二曝光范围放置和对准，该范围大于第一曝光装置的第一曝光范围; 检测由第二曝光装置的第二曝光范围所覆盖的半导体衬底的每个部分的对准误差; 基于检测到的对准误差，计算半导体衬底的这些部分相对于第二曝光装置的整个第二曝光范围的总体对准误差; 并根据计算的整体对准误差来控制第二曝光装置的曝光操作。

9. 发明授权

US5226523A Conveying apparatus and method of controlling the same 失效
标题翻译：输送装置及其控制方法
公开(公告)号：US5226523A
公开(公告)日：1993-07-13
申请号：US963517
申请日：1992-10-20
申请人： Eigo Kawakami , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Mitsutoshi Kuno , Kazunori Iwamoto , Takao Kariya
发明人： Eigo Kawakami , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Mitsutoshi Kuno , Kazunori Iwamoto , Takao Kariya
IPC分类号： G03F7/20 , G05B19/23
CPC分类号： G03F7/70741 , G03F7/7075 , G05B19/231
摘要： A conveying apparatus includes a plurality of position limiting devices provided along the direction of conveyance and a selecting device operable to select one of or those of the plurality of position limiting devices which are effective in view of a target position, before a start of conveyance. The selecting device is further operable to select, again, one of or those of the plurality of position limiting devices which are effective in view of the current position of an article being conveyed, after a start of conveyance.
摘要翻译：传送装置包括沿着传送方向设置的多个位置限制装置，以及选择装置，可操作以在开始传送之前选择在目标位置有效的多个位置限制装置中的一个或那些位置限制装置。选择装置还可操作以在开始运送之后再次选择多个位置限制装置中的一个或那些位置限制装置中的一个或那些位置限制装置，其在待传送物品的当前位置有效。

10. 发明授权

US5182615A Exposure apparatus 失效
标题翻译：曝光装置
公开(公告)号：US5182615A
公开(公告)日：1993-01-26
申请号：US563420
申请日：1990-08-07
申请人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
发明人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
IPC分类号： G03F7/20 , G03F9/00
CPC分类号： G03F7/70691 , G03F9/7049
摘要： An exposure apparatus for printing a pattern of a mask to a wafer includes a mask moving mechanism for moving the mask; a wafer moving mechanism or moving the wafer along a predetermined movement coordinate; a measuring system for measuring an error with respect to the movement coordinate, resulting from the movement of the mask by the mask moving mechanism; and a memorizing device for memorizing a data table prepared on the basis of the error measured by the measuring system; wherein the wafer moving mechanism uses the data in the data table when it moves the wafer for positioning of the wafer with respect to the mask.

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