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1. 发明授权

US5610965A Exposure method 失效
标题翻译：曝光方法
公开(公告)号：US5610965A
公开(公告)日：1997-03-11
申请号：US197569
申请日：1994-02-17
申请人： Makiko Mori , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Eiji Sakamoto
发明人： Makiko Mori , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Eiji Sakamoto
IPC分类号： G03F1/76 , G03F7/20 , H01L21/027 , G21K5/00
CPC分类号： G03F7/70866 , G03F7/70875
摘要： A method of exposing a wafer to exposure energy such as ultraviolet rays or X-rays through a mask to transfer a pattern of the mask onto the wafer, for example. The temperature of the mask and/or the wafer increases during the exposure operation by absorption of the exposure energy. While the wafer is being exposed, the temperature of the mask and/or the wafer is detected. If the temperature is going to exceed an exposable temperature range determined on the basis of the line width of the pattern to be transferred, the exposure operation is interrupted. Then, the heat accumulated in the mask and/or the wafer is removed. Thereafter, the exposure operation is resumed. This is repeated until the predetermined or required amount of exposure is reached, for one shot. By this, thermal expansion of the mask and the wafer during the exposure operation is prevented to assure the precision of the pattern transfer.
摘要翻译：例如，通过掩模将晶片暴露于诸如紫外线或X射线的曝光能量以将掩模的图案转印到晶片上的方法。掩模和/或晶片的温度在曝光操作期间通过吸收曝光能量而增加。当晶片被暴露时，检测掩模和/或晶片的温度。如果温度超过基于要传送的图案的线宽确定的可曝光温度范围，则曝光操作被中断。然后，除去积存在掩模和/或晶片中的热量。此后，恢复曝光操作。一直重复直到达到预定或所需的曝光量。由此，防止曝光操作期间的掩模和晶片的热膨胀，从而确保图案转印的精度。

2. 发明授权

US5157700A Exposure apparatus for controlling intensity of exposure radiation 失效
标题翻译：用于控制接触辐射强度的曝光装置
公开(公告)号：US5157700A
公开(公告)日：1992-10-20
申请号：US401615
申请日：1989-08-31
申请人： Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
发明人： Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
IPC分类号： G03F7/20
CPC分类号： G03F7/70691 , G03F7/70058 , G03F7/70091 , G03F7/702
摘要： An exposure apparatus usable with synchrotron radiation source wherein the synchrotron radiation is generated by electron injection into a ring. The exposure apparatus is to transfer a semiconductor element pattern of a mask onto a semiconductor wafer by the synchrotron radiation. The apparatus includes a shutter for controlling the exposure of the wafer. The shutter controls the exposure with the illuminance distribution on the wafer surface taken into account. The illuminance distribution is determined in response to the electron injection, and thereafter, the illuminance distribution is corrected in a predetermined manner. By this, the illuminance distribution data for controlling the shutter always correspond to the actual illuminance distribution. The entire shot areas of the semiconductor wafer are exposed with high precision.

3. 发明授权

US5063582A Liquid cooled X-ray lithographic exposure apparatus 失效
标题翻译：液体冷却X射线光刻曝光装置
公开(公告)号：US5063582A
公开(公告)日：1991-11-05
申请号：US658434
申请日：1991-02-20
申请人： Tetsuzo Mori , Eiji Sakamoto , Shinichi Hara , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa
发明人： Tetsuzo Mori , Eiji Sakamoto , Shinichi Hara , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa
IPC分类号： G03F7/20
CPC分类号： G03F7/709 , G03F7/707 , G03F7/70716 , G03F7/70866 , G03F7/70875
摘要： The present invention relates to a temperature control system for a lithographic exposure apparatus wherein a mask and wafer are closely disposed, and predetermined exposure energy is applied to respective shot areas of the wafer through the mask. The exposure energy is a soft-X-ray source, for example. The pattern of the mask is transferred onto the respective shot areas in a step-and-repeat manner. In the apparatus, a temperature control medium liquid is supplied into the wafer chuck which supports the wafer at the exposure position. The flow rate of the temperature control liquid is different during an exposure operation than during a non-exposure-operation. The flow control is determined in consideration of the wafer chuck vibration attributable to the supply of the liquid medium and also, of the heat generation in the wafer by the exposure energy, so that the vibration of the wafer chuck during the exposure operation is suppressed. Simultaneously the temperature rise of the wafer can also be suppressed. The pattern transfer from the mask to the wafer thus be precisely performed.

4. 发明授权

US5008703A Exposure apparatus and control of the same 失效
标题翻译：曝光装置和控制相同
公开(公告)号：US5008703A
公开(公告)日：1991-04-16
申请号：US407434
申请日：1989-09-06
申请人： Eigo Kawakami , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa
发明人： Eigo Kawakami , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa
IPC分类号： G03F7/20 , H01L21/027 , H01L21/30
CPC分类号： G03F7/7075 , G03F7/709
摘要： Exposure apparatus and control of the same, for exposing a semiconductor wafer to a mask with a predetermined radiation energy, for manufacture of semiconductor devices, is disclosed. During a time period in which the mask-to-wafer alignment or the exposure of the wafer to the mask is made, the operation of any other driving device that has no participation in the aligning operation or the exposure operation, is prohibited. This ensures high-precision pattern printing.

5. 发明授权

US5231291A Wafer table and exposure apparatus with the same 失效
标题翻译：晶圆台和曝光装置相同
公开(公告)号：US5231291A
公开(公告)日：1993-07-27
申请号：US821888
申请日：1992-01-17
申请人： Mitsuaki Amemiya , Eiji Sakamoto , Koji Uda , Kunitaka Ozawa , Kazunori Iwamoto , Shunichi Uzawa , Mitsuji Marumo
发明人： Mitsuaki Amemiya , Eiji Sakamoto , Koji Uda , Kunitaka Ozawa , Kazunori Iwamoto , Shunichi Uzawa , Mitsuji Marumo
IPC分类号： G03F7/20 , H01L21/00 , H01L21/687
CPC分类号： H01L21/67109 , G03F7/2041 , G03F7/707 , G03F7/70866 , G03F7/70875
摘要： A wafer table includes a wafer holding surface for holding a wafer by attraction; a flow passageway through which a temperature adjusting medium flows to remove any heat in the wafer table; a temperature measuring system for measuring the temperature of the wafer held by the wafer holding surface; a temperature adjusting system disposed between the wafer holding surface and the flow passageway; a temperature setting system for setting a temperature related to the wafer held by the wafer holding surface; a flow rate controlling system for controlling the flow rate of the temperature adjusting medium to be circulated through the flow passageway; and a temperature controlling system for controlling the operation of the temperature adjusting system related to heat, on the basis of a value set by the temperature setting system and a value measured by the temperature measuring system.
摘要翻译：晶片台包括用于通过吸引保持晶片的晶片保持表面; 流动通道，温度调节介质通过该通道流动以去除晶片台中的任何热量; 用于测量由晶片保持表面保持的晶片的温度的温度测量系统; 设置在晶片保持表面和流动通道之间的温度调节系统; 用于设定与晶片保持面保持的晶片有关的温度的温度设定系统; 流量控制系统，用于控制温度调节介质流过所述流动通道的流量; 以及温度控制系统，用于基于由温度设定系统设定的值和由温度测量系统测量的值来控制与热量相关的温度调节系统的操作。

6. 发明授权

US5112133A Alignment system 失效
标题翻译：对齐系统
公开(公告)号：US5112133A
公开(公告)日：1992-05-12
申请号：US769495
申请日：1991-10-01
申请人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Ryuichi Ebinuma , Takao Kariya
发明人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Ryuichi Ebinuma , Takao Kariya
IPC分类号： G03F9/00 , H01L21/027 , H01L21/30 , H01L21/68
CPC分类号： G03F9/70 , H01L21/681 , H01L21/682 , Y10T307/786
摘要： An alignment system usable in an exposure apparatus for printing a pattern of a mask on a wafer, for aligning the mask and the wafer, is disclosed. The system includes a plurality of position detecting devices; a plurality of driving stages corresponding to the position detecting devices, respectively, each driving stage being adapted to move a corresponding one of the position detecting devices two-dimensionally along a plane which is substantially opposed to the mask; a plurality of contacts corresponding to the position detecting devices, respectively, each contact being provided at an end portion of a corresponding one of the position detecting devices, along the plane and facing the pattern side; a detecting device for detecting mutual approach of the position detecting devices through at least one of the contacts; and a control device for controlling movement of at least one of the driving stages in accordance with the detection by the detecting device.

7. 发明授权

US5182615A Exposure apparatus 失效
标题翻译：曝光装置
公开(公告)号：US5182615A
公开(公告)日：1993-01-26
申请号：US563420
申请日：1990-08-07
申请人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
发明人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
IPC分类号： G03F7/20 , G03F9/00
CPC分类号： G03F7/70691 , G03F9/7049
摘要： An exposure apparatus for printing a pattern of a mask to a wafer includes a mask moving mechanism for moving the mask; a wafer moving mechanism or moving the wafer along a predetermined movement coordinate; a measuring system for measuring an error with respect to the movement coordinate, resulting from the movement of the mask by the mask moving mechanism; and a memorizing device for memorizing a data table prepared on the basis of the error measured by the measuring system; wherein the wafer moving mechanism uses the data in the data table when it moves the wafer for positioning of the wafer with respect to the mask.

8. 发明授权

US5226523A Conveying apparatus and method of controlling the same 失效
标题翻译：输送装置及其控制方法
公开(公告)号：US5226523A
公开(公告)日：1993-07-13
申请号：US963517
申请日：1992-10-20
申请人： Eigo Kawakami , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Mitsutoshi Kuno , Kazunori Iwamoto , Takao Kariya
发明人： Eigo Kawakami , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Mitsutoshi Kuno , Kazunori Iwamoto , Takao Kariya
IPC分类号： G03F7/20 , G05B19/23
CPC分类号： G03F7/70741 , G03F7/7075 , G05B19/231
摘要： A conveying apparatus includes a plurality of position limiting devices provided along the direction of conveyance and a selecting device operable to select one of or those of the plurality of position limiting devices which are effective in view of a target position, before a start of conveyance. The selecting device is further operable to select, again, one of or those of the plurality of position limiting devices which are effective in view of the current position of an article being conveyed, after a start of conveyance.
摘要翻译：传送装置包括沿着传送方向设置的多个位置限制装置，以及选择装置，可操作以在开始传送之前选择在目标位置有效的多个位置限制装置中的一个或那些位置限制装置。选择装置还可操作以在开始运送之后再次选择多个位置限制装置中的一个或那些位置限制装置中的一个或那些位置限制装置，其在待传送物品的当前位置有效。

9. 发明授权

US5459573A Light quantity controlling apparatus 失效
标题翻译：光量控制装置
公开(公告)号：US5459573A
公开(公告)日：1995-10-17
申请号：US291747
申请日：1994-08-17
申请人： Naoto Abe , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Noriyuki Nose
发明人： Naoto Abe , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Noriyuki Nose
IPC分类号： G01B11/00 , G01D5/26 , G03F9/00 , H01L21/68 , H01L31/12 , H01L33/00 , H01S5/06 , H01S5/062 , H01S5/0683 , G01N21/86
CPC分类号： G03F9/7088 , G03F9/7049 , H01L21/68 , H01L21/682 , H01S5/06835 , H01S5/06216
摘要： A position detecting apparatus usable for aligning mask and a semiconductor wafer, wherein a laser beam produced by a semiconductor laser is projected through a predetermined optical system to alignment marks formed on the mask and the wafer, and the light reflected by the marks are detected by an accumulation type sensor to produce an electrical signal, from which the relative positional relation between the mask and the wafer are detected on the basis of the electrical signal. To obtain proper mark signals, the quantity of light incident on the accumulation sensor is controlled. In this apparatus, the beam emitting strength of the semiconductor laser is made constant, and the control of thee amount of light incident on the accumulation sensor is effected by controlling the operation period of the semiconductor laser. In addition, the actuation timing of the semiconductor laser is advanced from the accumulation start of the accumulation type sensor by the time required for the semiconductor laser to be thermally stabilized after its actuation. The mark detection signal produced by the accumulation sensor is precise.
摘要翻译：一种可用于对准掩模和半导体晶片的位置检测装置，其中由半导体激光器产生的激光束通过预定的光学系统投射到形成在掩模和晶片上的对准标记，并且由标记反射的光被用于产生电信号的累积型传感器，根据电信号检测掩模和晶片之间的相对位置关系。为了获得适当的标记信号，控制入射在累积传感器上的光量。在该装置中，半导体激光器的发射光强度保持恒定，并且通过控制半导体激光器的工作周期来控制入射到积聚传感器上的光量。此外，半导体激光器的激活定时从累积型传感器的累积开始到半导体激光器在其致动之后被热稳定所需的时间前进。由积累传感器产生的标记检测信号是精确的。

10. 发明授权

US5001734A SOR exposure system 失效
标题翻译： SOR曝光系统
公开(公告)号：US5001734A
公开(公告)日：1991-03-19
申请号：US401791
申请日：1989-09-01
申请人： Koji Uda , Yutaka Tanaka , Tetsuzo Mori , Isamu Shimoda , Shunichi Uzawa
发明人： Koji Uda , Yutaka Tanaka , Tetsuzo Mori , Isamu Shimoda , Shunichi Uzawa
IPC分类号： H05H13/04 , G03F7/20 , H01L21/027 , H01L21/30
CPC分类号： G03F7/70525 , G03F7/70808 , G03F7/70841 , G03F7/70883 , G03F7/709 , G03F7/70991
摘要： Synchrotron orbital radiation (SOR) exposure system includes a SOR ring and a plurality of exposure apparatus each being coupled to the SOR ring and being arranged to expose a wafer to a mask pattern with X-rays contained in synchrotron radiation from the SOR ring to thereby print the mask pattern on the wafer. Specific arrangement is provided to allow communication of a control of the SOR ring and respective controls of the exposure apparatuses. If any abnormality such as vacuum leakage occurs in one exposure apparatus, the information is transmitted to all the controls to start, in all the exposure apparatuses, appropriate operations to protect the exposure apparatuses against the abnormality. This makes it possible to prevent stoppage of the SOR exposure system as a whole even when any abnormality occurs in one exposure apparatus.

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