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    • 1. 发明授权
    • Narrow bitline using Safier for mirrorbit
    • 使用Safier进行镜像位的窄位线
    • US06872609B1
    • 2005-03-29
    • US10755430
    • 2004-01-12
    • Tazrien KamalWeidong QianKouros GhandehariTaraneh Jamali-Beh
    • Tazrien KamalWeidong QianKouros GhandehariTaraneh Jamali-Beh
    • H01L21/337H01L21/8246H01L27/115
    • H01L27/11568H01L27/115
    • A technique for forming at least part of an array of a dual bit memory core is disclosed. A Safier material is utilized in the formation process to reduce the size of buried bitlines in the memory, which is suitable for use in storing data for computers and the like. The smaller (e.g., narrower) bitlines facilitate increased packing densities while maintaining an effective channel length between the bitlines. The separation between the bitlines allows dual bits that are stored above the channel within a charge trapping layer to remain sufficiently separated so as to not interfere with one another. In this manner, one bit can be operated on (e.g., for read, write or erase operations) without substantially or adversely affecting the other bit. Additionally, bit separation is preserved and leakage currents, cross talk, as well as other adverse effects that can result from narrow channels are mitigated, and the memory device is allowed to operate as desired.
    • 公开了一种用于形成双位存储器核心的阵列的至少一部分的技术。 在形成过程中采用Safier材料以减小存储器中的埋置位线的尺寸,其适用于存储用于计算机等的数据。 较小(例如较窄)的位线有助于增加打包密度,同时保持位线之间的有效通道长度。 位线之间的间隔允许存储在电荷俘获层内的通道上方的双位保持充分分离,以便彼此不干扰。 以这种方式,一个位可以被操作(例如,用于读取,写入或擦除操作)而基本上或不利地影响另一个位。 此外,保留位分离,并且减轻了可能由窄通道产生的漏电流,串扰以及其他不利影响,并且允许存储器件根据需要进行操作。
    • 2. 发明授权
    • Hard mask spacer for sublithographic bitline
    • 用于亚光刻位线的硬掩模垫片
    • US06962849B1
    • 2005-11-08
    • US10729732
    • 2003-12-05
    • Tazrien KamalWeidong QianKouros GhandehariTaraneh Jamali-BehMark T. RamsbeyAshok M. Khathuria
    • Tazrien KamalWeidong QianKouros GhandehariTaraneh Jamali-BehMark T. RamsbeyAshok M. Khathuria
    • H01L21/336H01L21/8247H01L27/115
    • H01L27/115H01L27/11521
    • A technique for forming at least part of an array of a dual bit memory core is disclosed. Spacers are utilized in the formation process to reduce the size of buried bitlines in the memory, which is suitable for use in storing data for computers and the like. The smaller (e.g., narrower) bitlines facilitate increased packing densities while maintaining an effective channel length between the bitlines. The separation between the bitlines allows dual bits that are stored above the channel within a charge trapping layer to remain sufficiently separated so as to not interfere with one another. In this manner, one bit can be operated on (e.g., for read, write or erase operations) without substantially or adversely affecting the other bit. Additionally, bit separation is preserved and leakage currents, cross talk, as well as other adverse effects that can result from narrow channels are mitigated, and the memory device is allowed to operate as desired.
    • 公开了一种用于形成双位存储器核心的阵列的至少一部分的技术。 在形成过程中使用间隔物来减小存储器中的掩埋位线的尺寸,这适用于存储用于计算机等的数据。 较小(例如较窄)的位线有助于增加打包密度,同时保持位线之间的有效通道长度。 位线之间的间隔允许存储在电荷俘获层内的通道上方的双位保持充分分离,以便彼此不干扰。 以这种方式,一个位可以被操作(例如,用于读取,写入或擦除操作)而基本上或不利地影响另一个位。 此外,保留位分离,并且减轻了可能由窄通道产生的漏电流,串扰以及其他不利影响,并且允许存储器件根据需要进行操作。
    • 4. 发明授权
    • Memory with disposable ARC for wordline formation
    • 具有一次性ARC用于字线形成的记忆
    • US06620717B1
    • 2003-09-16
    • US10100487
    • 2002-03-14
    • Tazrien KamalScott A. BellKouros GhandehariMark T. RamsbeyJeffrey A. ShieldsJean Y. Yang
    • Tazrien KamalScott A. BellKouros GhandehariMark T. RamsbeyJeffrey A. ShieldsJean Y. Yang
    • H01L213205
    • H01L27/11568H01L21/32139H01L27/115
    • A method of manufacturing for a Flash memory includes depositing a charge-trapping material over a semiconductor substrate and implanting first and second bitlines. A wordline material is deposited over the charge-trapping dielectric material and a hard mask material deposited. A disposable anti-reflective coating (ARC) material and a photoresist material are deposited followed by processing to form a patterned photoresist material and a patterned ARC material. The hard mask material is processed to form a patterned hard mask material. The patterned photoresist is removed and then the patterned ARC without damaging the patterned hard mask material or the wordline material. The wordline material is processed using the patterned hard mask material to form a wordline and the patterned hard mask material is removed without damaging the wordline or the charge-trapping dielectric material.
    • 一种用于闪速存储器的制造方法包括在半导体衬底上沉积电荷捕获材料并植入第一和第二位线。 字线材料沉积在电荷捕获电介质材料上并沉积硬掩模材料。 沉积一次性抗反射涂层(ARC)材料和光致抗蚀剂材料,然后进行处理以形成图案化的光致抗蚀剂材料和图案化的ARC材料。 加工硬掩模材料以形成图案化的硬掩模材料。 去除图案化的光致抗蚀剂,然后去除图案化的ARC,而不损坏图案化的硬掩模材料或字线材料。 使用图案化的硬掩模材料处理字线材料以形成字线,并且去除图案化的硬掩模材料而不损坏字线或电荷捕获电介质材料。
    • 5. 发明授权
    • Flash memory with controlled wordline width
    • 具有受控字线宽度的闪存
    • US06653190B1
    • 2003-11-25
    • US10023436
    • 2001-12-15
    • Jean Y. YangKouros GhandehariTazrien KamalMinh Van NgoMark T. RamsbeyDawn M. HopperAngela T. HuiScott A. Bell
    • Jean Y. YangKouros GhandehariTazrien KamalMinh Van NgoMark T. RamsbeyDawn M. HopperAngela T. HuiScott A. Bell
    • H01L21336
    • H01L27/11568H01L27/115
    • A method of manufacturing for a MirrorBit® Flash memory includes depositing a charge-trapping material over a semiconductor substrate and implanting first and second bitlines in the semiconductor substrate. A wordline material is deposited over the charge-trapping dielectric material and a hard mask material deposited thereon. An anti-reflective coating (ARC) material is deposited on the hard mask material and a photoresist material is deposited on the ARC followed by processing the photoresist material and the ARC material to form a photomask of a patterned photoresist and a patterned ARC. The hard mask material is processed using the photomask to form a hard mask. The patterned photoresist is removed and then the patterned ARC without damaging the hard mask or the wordline material. The wordline material is processed using the hard mask to form a wordline and the hard mask is removed without damaging the wordline or the charge-trapping material.
    • 用于MirrorBit(闪存)闪存的制造方法包括在半导体衬底上沉积电荷捕获材料并在半导体衬底中注入第一和第二位线。 字线材料沉积在电荷俘获电介质材料上并沉积在其上的硬掩模材料。 将抗反射涂层(ARC)材料沉积在硬掩模材料上,并且将光致抗蚀剂材料沉积在ARC上,随后处理光致抗蚀剂材料和ARC材料以形成图案化光致抗蚀剂和图案化ARC的光掩模。 使用光掩模处理硬掩模材料以形成硬掩模。 去除图案化的光致抗蚀剂,然后去除图案化的ARC,而不损坏硬掩模或字线材料。 使用硬掩模处理字线材料以形成字线,并且去除硬掩模而不损坏字线或电荷捕获材料。
    • 7. 发明授权
    • Method for forming bit lines for semiconductor devices
    • 用于形成半导体器件的位线的方法
    • US07811915B2
    • 2010-10-12
    • US12048549
    • 2008-03-14
    • Weidong QianMark T. RamsbeyTazrien Kamal
    • Weidong QianMark T. RamsbeyTazrien Kamal
    • H01L21/22
    • H01L27/115H01L27/11521H01L27/11568
    • A method for forming a semiconductor device includes forming a first dielectric layer over a first portion of a substrate, forming a charge storage layer over the first dielectric layer and etching a trench in the charge storage layer and the first dielectric layer, where the trench extends to the substrate. The method also includes implanting n-type impurities into the substrate to form an n-type region having a first depth and a first width and implanting p-type impurities into the substrate after implanting the n-type impurities, the p-type impurities forming a p-type region having a second depth and a second width. The method further includes forming a second dielectric layer over the charge storage layer and forming a control gate over the second dielectric layer.
    • 一种形成半导体器件的方法包括在衬底的第一部分上形成第一介电层,在第一介电层上形成电荷存储层,并蚀刻电荷存储层和第一介电层中的沟槽,其中沟槽延伸 到基底。 该方法还包括将n型杂质注入到衬底中以形成具有第一深度和第一宽度的n型区域,并且在植入n型杂质之后将p型杂质注入到衬底中,形成p型杂质 具有第二深度和第二宽度的p型区域。 该方法还包括在电荷存储层上形成第二电介质层,并在第二电介质层上形成控制栅极。