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    • 5. 发明授权
    • Memory with disposable ARC for wordline formation
    • 具有一次性ARC用于字线形成的记忆
    • US06620717B1
    • 2003-09-16
    • US10100487
    • 2002-03-14
    • Tazrien KamalScott A. BellKouros GhandehariMark T. RamsbeyJeffrey A. ShieldsJean Y. Yang
    • Tazrien KamalScott A. BellKouros GhandehariMark T. RamsbeyJeffrey A. ShieldsJean Y. Yang
    • H01L213205
    • H01L27/11568H01L21/32139H01L27/115
    • A method of manufacturing for a Flash memory includes depositing a charge-trapping material over a semiconductor substrate and implanting first and second bitlines. A wordline material is deposited over the charge-trapping dielectric material and a hard mask material deposited. A disposable anti-reflective coating (ARC) material and a photoresist material are deposited followed by processing to form a patterned photoresist material and a patterned ARC material. The hard mask material is processed to form a patterned hard mask material. The patterned photoresist is removed and then the patterned ARC without damaging the patterned hard mask material or the wordline material. The wordline material is processed using the patterned hard mask material to form a wordline and the patterned hard mask material is removed without damaging the wordline or the charge-trapping dielectric material.
    • 一种用于闪速存储器的制造方法包括在半导体衬底上沉积电荷捕获材料并植入第一和第二位线。 字线材料沉积在电荷捕获电介质材料上并沉积硬掩模材料。 沉积一次性抗反射涂层(ARC)材料和光致抗蚀剂材料,然后进行处理以形成图案化的光致抗蚀剂材料和图案化的ARC材料。 加工硬掩模材料以形成图案化的硬掩模材料。 去除图案化的光致抗蚀剂,然后去除图案化的ARC,而不损坏图案化的硬掩模材料或字线材料。 使用图案化的硬掩模材料处理字线材料以形成字线,并且去除图案化的硬掩模材料而不损坏字线或电荷捕获电介质材料。
    • 6. 发明授权
    • Method for forming bit lines for semiconductor devices
    • 用于形成半导体器件的位线的方法
    • US07811915B2
    • 2010-10-12
    • US12048549
    • 2008-03-14
    • Weidong QianMark T. RamsbeyTazrien Kamal
    • Weidong QianMark T. RamsbeyTazrien Kamal
    • H01L21/22
    • H01L27/115H01L27/11521H01L27/11568
    • A method for forming a semiconductor device includes forming a first dielectric layer over a first portion of a substrate, forming a charge storage layer over the first dielectric layer and etching a trench in the charge storage layer and the first dielectric layer, where the trench extends to the substrate. The method also includes implanting n-type impurities into the substrate to form an n-type region having a first depth and a first width and implanting p-type impurities into the substrate after implanting the n-type impurities, the p-type impurities forming a p-type region having a second depth and a second width. The method further includes forming a second dielectric layer over the charge storage layer and forming a control gate over the second dielectric layer.
    • 一种形成半导体器件的方法包括在衬底的第一部分上形成第一介电层,在第一介电层上形成电荷存储层,并蚀刻电荷存储层和第一介电层中的沟槽,其中沟槽延伸 到基底。 该方法还包括将n型杂质注入到衬底中以形成具有第一深度和第一宽度的n型区域,并且在植入n型杂质之后将p型杂质注入到衬底中,形成p型杂质 具有第二深度和第二宽度的p型区域。 该方法还包括在电荷存储层上形成第二电介质层,并在第二电介质层上形成控制栅极。