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    • 7. 发明授权
    • Liquid crystal display device having wiring line including first and second layers with second layer having a thickness not greater than 1/2 of a thickness of first layer
    • 具有包括第一层和第二层的布线的液晶显示装置,其第二层具有不大于第一层厚度的1/2的厚度
    • US06392721B1
    • 2002-05-21
    • US09411254
    • 1999-10-04
    • Takahiro OchiaiToshiki KanekoTakuya TakahashiKazumi Fujii
    • Takahiro OchiaiToshiki KanekoTakuya TakahashiKazumi Fujii
    • G02F1136
    • G02F1/136286G02F2001/13629
    • A liquid crystal display device has good contact characteristics between an etched side end portion of a lower layer wiring line and an insulating film and the like, satisfactory step coverage, and satisfactory adhesion to a substrate so that disconnection of an upper layer wiring line and short-circuiting of the lower layer wiring line can be prevented to improve reliability. The liquid crystal display device comprises a wiring line having a laminated structure including a first layer which is made from a first metal layer formed over an insulating substrate and a second layer which is made from a second metal layer different from the first metal layer and is formed over the first metal layer, and the side end face of the first layer has a right-tapered shape with a taper angle of 60° or less, while the side end face of the second layer is approximately perpendicular to or counter-tapered with respect to the insulating substrate. The second layer has a thickness not greater than ½ of that of the first layer.
    • 液晶显示装置在下层布线的蚀刻侧端部与绝缘膜之间具有良好的接触特性,令人满意的台阶覆盖率以及对基板的良好的粘附性,从而使上层布线和短路 可以防止下层布线的电路提高可靠性。 液晶显示装置包括具有叠层结构的布线,该层叠结构包括由绝缘基板上形成的第一金属层制成的第一层和由与第一金属层不同的第二金属层制成的第二层,并且是第 形成在所述第一金属层上,并且所述第一层的侧端面具有锥形角为60°以下的右锥形形状,而所述第二层的侧端面大致垂直于或相对锥度 相对于绝缘基板。 第二层的厚度不大于第一层的厚度的1/2。
    • 8. 发明授权
    • Liquid crystal display device and wiring structure therefor
    • 液晶显示装置及其配线结构
    • US06628361B2
    • 2003-09-30
    • US09790638
    • 2001-02-23
    • Takuya TakahashiYoichi SakakiIsao IkutaKatsumi TamuraKen-ichi Onisawa
    • Takuya TakahashiYoichi SakakiIsao IkutaKatsumi TamuraKen-ichi Onisawa
    • G02F11343
    • G02F1/136286G02F2001/13629G02F2001/136295
    • A wiring structure is provided, the wiring structure being formed by forming a laminated film of silver (Ag) or an alloy containing silver (Ag) as the major constituent and the other metallic material, and by forming a wiring pattern through a single process of photolithography. The wiring structure comprises a plurality of first parallel wires; a plurality of second parallel wires intersecting with the first parallel wires; and a plurality of active elements, each of the active elements being arranged at a position near an intersection of the first parallel wire and the second parallel wire and connected to the first parallel wire and the second parallel wire, wherein part or all of the first parallel wires and the second parallel wires are of a laminated structure of a layer made of silver (Ag) or an alloy containing silver (Ag) as a major constituent and a layer made of a metallic element having standard electrode potential of dissolution reaction lower than the standard electrode potential of silver (Ag) or an alloy containing said metallic element as a major constituent, and are formed through a single process of photolithography.
    • 提供一种布线结构,该布线结构通过以下方式形成:银(Ag)或含有银(Ag)的合金作为主要成分和另一种金属材料的叠层膜,并通过单一工艺形成布线图案 布线结构包括多个第一平行线; 与所述第一平行线相交的多个第二平行线; 以及多个有源元件,所述有源元件中的每一个被布置在靠近所述第一平行线和所述第二平行线的交叉点并且连接到所述第一平行线和所述第二平行线的位置,其中所述第一平行线和所述第二平行线的部分或全部 平行线和第二平行线是由银(Ag)或含有银(Ag)作为主要成分的合金层构成的层的层压结构,以及由金属元素制成的层,其具有溶解反应的标准电极电位低于 银(Ag)或包含所述金属元素作为主要成分的合金的标准电极电位,并且通过单一光刻工艺形成。