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1. 发明授权

US07401988B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07401988B2
公开(公告)日：2008-07-22
申请号：US11673257
申请日：2007-02-09
申请人： Takayuki Katano , Hidefumi Matsui , Junichi Kitano , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura
发明人： Takayuki Katano , Hidefumi Matsui , Junichi Kitano , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura
IPC分类号： G03D5/00 , B05C11/00
CPC分类号： H01L21/67178 , G03F7/70991 , H01L21/67017 , H01L21/6715 , H01L21/67161 , H01L21/67184 , H01L21/67742 , H01L21/67778 , Y10T29/41
摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.
摘要翻译：在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。在各个区域的底部设置用于各区域的排气的排气管。通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

2. 发明授权

US07208066B2 Substrate processing apparatus and substrate processing method 失效
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07208066B2
公开(公告)日：2007-04-24
申请号：US10649780
申请日：2003-08-28
申请人： Junichi Kitano , Yuji Matsuyama , Takahiro Kitano , Takayuki Katano , Hidefumi Matsui , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura , Masatoshi Deguchi , Kousuke Yoshihara , Naruaki Iida
发明人： Junichi Kitano , Yuji Matsuyama , Takahiro Kitano , Takayuki Katano , Hidefumi Matsui , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura , Masatoshi Deguchi , Kousuke Yoshihara , Naruaki Iida
IPC分类号： C23F1/00 , H01L21/306 , B05C11/00
CPC分类号： H01L21/67178 , G03F7/70991 , H01L21/67017 , H01L21/6715 , H01L21/67161 , H01L21/67184 , H01L21/67742 , H01L21/67778 , Y10T29/41
摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.
摘要翻译：在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。在各个区域的底部设置用于各区域的排气的排气管。通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

3. 发明申请

US20070127916A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20070127916A1
公开(公告)日：2007-06-07
申请号：US11673257
申请日：2007-02-09
申请人： Junichi Kitano , Yuji Matsuyama , Takahiro Kitano , Takayuki Katano , Hidefumi Matsui , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura , Masatoshi Deguchi , Kousuke Yoshihara , Naruaki Iida
发明人： Junichi Kitano , Yuji Matsuyama , Takahiro Kitano , Takayuki Katano , Hidefumi Matsui , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura , Masatoshi Deguchi , Kousuke Yoshihara , Naruaki Iida
IPC分类号： G03D5/00
CPC分类号： H01L21/67178 , G03F7/70991 , H01L21/67017 , H01L21/6715 , H01L21/67161 , H01L21/67184 , H01L21/67742 , H01L21/67778 , Y10T29/41
摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.
摘要翻译：在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。在各个区域的底部设置用于各区域的排气的排气管。通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

4. 发明授权

US06485203B2 Substrate processing method and substrate processing apparatus 失效
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US06485203B2
公开(公告)日：2002-11-26
申请号：US09737473
申请日：2000-12-18
申请人： Takayuki Katano , Hidefumi Matsui , Junichi Kitano , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura
发明人： Takayuki Katano , Hidefumi Matsui , Junichi Kitano , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura
IPC分类号： G03D500
CPC分类号： H01L21/67178 , B05C11/08 , H01L21/67248 , H01L21/67742 , H01L21/67748 , H01L21/67754
摘要： A developing unit, a coating unit and a plurality of cooling plates are arranged in a process station which performs a resist coating and so on and a wafer is transferred among them by a substrate transfer device. The temperature of an area to where the wafer is transferred is detected by a temperature/humidity detector and the temperature of the wafer which is cooled by the cooling plates is adjusted accordingly based on a detected value so that the temperature of the wafer when transferred to the coating unit becomes a coating temperature of a processing solution. Thereby, the wafer is transferred to the coating unit while maintaining its temperature with high accuracy to be coated with a resist solution, so that a formation of an uneven processing due to the temperature change can be prevented and a uniform processing can be performed.
摘要翻译：显影单元，涂布单元和多个冷却板布置在执行抗蚀剂涂层等的处理站中，并且通过基板传送装置在晶片之间转印晶片。通过温度/湿度检测器检测晶片转移到的区域的温度，并且基于检测值相应地调节由冷却板冷却的晶片的温度，使得晶片转移到涂布单元成为处理溶液的涂布温度。由此，将晶片转印到涂布单元，同时高精度地保持其温度以涂覆抗蚀剂溶液，从而可以防止由温度变化引起的不均匀处理的形成，并且可以进行均匀的处理。

5. 发明授权

US06617095B2 Evaluating method of hydrophobic process, forming method of resist pattern, and forming system of resist pattern 失效
公开(公告)号：US06617095B2
公开(公告)日：2003-09-09
申请号：US09827095
申请日：2001-04-06
申请人： Junichi Kitano , Keiko Hada , Yuko Ono , Takayuki Katano , Hidefumi Matsui
发明人： Junichi Kitano , Keiko Hada , Yuko Ono , Takayuki Katano , Hidefumi Matsui
IPC分类号： C23C1600
CPC分类号： G03F7/16 , Y10T428/2995
摘要： A HMDS gas is supplied to a surface of a wafer W to perform a hydrophobic process, thereafter the wafer W is contained in an airtight container on a cassette stage, and is transferred to an analyzer provided at an external portion of a resist pattern forming apparatus. The analyzer performs mass spectrometry of the quantity of an ionic species such as CH9Si+, C3H9Si+, C3H9Osi− and the like on the surface of the wafer W using an analyzing section, for example, TOF-SIMS, whereby measuring a HMDS quantity (hexamethyldisilazane) on the surface of the wafer W. This method makes it possible to measure the HMDS quantity on the surface of the wafer W and to evaluate a hydrophobic process state with high reliability.

6. 发明授权

US06333003B1 Treatment apparatus, treatment method, and impurity removing apparatus 失效
标题翻译：处理装置，处理方法和杂质除去装置
公开(公告)号：US06333003B1
公开(公告)日：2001-12-25
申请号：US09083096
申请日：1998-05-22
申请人： Takayuki Katano , Junichi Kitano , Masami Akimoto , Norio Semba
发明人： Takayuki Katano , Junichi Kitano , Masami Akimoto , Norio Semba
IPC分类号： A61L914
CPC分类号： H01L21/67178 , F24F3/161 , G03F7/70858 , H01L21/67017
摘要： A treatment apparatus for treating a substrate in an isolated treatment space in an air-conditioned clean room, comprising a removing unit including a plurality of removing sections for recovering at least some of air in the treatment space and removing impurities from the recovered air, the removing sections being arranged in series and each including a supply mechanism for supplying an impurity remover capable of removing the impurities by touching the recovered air, a temperature adjustment unit for adjusting the temperature of the air cleared of the impurities by the removing unit, and a return circuit for returning the air, adjusted in temperature by the temperature adjustment unit, to the treatment space.
摘要翻译：一种用于处理空调净化室中的分离处理空间中的基板的处理装置，包括：除去单元，其包括多个除去部分，用于回收处理空间中的至少一些空气并从回收的空气中除去杂质; 除去部分串联布置，并且每个部分包括用于提供能够通过接触回收的空气来去除杂质的杂质去除器的供给机构;温度调节单元，用于调节由除去单元排出的杂质的温度;以及返回电路，用于将由温度调节单元调节的空气返回到处理空间。

7. 发明授权

US5928390A Vertical processing apparatus 失效
标题翻译：垂直加工设备
公开(公告)号：US5928390A
公开(公告)日：1999-07-27
申请号：US787862
申请日：1997-01-23
申请人： Hidetami Yaegashi , Takayuki Toshima , Masami Akimoto , Eiji Yamaguchi , Junichi Kitano , Takayuki Katano , Hiroshi Shinya , Naruaki Iida
发明人： Hidetami Yaegashi , Takayuki Toshima , Masami Akimoto , Eiji Yamaguchi , Junichi Kitano , Takayuki Katano , Hiroshi Shinya , Naruaki Iida
IPC分类号： H01L21/00 , H01L21/68 , B23P21/00 , B65G49/07 , H01L21/027
CPC分类号： H01L21/67178 , H01L21/67196 , H01L21/67225 , H01L21/67742 , Y10T29/41
摘要： A processing apparatus comprises a plurality of process unit groups each including a plurality of process units for subjecting an object to a series of processes, the process units being arranged vertically in multiple stages, an object transfer space being defined among the process unit groups, and a transfer mechanism for transferring the object, the transfer mechanism having a transfer member vertically movable in the object transfer space, the transfer member being capable of transferring the object to each of the process units. The processing apparatus further comprises a mechanism for forming a downward air flow in the object transfer space, a mechanism for controlling the quantity of the downward air flow, and a mechanism for controlling the pressure in the object transfer space. Thus, a variation in condition of the object transfer space is reduced.
摘要翻译：处理装置包括多个处理单元组，每个处理单元组包括用于对象进行一系列处理的多个处理单元，处理单元以多级垂直排列，在处理单元组之间定义对象传送空间，以及用于传送物体的传送机构，传送机构具有可在物体传送空间中垂直移动的传送部件，传送部件能够将物体传送到每个处理单元。处理装置还包括用于在物体传送空间中形成向下的空气流的机构，用于控制向下的空气流量的机构，以及用于控制物体传送空间中的压力的机构。因此，物体传送空间的状态的变化减小。

8. 发明授权

US5876280A Substrate treating system and substrate treating method 失效
标题翻译：底物处理系统和底物处理方法
公开(公告)号：US5876280A
公开(公告)日：1999-03-02
申请号：US864937
申请日：1997-05-29
申请人： Junichi Kitano , Hiroshi Shinya , Takayuki Katano , Hidetami Yaegashi , Yasunori Kawakami , Fumihiko Kawano
发明人： Junichi Kitano , Hiroshi Shinya , Takayuki Katano , Hidetami Yaegashi , Yasunori Kawakami , Fumihiko Kawano
IPC分类号： G03F7/20 , H01L21/00 , H01L21/677 , F24F7/06
CPC分类号： H01L21/67173 , G03F7/7075 , H01L21/67017 , H01L21/67178 , H01L21/67778 , Y10S414/14
摘要： The present invention provides a substrate treating system for successively treating a plurality of substrates W under an air-conditioned environment. The system comprises an outer casing provided with a cassette transfer port through which a cassette is transferred, a cassette section having a cassette table arranged within an inner space surrounded by the outer casing for supporting the cassette transferred through the cassette transfer port, a sub-arm mechanism for taking the substrates one by one from the cassette section, a process section positioned adjacent to the cassette section and having a plurality of treating units for treating the substrates arranged therein, a main arm mechanism arranged within the process section for receiving the substrates from the sub-arm mechanism arranged in the cassette section and, then, transferring the received substrates to each of the treating units while transferring the treated substrates out of the treating units, an air supply mechanism for supplying a clean air to form a down-stream within the space surrounded by the outer casing, and a partition plate for partitioning the inner space surrounded by the outer casing not to interfere the down-flow of the air formed by the air supply mechanism, the partition plate having a substrate transfer port through which the substrate is transferred from one of the partitioned spaces to the other partitioned space.
摘要翻译：本发明提供一种用于在空调环境下连续处理多个基板W的基板处理系统。该系统包括设置有盒传送端口的外壳，盒传送通过该盒外壳，盒部具有设置在由外壳包围的内部空间内的盒式表台，用于支撑通过盒式磁带传送端口传送的磁带，用于从盒部分逐个取出基板的臂机构，与盒部分相邻设置的处理部分，并具有用于处理布置在其中的基板的多个处理单元;布置在处理部分内用于接收基板的主臂机构从设置在盒部中的副臂机构，然后将接收到的基板传送到每个处理单元，同时将处理过的基板从处理单元传送出去;空气供应机构，用于供应清洁空气，在由外壳包围的空间内流动，以及用于分隔内部空间的分隔板所述隔板由所述外壳围绕，不会干扰由所述供气机构形成的空气的向下流动，所述隔板具有基板传送口，所述基板通过所述基板传送口从所述分隔空间之一转移到所述另一个分隔空间。

9. 发明授权

US6063439A Processing apparatus and method using solution 失效
标题翻译：处理装置和使用方法的方法
公开(公告)号：US6063439A
公开(公告)日：2000-05-16
申请号：US90882
申请日：1998-06-05
申请人： Norio Semba , Junichi Kitano , Takayuki Katano
发明人： Norio Semba , Junichi Kitano , Takayuki Katano
IPC分类号： G03F7/16 , B01D53/14 , B05B15/12 , B05C11/08 , G03F7/30 , H01L21/00 , H01L21/027 , B05D3/12 , B05C11/02
CPC分类号： H01L21/67178 , B01D53/14 , B05B15/1262 , H01L21/67051 , B05B15/1248 , B05B15/1259 , B05C11/08 , Y02P70/36
摘要： A processing apparatus using solution comprises a rotary table which rotates while holding a substrate thereon, in the processing chamber provided in the casing, a supply mechanism for supplying a processing solution to a surface of the substrate held on the rotary table, and an impurity remover unit, provided outside the casing, wherein the impurity remover unit includes a cleaning unit for cleaning an object gas introduced from the inlet opening by brining it into contact with an impurity remover solution, and the gas-liquid separation mechanism for separating liquid from gas in an exhaust is provided in the exhaust system for exhausting the casing.
摘要翻译：一种使用溶液的处理装置包括：旋转台，其在保持基板的同时保持基板，旋转台在设置在壳体中的处理室中;供给机构，用于将处理溶液供应到保持在旋转台上的基板的表面;以及杂质去除器单元，其设置在所述壳体的外部，其中所述杂质去除器单元包括清洁单元，用于清洁从入口开口引入的物体气体与杂质去除剂溶液接触;以及气液分离机构，用于将液体与气体分离在排气系统中设置排气以排出外壳。

10. 发明授权

US5944894A Substrate treatment system 失效
标题翻译：基材处理系统
公开(公告)号：US5944894A
公开(公告)日：1999-08-31
申请号：US917734
申请日：1997-08-27
申请人： Junichi Kitano , Takayuki Katano , Keiko Kanzawa , Masami Akimoto , Norio Semba
发明人： Junichi Kitano , Takayuki Katano , Keiko Kanzawa , Masami Akimoto , Norio Semba
IPC分类号： F24F3/16 , H01L21/677 , B05B1/28 , B01D47/06 , B05C11/00 , F27B5/04
CPC分类号： F24F3/161 , H01L21/67017 , H01L21/67178
摘要： A substrate treatment system comprises process sections provided with at least either of liquid treatment group units and heat treatment group units, an upper space formed above the process sections in order to supply air to the process sections, a purification section for removing alkaline components from the air to be supplied to the upper spaces to purify the air, temperature/humidity controller communicating with the urification section and the upper spaces to control the temperature and humidity of the air passing through the purification sections, and fans for supplying air to the top spaces from the temperature/humidity controller, lowering the air from the upper spaces into the process sections, and supplying at least some of the air lowering through the process sections to the temperature/humidity controller.
摘要翻译：基板处理系统包括设置有液体处理组单元和热处理组单元中的至少一个的处理部分，形成在处理部分上方的上部空间以向处理部分供应空气;净化部分，用于从供给上部空间以净化空气的空气，与尿素部和上部空间连通的温度/湿度控制器，以控制通过净化部的空气的温度和湿度，以及用于向顶部空间供给空气的风扇从温度/湿度控制器将空气从上部空间降低到处理区域中，并且将至少一些通过处理区域的空气的空气供应到温度/湿度控制器。

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