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1. 发明授权

US07766566B2 Developing treatment apparatus and developing treatment method 有权
标题翻译：开发治疗仪器和开发治疗方法
公开(公告)号：US07766566B2
公开(公告)日：2010-08-03
申请号：US11495732
申请日：2006-07-31
申请人： Takahiro Kitano , Masami Akimoto , Shuuichi Nishikido , Dai Kumagai
发明人： Takahiro Kitano , Masami Akimoto , Shuuichi Nishikido , Dai Kumagai
IPC分类号： G03D5/04
CPC分类号： G03D5/04 , G03F7/30 , G03F7/3021 , H01L21/6715 , H01L21/67748 , Y10S134/902
摘要： In the present invention, a substrate transfer unit into/from which a substrate is transferred from/to the outside of a treatment container and a developing treatment unit in which development of the substrate is performed are arranged side by side in the treatment container, and a carrier mechanism is provided which carries the substrate while grasping an outside surface of the substrate from both sides, between the substrate transfer unit and the developing treatment unit. A developing solution supply nozzle for supplying a developing solution onto the substrate and a gas blow nozzle for blowing a gas to the substrate, are provided between the substrate transfer unit and the developing treatment unit and above a carriage path along which the substrate is carried, and a cleaning solution supply nozzle is provided in the developing treatment unit for supplying a cleaning solution onto the substrate. According to the present invention, since the substrate is carried with its outside surface being grasped, spread of contamination can be prevented to restrain generation of particles in the treatment container.
摘要翻译：在本发明中，在处理容器中并排设置有将基板从处理容器的外部转移到基板转移单元和进行基板的显影的显影处理单元，并且提供了一种承载机构，其承载基板，同时从基板转印单元和显影处理单元之间的两侧抓住基板的外表面。用于将显影液供给到基板上的显影液供给喷嘴和用于将气体吹送到基板的气体吹出喷嘴设置在基板转印单元和显影处理单元之间以及载置基板的滑架路径上方，并且在显影处理单元中设置清洁液供给喷嘴，用于将清洗液供给到基板上。根据本发明，由于基板的外表面被抓住，因此可以防止污染物的扩散，从而抑制处理容器中的颗粒的产生。

2. 发明申请

US20080023049A1 Liquid processing system 有权
标题翻译：液体处理系统
公开(公告)号：US20080023049A1
公开(公告)日：2008-01-31
申请号：US11878385
申请日：2007-07-24
申请人： Kazuhisa Matsumoto , Satoshi Kaneko , Masami Akimoto , Takayuki Toshima , Norihiro Ito
发明人： Kazuhisa Matsumoto , Satoshi Kaneko , Masami Akimoto , Takayuki Toshima , Norihiro Ito
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , H01L21/67017 , H01L21/6708 , H01L21/67173
摘要： A liquid processing system includes a liquid processing section including liquid processing units horizontally disposed therein and each configured to perform a liquid process while supplying a process liquid onto a substrate; a process liquid storing section that stores the process liquid to be supplied to the liquid processing units of the liquid processing section; and a piping unit including a supply pipe configured to guide the process liquid from the process liquid storing section to the liquid processing units. The process liquid storing section, the piping unit, and the liquid processing section are disposed inside a common casing in this order from below. The supply pipe of the piping unit has a horizontal pipe portion horizontally extending along an array direction of the liquid processing units, such that the process liquid is supplied from the horizontal pipe portion to the liquid processing units individually.
摘要翻译：液体处理系统包括液体处理部分，其包括水平地设置在其中的液体处理单元，并且每个液体处理部件被配置为在将处理液体供应到基板上时进行液体处理; 处理液体存储部，其存储要供给到液体处理部的液体处理单元的处理液; 以及管道单元，其包括供给管，其构造成将处理液从所述处理液储存部引导到所述液体处理单元。处理液收容部，配管部和液处理部从下方依次配置在公共壳体的内部。管道单元的供给管具有沿着液体处理单元的排列方向水平延伸的水平管部分，使得处理液体从水平管部分分别供应到液体处理单元。

3. 发明申请

US20070240824A1 Liquid processing apparatus 有权
标题翻译：液体处理设备
公开(公告)号：US20070240824A1
公开(公告)日：2007-10-18
申请号：US11785351
申请日：2007-04-17
申请人： Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Masami Akimoto , Takayuki Toshima , Hiromitsu Nanba
发明人： Satoshi Kaneko , Kazuhisa Matsumoto , Norihiro Ito , Masami Akimoto , Takayuki Toshima , Hiromitsu Nanba
IPC分类号： B05C13/02 , B08B3/00 , H01L21/306
CPC分类号： H01L21/67051 , H01L21/6715 , H01L21/68728 , Y10S134/902
摘要： A liquid processing apparatus includes a substrate holding member configured to rotate along with a substrate held thereon in a horizontal state; a rotary cup configured to surround the substrate and to rotate along with the substrate; a liquid supply mechanism configured to supply a process liquid onto at least a front surface of the substrate; and an exhaust/drain section configured to perform gas-exhausting and liquid-draining out of the rotary cup; and a guide member disposed to surround the substrate, having an upper surface to be substantially continued to the front surface of the substrate, and configured to rotate along with the substrate holding member and the rotary cup, such that a process liquid supplied onto the front surface of the substrate and thrown off from the substrate is guided by the upper surface of the guide member from the rotary cup to the exhaust/drain section.
摘要翻译：一种液体处理装置，包括：基板保持部件，其被构造成与水平状态下保持的基板一起旋转; 旋转杯，其构造成围绕所述基底并与所述基底一起旋转; 液体供给机构，其构造成将处理液体供给到所述基板的至少前表面上; 以及排气/排出部，其构造成从所述旋转杯中排出并排出液体; 以及引导构件，其设置成围绕所述基板，具有基本上连续到所述基板的前表面的上表面，并且被构造成与所述基板保持构件和所述旋转杯一起旋转，使得提供到所述前面的处理液基板的表面从基板被甩出，由引导构件的上表面从旋转杯引导到排气/排出部。

4. 发明申请

US20060165409A1 Coating and developing system and coating and developing method 有权
标题翻译：涂层开发系统及涂层开发方法
公开(公告)号：US20060165409A1
公开(公告)日：2006-07-27
申请号：US11335635
申请日：2006-01-20
申请人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
发明人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
IPC分类号： G03D5/00
CPC分类号： H01L21/67184 , H01L21/00 , H01L21/6715 , H01L21/67178 , H01L21/6719
摘要： A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system is capable of coping with either of a case where antireflection films are formed and a case where any antireflection film is not formed and needs simple software. Film forming unit blocks, namely, a TCT layer B3, a COT layer B4 and a BCT layer B5, and developing unit blocks, namely, DEV layers B1 and B2, are stacked up in layers in a processing block S2. The TCT layer B3, the COT layer B4 and the BCT layer B5 are used selectively in the case where antireflection films are formed and the case where any antireflection film is not formed. The coating and developing system is controlled by a simple carrying program and simple software.
摘要翻译：涂覆显影系统包括：抗蚀剂膜形成单元块和层叠的抗反射膜形成单元块，以形成抗蚀剂膜和抗反射膜下面的抗反射膜以及在小空间中覆盖抗蚀剂膜的抗反射膜。涂层显影系统能够应对形成防反射膜的情况和没有形成任何抗反射膜的情况，并且需要简单的软件。成膜单位块，即TCT层B 3，COT层B 4和BCT层B 5以及显影单元块，即DEV层B 1和B 2，层叠在处理块S 在形成防反射膜的情况下选择性地使用TCT层B 3，COT层B 4和BCT层B 5以及未形成任何抗反射膜的情况。涂层和显影系统由简单的携带程序和简单的软件控制。

5. 发明授权

US06515731B1 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US06515731B1
公开(公告)日：2003-02-04
申请号：US09559472
申请日：2000-04-27
申请人： Masami Akimoto
发明人： Masami Akimoto
IPC分类号： G03B2732
CPC分类号： H01L21/67178 , G03F7/162 , H01L21/67109 , H01L21/6715 , H01L21/67184 , H01L21/67225
摘要： A substrate processing apparatus configured to process a substrate by a photolithography process, comprising a plurality of heating sections for heating substrate, respectively, a plurality of first cooling sections, the number of which is equal to or smaller than the number of the heating sections, for cooling the substrate heated in the heating section to a first temperature, a second cooling section for further cooling the substrate cooled in the first cooling section to a second temperature lower than the first temperature, and a plurality of liquid process sections for supplying a process liquid to the substrate cooled in the second cooling section to form a liquid film of the process liquid on the substrate.
摘要翻译：一种基板处理装置，其被配置为通过光刻处理处理基板，所述基板处理装置包括多个用于加热基板的加热部分，所述多个第一冷却部分的数量等于或小于所述加热部分的数量，用于将在所述加热部中加热的所述基板冷却至第一温度;第二冷却部，用于将在所述第一冷却部中冷却的所述基板进一步冷却至低于所述第一温度的第二温度;以及多个液体处理部，液体流到在第二冷却部分中冷却的衬底，以在衬底上形成工艺液体的液膜。

6. 发明授权

US06475279B1 Substrate processing apparatus and substrate processing method 失效
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US06475279B1
公开(公告)日：2002-11-05
申请号：US09619314
申请日：2000-07-19
申请人： Masami Akimoto
发明人： Masami Akimoto
IPC分类号： B05C1102
CPC分类号： H01L21/67178 , H01L21/67109
摘要： A substrate which has been subjected to heat processing in any of hot plate units is transferred to a normal cooling unit by a transfer device and subjected to cooling processing to some extent, and then transferred to a high accuracy cooling unit and subjected to cooling processing with high accuracy, and thereafter transferred to any of coating units or a developing units. Thereby, the substrate can be subjected to the cooling processing with high accuracy and thereafter to coating processing with no increase in apparatus cost and with no decrease in throughput.
摘要翻译：在热板单元中的任一个中进行了加热处理的基板通过转印装置被转印到通常的冷却单元上并进行一定程度的冷却处理，然后转移到高精度的冷却单元，并进行冷却处理高精度，然后转移到任何涂布单元或显影单元。由此，可以高精度地对基板进行冷却处理，然后进行涂布处理，而不会增加设备成本并且不降低生产量。

7. 发明授权

US06464789B1 Substrate processing apparatus 失效
标题翻译：基板加工装置
公开(公告)号：US06464789B1
公开(公告)日：2002-10-15
申请号：US09589404
申请日：2000-06-08
申请人： Masami Akimoto
发明人： Masami Akimoto
IPC分类号： B05C1100
CPC分类号： H01L21/67109 , Y10S414/135
摘要： A cooling processing unit for cooling a wafer to a predetermined temperature is disposed between a heat processing unit and a set of a resist coating processing unit and a developing processing unit. Pre-cooling units are stacked in multi-stages on top of the cooling processing unit. Immediately after having undergone heat processing in the heat processing unit, the wafer is first transferred to the pre-cooling unit by a first transfer machine. Thereafter, the wafer is transferred to the cooling processing unit by a third transfer machine to be cooled to the predetermined temperature, and then transferred to the resist coating processing unit by a second transfer machine. Thus, over-bake of the wafer can be prevented.
摘要翻译：在热处理单元和一组抗蚀剂涂布处理单元和显影处理单元之间设置用于将晶片冷却至预定温度的冷却处理单元。预冷单元在冷却处理单元的顶部以多级堆叠。在热处理单元中经过热处理之后，首先通过第一转印机将晶片转印到预冷单元。此后，通过第三转印机将晶片转移到冷却处理单元，以冷却到预定温度，然后通过第二转印机转印到抗蚀剂涂布处理单元。因此，可以防止晶片过度烘烤。

8. 发明授权

US06371667B1 Film forming method and film forming apparatus 有权
标题翻译：成膜方法和成膜装置
公开(公告)号：US06371667B1
公开(公告)日：2002-04-16
申请号：US09545003
申请日：2000-04-06
申请人： Takahiro Kitano , Masami Akimoto , Tomohide Minami , Masateru Morikawa
发明人： Takahiro Kitano , Masami Akimoto , Tomohide Minami , Masateru Morikawa
IPC分类号： G03D500
CPC分类号： G03D5/00
摘要： A resist solution discharge nozzle for discharging a resist solution to a wafer is moved at a constant speed along a radial direction of the wafer while the wafer is being rotated. During this movement, the amount of the resist solution to be discharged from the resist solution discharge nozzle is gradually decreased. The resist solution discharged to the wafer is applied to the front surface of the wafer drawing a spiral track, and coating amounts of the resist solution per unit area with respect to a central portion and a peripheral portion of the wafer can be made equal. Accordingly, waste of a processing solution supplied onto a substrate can be eliminated, and a uniform processing solution film can be formed on the substrate.
摘要翻译：用于将抗蚀剂溶液放电到晶片的抗蚀剂溶液排出喷嘴在晶片旋转的同时沿着晶片的径向以恒定的速度移动。在该运动中，从抗蚀剂溶液排出喷嘴排出的抗蚀剂溶液的量逐渐降低。将排出到晶片的抗蚀剂溶液施加到晶片的前表面，从而绘制螺旋轨道，并且可以使相对于晶片的中心部分和周边部分的每单位面积的抗蚀剂溶液的涂布量相等。因此，能够消除供给到基板上的处理液的浪费，能够在基板上形成均匀的处理液膜。

9. 发明授权

US5980591A System for processing a plurality of objects contained in a plurality of cassettes 失效
标题翻译：用于处理包含在多个盒中的多个物体的系统
公开(公告)号：US5980591A
公开(公告)日：1999-11-09
申请号：US916441
申请日：1997-08-22
申请人： Masami Akimoto , Shizuo Ogawa , Toshihiko Nagano
发明人： Masami Akimoto , Shizuo Ogawa , Toshihiko Nagano
IPC分类号： B65G49/07 , H01L21/00 , H01L21/02 , H01L21/027 , H01L21/677 , G06F15/46
CPC分类号： H01L21/67173 , H01L21/67184 , H01L21/67276 , H01L21/67745 , Y10T29/41
摘要： A processing system comprising a loading/unloading section, a processing section and an interface section. The system further comprises a convey mechanism and at least two waiting sections. The convey mechanism can move in either direction between between the loading/unloading section and the interface section, for conveying objects to the processing units included in the processing section and conveying objects in either direction between the loading/unloading section and the interface section. The waiting sections are provided for temporarily holding an object before the convey mechanism conveys an object to the interface section.
摘要翻译：一种处理系统，包括加载/卸载部分，处理部分和接口部分。系统还包括传送机构和至少两个等待部分。传送机构可以在装载/卸载部分和接口部分之间的任一方向上移动，用于将物体传送到包括在处理部分中的处理单元，并且在装载/卸载部分和接口部分之间沿任一方向传送物体。提供等待部分用于在传送机构将对象传送到接口部分之前临时保持物体。

10. 发明授权

US5942013A Substrate processing system 失效
标题翻译：基板加工系统
公开(公告)号：US5942013A
公开(公告)日：1999-08-24
申请号：US928023
申请日：1997-09-11
申请人： Masami Akimoto
发明人： Masami Akimoto
IPC分类号： G03F7/30 , B05C13/00 , H01L21/00 , H01L21/027 , H01L21/306 , H01L21/677 , B05D3/12
CPC分类号： H01L21/67754 , B05C13/00 , H01L21/67173 , H01L21/67178 , Y10T29/41
摘要： A substrate processing system comprises a cassette mounting section having a plurality of cassettes arranged therein, a sub-arm mechanism for transferring the substrate into and out of the cassette within the cassette mounting section, a first transfer path of the sub-arm mechanism extending along the arrangement of the cassettes in the cassette mounting section, a process section including a heat treating section for heating or cooling the substrate and a liquid treating section in which a process liquid is applied to the substrate, a main arm mechanism for transfer of the substrate from and onto the sub-arm mechanism and from and into the process section, and a second transfer path of the main arm mechanism. The heat treating section is positioned higher than the first transfer path, interposed between the cassette mounting section and the second transfer path in respect of a horizontal plane, and comprises a plurality of compartments stacked one upon the other.
摘要翻译：基板处理系统包括：盒安装部，其具有布置在其中的多个盒;副臂机构，用于将所述基板传送到所述盒安装部内的所述盒;所述副臂机构的第一传送路径沿着盒体在盒安装部分中的布置，包括用于加热或冷却基板的热处理部分的处理部分和其中将处理液体施加到基板的液体处理部分，用于传送基板的主臂机构从副臂机构进入和进入加工部分，以及主臂机构的第二传送路径。所述热处理部被定位成高于所述第一传送路径，相对于水平面插入在所述盒安装部和所述第二传送路径之间，并且包括多个彼此堆叠的隔间。

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