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1. 发明授权

US5411430A Scanning optical device and method for making a hybrid scanning lens used therefor 失效
标题翻译：用于制造用于其的混合扫描透镜的扫描光学装置和方法
公开(公告)号：US5411430A
公开(公告)日：1995-05-02
申请号：US950687
申请日：1992-09-25
申请人： Takashi Nishimura , Akira Arimoto , Yoshinori Miyamura , Yumiko Anzai , Yoshimasa Kondo , Fumihiko Uchida , Shigeo Moriyama
发明人： Takashi Nishimura , Akira Arimoto , Yoshinori Miyamura , Yumiko Anzai , Yoshimasa Kondo , Fumihiko Uchida , Shigeo Moriyama
IPC分类号： B23Q1/48 , B23Q1/54 , B24B13/06 , B41J2/47 , G02B26/12 , G05B19/18 , B24B49/00
CPC分类号： B23Q1/5406 , B23Q1/4852 , B24B13/06 , B41J2/471 , G02B26/125 , G05B19/184 , G05B2219/45157
摘要： The present invention provides a hybrid lens having an axially asymmetrical non-spherical shape, good mass productivity, and excellent shape precision surface precision as well as environment resistant property, and a method for fabricating same, as well as a method and a device for a laser printer using that hybrid lens. In particular, there are disclosed a method, by which, when an axially asymmetrical non-spherical convex lens is formed by the replica method, the shape thereof is transcribed with a high precision, as well as a method and a device for fabricating an axially asymmetrical non-spherical concave lens (female die) serving as an original for the transcription. In a device for fabricating a female die by direct grinding, the positions of a rotation axis of an object to be worked and a rotation axis of a grinding wheel are controlled and it has further a function of correcting mounting errors, when the object to be worked and the grinding wheel are mounted.
摘要翻译：本发明提供一种具有轴对称非球面形状，良好的质量生产率和优异的形状精度表面精度以及耐环境性能的混合透镜及其制造方法，以及用于激光打印机使用该混合镜头。特别地，公开了一种方法，当通过复制方法形成轴向不对称非球面凸透镜时，其形状被高精度地转录，以及用于制造轴向非球面凸透镜的方法和装置不对称非球面凹透镜（女模）用作转录的原件。在通过直接研磨制造阴模的装置中，控制被加工物的旋转轴的位置和砂轮的旋转轴的位置，并且还具有校正安装误差的功能，当要被加工的物体工作，砂轮安装。

2. 发明授权

US5107628A Method of fabricating article having aspheric figure and tool for use in carrying out the method 失效
标题翻译：制作具有平面图的文章的方法和用于实施方法的工具
公开(公告)号：US5107628A
公开(公告)日：1992-04-28
申请号：US390107
申请日：1989-08-07
申请人： Yoshimasa Kondo , Shigeo Moriyama , Akira Arimoto , Koji Takahashi , Kenichi Kugai
发明人： Yoshimasa Kondo , Shigeo Moriyama , Akira Arimoto , Koji Takahashi , Kenichi Kugai
IPC分类号： B24B13/00 , B24B13/06
CPC分类号： B24B13/06
摘要： A method of and apparatus for fabricating an article having an aspheric figure, wherein the three-dimensional positional relationship between a work and a grinding spindle as a processing tool is controlled in terms of a polar coordinate system. The grinding spindle extends in a plane which is perpendicular to the direction of rotation of said work and is made to swing along an arcuate path. The distance between the axis of rotation of the work and the axis of the swing of the grinding spindle is changed in relation to the rotational angular position of the work.
摘要翻译：一种用于制造具有非球面图形的制品的方法和装置，其中工件与作为加工工具的磨削主轴之间的三维位置关系是根据极坐标系进行控制的。研磨主轴在与所述工件的旋转方向垂直的平面中延伸并且沿着弓形路径摆动。工件的旋转轴线与磨削主轴的摆动轴线之间的距离相对于工件的旋转角度位置而改变。

3. 发明授权

US5981399A Method and apparatus for fabricating semiconductor devices 失效
标题翻译：用于制造半导体器件的方法和装置
公开(公告)号：US5981399A
公开(公告)日：1999-11-09
申请号：US894308
申请日：1997-08-14
申请人： Yoshio Kawamura , Tatuharu Yamamoto , Shigeo Moriyama , Yoshifumi Kawamoto , Natsuki Yokoyama , Fumihiko Uchida , Minoru Hidaka , Miyako Matsui
发明人： Yoshio Kawamura , Tatuharu Yamamoto , Shigeo Moriyama , Yoshifumi Kawamoto , Natsuki Yokoyama , Fumihiko Uchida , Minoru Hidaka , Miyako Matsui
IPC分类号： B65G49/07 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67167 , H01L21/67196 , H01L21/67742 , H01L21/67748
摘要： A semiconductor device fabrication apparatus having multiple processing chambers for different processes, where a substrate is carried in and out in a sophisticated manner, with their different internal ambient conditions being retained, so that the substrate is free from contamination, thereby manufacturing high-quality semiconductor devices at high throughput. The apparatus includes a movable buffer chamber having a wafer carriage means within a transfer chamber which faces a process chamber, an evacuation means which evacuates of gas the buffer chamber, transfer chamber and process chamber independently, a gas feed means, and a control means.
摘要翻译： PCT No.PCT / JP95 / 00210 Sec。 371日期1997年8月14日 102（e）日期1997年8月14日PCT提交1995年2月15日PCT公布。公开号WO96 / 25760 PCT 日期1996年8月22日一种半导体器件制造装置，具有用于不同工艺的多个处理室，其中衬底以复杂的方式进出，同时保持其不同的内部环境条件，使得衬底没有污染，从而以高产量制造高品质半导体器件。该装置包括可移动缓冲室，其具有面向处理室的传送室内的晶片托架装置，独立地排出缓冲室，传送室和处理室的气体的抽气装置，气体供给装置和控制装置。

4. 发明授权

US5628828A Processing method and equipment for processing a semiconductor device having holder/carrier with flattened surface 失效
标题翻译：用于处理具有平坦表面的保持器/载体的半导体器件的处理方法和设备
公开(公告)号：US5628828A
公开(公告)日：1997-05-13
申请号：US397991
申请日：1995-03-03
申请人： Yoshio Kawamura , Shigeo Moriyama , Tatuharu Yamamoto , Fumihiko Uchida
发明人： Yoshio Kawamura , Shigeo Moriyama , Tatuharu Yamamoto , Fumihiko Uchida
IPC分类号： H01L21/677 , C23C16/44 , C23C16/458 , C23C16/54 , H01L21/00 , H01L21/02 , H01L21/027 , H01L21/304 , C23C16/00
CPC分类号： H01L21/67167 , C23C16/4412 , C23C16/4583 , C23C16/54 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/67748 , Y10S414/139
摘要： Process equipment and method for processing a semiconductor device comprising a buffer chamber, at least one process chamber connected to the buffer chamber through an opening portion, a holding/carrying unit disposed at a position facing the opening portion for holding and carrying a member to be processed such as a wafer, and a carrier unit disposed in the buffer chamber for transferring the member to be processed to and from the holding/carrying unit. The holding/carrying unit includes a flattened surface closely facing the opening portion for holding an atmosphere in the at least one process chamber independently from an atmosphere in the buffer chamber. The opening portion has a flattened surface closely facing the flattened surface of the holding/carrying unit.
摘要翻译：用于处理半导体器件的工艺设备和方法，包括缓冲室，通过开口部连接到缓冲室的至少一个处理室，设置在面向开口部分的位置处的保持/承载单元，用于保持和承载构件处理如晶片，以及设置在缓冲室中的载体单元，用于将待加工的构件传送到保持/携带单元。保持/携带单元包括紧密面向开口部分的平坦表面，用于独立于缓冲室中的气氛保持至少一个处理室中的气氛。开口部具有与保持/承载单元的平坦表面紧密相对的平坦表面。

5. 发明授权

US4739161A Fine displacement transducer employing plural optical fibers 失效
标题翻译：采用多根光纤的精细位移传感器
公开(公告)号：US4739161A
公开(公告)日：1988-04-19
申请号：US870814
申请日：1986-06-05
申请人： Shigeo Moriyama , Fumihiko Uchida
发明人： Shigeo Moriyama , Fumihiko Uchida
IPC分类号： G01B11/00 , G01B11/02 , G01C3/00 , G01C3/06 , G01C3/08 , H01J5/16
CPC分类号： G01B11/026
摘要： A fine displacement transducer, wherein either end of a first and a second optical fibers which are mutually adjacent are respectively provided in alignment with each other opposed to the reflection surface and the illuminating light is made incident from the one end of the first optical fiber and the light irradiated from the other end of the first optical fiber is made to illuminate its reflection surface, while the reflected light therefrom is received by the second optical fiber, so that the amount of displacement of the reflection surface relative to both end surfaces of the second optical fiber can be detected from the variation of intensity of the received light, and a measuring system wherein the reflected light from the reflection surface is received by either of the second or a separately provided third optical fiber to detect the intensity of received light for converting it into the electric signal.
摘要翻译：精细位移传感器，其中彼此相邻的第一和第二光纤的任一端分别设置成与反射表面相对准，并且照明光从第一光纤的一端入射，使从第一光纤的另一端照射的光照射其反射面，同时其反射光被第二光纤接收，使得反射面相对于第二光纤的两个端面的位移量可以从接收光的强度的变化来检测第二光纤，以及测量系统，其中来自反射表面的反射光由第二光纤或单独提供的第三光纤中的任一个接收，以检测接收光的强度将其转换为电信号。

6. 发明授权

US5025268A Optical scanning apparatus and asymmetrical aspheric scanning lens 失效
标题翻译：光学扫描装置和非对称非球面扫描透镜
公开(公告)号：US5025268A
公开(公告)日：1991-06-18
申请号：US377325
申请日：1989-07-10
申请人： Akira Arimoto , Susumu Saito , Yoshito Tsunoda , Shigeo Moriyama , Takeshi Mochizuki
发明人： Akira Arimoto , Susumu Saito , Yoshito Tsunoda , Shigeo Moriyama , Takeshi Mochizuki
IPC分类号： B41J2/47 , G02B3/02 , G02B13/00 , G02B13/18 , G02B26/12 , G02B27/00
CPC分类号： G02B26/125 , B41J2/471 , G02B13/0005 , G02B27/0031 , G02B3/02
摘要： An optical scanning apparatus has a scanning lens with a rotationally asymmetric aspheric surface having individual curvature radii in the main scanning direction and in the sub-scanning direction. The curvature radius in the sub-scanning direction is asymmetrically increased in the lateral direction with the distance from the optical axis. A field curvature aberration which may be generated in the sub-scanning direction on the scanning surface due to an oblique incident of optical beams on the rotating polygonal mirror or the movement of the reflective surface caused by rotation of the rotating polygonal mirror is compensated for by the scanning lens and the focusing properties of the system can be kept at a level of high resolving power.
摘要翻译：光学扫描装置具有在主扫描方向和副扫描方向上具有单独曲率半径的旋转非对称非球面的扫描透镜。副扫描方向的曲率半径与光轴的距离在横向方向上不对称地增加。可以由旋转多面镜上的光束的倾斜入射引起的扫描面上的副扫描方向产生的场曲率像差或由旋转多面镜的旋转引起的反射面的移动而补偿扫描透镜和系统的聚焦属性可以保持在高分辨率的水平。

7. 发明授权

US07137866B2 Polishing apparatus and method for producing semiconductors using the apparatus 有权
公开(公告)号：US07137866B2
公开(公告)日：2006-11-21
申请号：US11267306
申请日：2005-11-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/02 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended.Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate.The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.

8. 发明申请

US20050095960A1 Polishing apparatus and method for producing semiconductors using the apparatus 有权
标题翻译：抛光装置及其制造方法
公开(公告)号：US20050095960A1
公开(公告)日：2005-05-05
申请号：US11004991
申请日：2004-12-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
IPC分类号： B24B37/04 , B24B41/04 , B24B53/12 , B24B49/00 , B24B1/00
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
摘要翻译：本发明涉及一种抛光装置以及使用该装置的半导体制造方法。磨石表面的磨合通过施胶处理进行研磨，由此可以进行工具表面的修整，同时防止在磨石表面产生裂纹，这是产生划痕的原因。此外，可以保证修整工具的表面的平整度，因为切割的尺寸大小; 即使使用了几厘米厚的砂轮，也可以保持平坦度，并且可以总是执行具有较少的面内不均匀性的处理。因此，修整工具的寿命可以大大延长。此外，与晶片的处理联合进行本施胶修整，从而能够提高装置的生产量以及维持处理速度。本装置和方法对于具有不规则性的各种衬底表面的平坦化是有效的。

9. 发明授权

US06612912B2 Method for fabricating semiconductor device and processing apparatus for processing semiconductor device 失效
标题翻译：半导体装置的制造方法以及半导体装置的处理装置
公开(公告)号：US06612912B2
公开(公告)日：2003-09-02
申请号：US09371003
申请日：1999-08-10
申请人： Kan Yasui , Souichi Katagiri , Shigeo Moriyama , Yoshio Kawamura , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato
发明人： Kan Yasui , Souichi Katagiri , Shigeo Moriyama , Yoshio Kawamura , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B1/04 , B24B37/042 , B24B53/12
摘要： A method for fabricating a semiconductor device includes grindstone surface activation treatment by means of a brush or ultrasonic wave carried out when a concave/convex pattern of a semiconductor wafer is planarized by polishing a semiconductor wafer held by a wafer holder by using a grindstone constituted of abrasive grains and material for holding the abrasive grains onto which the semiconductor wafer is pressed with relative motion. The semiconductor wafer is processed with high removal rate and the polishing thickness is controlled accurately.
摘要翻译：一种制造半导体器件的方法包括：当半导体晶片的凹凸图案通过使用由晶片保持器保持的半导体晶片进行平面化而进行的刷子或超声波的磨石表面激活处理，磨料颗粒和用于保持磨料颗粒的材料，半导体晶片被相对运动地压在其上。半导体晶片以高去除率进行处理，并且精确地控制抛光厚度。

10. 发明授权

US4984259A X-ray exposure apparatus 失效
标题翻译： X射线曝光装置
公开(公告)号：US4984259A
公开(公告)日：1991-01-08
申请号：US481682
申请日：1990-02-20
申请人： Masaaki Itou , Shigeo Moriyama
发明人： Masaaki Itou , Shigeo Moriyama
IPC分类号： G21K1/06 , G03F7/20 , G21K5/02 , H01L21/027
CPC分类号： G03F7/70075
摘要： An X-ray exposure apparatus comprises an X-ray source, a reflecting mirror for deflecting an X-ray beam radiated from the X-ray source to an object, and mechanisms for rotating the reflecting mirror about an axis of rotation apart from a reflecting surface of the reflecting mirror. The reflecting mirror has such a shape that the angle of incidence remains constant relative to the X-ray beam at given angles of rotation.

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