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1. 发明授权

US07166013B2 Polishing apparatus and method for producing semiconductors using the apparatus 有权
标题翻译：抛光装置及其制造方法
公开(公告)号：US07166013B2
公开(公告)日：2007-01-23
申请号：US11004991
申请日：2004-12-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
IPC分类号： B24B49/00 , B24B51/00 , B24B1/00 , B24B29/00
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended.Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate.The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
摘要翻译：本发明涉及一种抛光装置以及使用该装置的半导体制造方法。磨石表面的磨合通过施胶处理进行研磨，由此可以进行工具表面的修整，同时防止在磨石表面产生裂纹，这是产生划痕的原因。此外，可以保证修整工具的表面的平整度，因为切割的尺寸大小; 即使使用了几厘米厚的砂轮，也可以保持平坦度，并且可以总是执行具有较少的面内不均匀性的处理。因此，修整工具的寿命可以大大延长。此外，与晶片的处理联合进行本施胶修整，从而能够提高装置的生产量以及维持处理速度。本装置和方法对于具有不规则性的各种衬底表面的平坦化是有效的。

2. 发明申请

US20060057940A1 Polishing apparatus and method for producing semiconductors using the apparatus 有权
公开(公告)号：US20060057940A1
公开(公告)日：2006-03-16
申请号：US11267306
申请日：2005-11-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
IPC分类号： B24B51/00 , B24B7/30 , B24B1/00 , B24B29/00 , B24B21/18
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/02 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.

3. 发明授权

US07137866B2 Polishing apparatus and method for producing semiconductors using the apparatus 有权
公开(公告)号：US07137866B2
公开(公告)日：2006-11-21
申请号：US11267306
申请日：2005-11-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/02 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended.Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate.The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.

4. 发明申请

US20050095960A1 Polishing apparatus and method for producing semiconductors using the apparatus 有权
标题翻译：抛光装置及其制造方法
公开(公告)号：US20050095960A1
公开(公告)日：2005-05-05
申请号：US11004991
申请日：2004-12-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
IPC分类号： B24B37/04 , B24B41/04 , B24B53/12 , B24B49/00 , B24B1/00
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
摘要翻译：本发明涉及一种抛光装置以及使用该装置的半导体制造方法。磨石表面的磨合通过施胶处理进行研磨，由此可以进行工具表面的修整，同时防止在磨石表面产生裂纹，这是产生划痕的原因。此外，可以保证修整工具的表面的平整度，因为切割的尺寸大小; 即使使用了几厘米厚的砂轮，也可以保持平坦度，并且可以总是执行具有较少的面内不均匀性的处理。因此，修整工具的寿命可以大大延长。此外，与晶片的处理联合进行本施胶修整，从而能够提高装置的生产量以及维持处理速度。本装置和方法对于具有不规则性的各种衬底表面的平坦化是有效的。

5. 发明授权

US06336842B1 Rotary machining apparatus 有权
标题翻译：旋转加工机
公开(公告)号：US06336842B1
公开(公告)日：2002-01-08
申请号：US09574285
申请日：2000-05-19
申请人： Shigeo Ootsuki , Shigeo Moriyama , Takashi Kugaya , Kenichi Togawa , Makoto Kajiwara , Shyuichi Oowada , Yukio Suzuki , Yoko Sugawa
发明人： Shigeo Ootsuki , Shigeo Moriyama , Takashi Kugaya , Kenichi Togawa , Makoto Kajiwara , Shyuichi Oowada , Yukio Suzuki , Yoko Sugawa
IPC分类号： B24B4900
CPC分类号： B24B53/017 , B24B49/16
摘要： An object of the present invention is to provide a polishing apparatus which is capable of configuring a surface of a polishing tool without damaging the polishing tool. In order to solve the above-mentioned problem, the present invention provide a rotary machining apparatus comprising a polishing tool for polishing a sample; a rotary disk for holding the polishing tool; a tool for configuring a surface of the polishing tool; and a position adjusting mechanism for adjusting a gap between the tool and the polishing tool, which comprises a rotating mechanism for rotating the tool; and a sensor for sensing a change in the rotation of the rotating mechanism, a height at starting to configure the polishing tool using the tool being determined based on the change in the rotation obtained by the sensor.
摘要翻译：本发明的目的是提供一种能够构造抛光工具的表面而不损坏抛光工具的抛光装置。为了解决上述问题，本发明提供了一种旋转加工装置，其包括抛光用于抛光样品的工具; 用于保持抛光工具的旋转盘; 用于配置抛光工具的表面的工具; 以及位置调节机构，用于调整所述工具和所述研磨工具之间的间隙，所述间隙包括用于旋转所述工具的旋转机构; 以及用于感测旋转机构的旋转变化的传感器，基于由传感器获得的旋转变化确定的，使用该工具来开始构造抛光工具的高度。

6. 发明授权

US4362060A Displacement transducer 失效
标题翻译：位移传感器
公开(公告)号：US4362060A
公开(公告)日：1982-12-07
申请号：US195108
申请日：1980-10-08
申请人： Tsutomu Okayama , Takashi Kugaya
发明人： Tsutomu Okayama , Takashi Kugaya
IPC分类号： G01D3/02 , G01L1/22 , G01R15/00 , G01L9/06 , G01L19/04
CPC分类号： G01L1/2275 , G01D3/021 , G01R15/005
摘要： A displacement transducer for measuring displacement brought about by pressure, strain or the like comprises a sensor for producing an electric signal representative of displacement, an output amplifier for amplifying the signal output from the sensor, an exciting circuit for exciting the sensor with a current or voltage and adapted for controlling excitation in dependence on deviation thereof from a reference value, and a correcting circuit for correcting the excitation of the sensor thereby to correct non-linearity of the output signal from the sensor. The correcting circuit includes a first voltage divider circuitry of a fixed dividing factor and a second voltage divider circuitry of a variable dividing factor connected in parallel with the first divider circuitry. The reference value is corrected by the voltage dividing factor of the second divider circuitry thereby to correct the excitation of the sensor. Correction of the non-linearity of the output signals of negative and positive polarities can be made with only a single correcting circuit.
摘要翻译：用于测量由压力，应变等引起的位移的位移传感器包括用于产生代表位移的电信号的传感器，用于放大从传感器输出的信号的输出放大器，用于以电流或电流激励传感器的激励电路，电压，并且适于根据其与参考值的偏差来控制激励;以及校正电路，用于校正传感器的激励，从而校正来自传感器的输出信号的非线性。校正电路包括固定分频因子的第一分压器电路和与第一分频器电路并联连接的可变分频因子的第二分压器电路。参考值由第二分频器电路的分压系数校正，从而校正传感器的激励。可以仅使用单个校正电路来校正负极性和正极性的输出信号的非线性。

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