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1. 发明授权

US5981399A Method and apparatus for fabricating semiconductor devices 失效
标题翻译：用于制造半导体器件的方法和装置
公开(公告)号：US5981399A
公开(公告)日：1999-11-09
申请号：US894308
申请日：1997-08-14
申请人： Yoshio Kawamura , Tatuharu Yamamoto , Shigeo Moriyama , Yoshifumi Kawamoto , Natsuki Yokoyama , Fumihiko Uchida , Minoru Hidaka , Miyako Matsui
发明人： Yoshio Kawamura , Tatuharu Yamamoto , Shigeo Moriyama , Yoshifumi Kawamoto , Natsuki Yokoyama , Fumihiko Uchida , Minoru Hidaka , Miyako Matsui
IPC分类号： B65G49/07 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67167 , H01L21/67196 , H01L21/67742 , H01L21/67748
摘要： A semiconductor device fabrication apparatus having multiple processing chambers for different processes, where a substrate is carried in and out in a sophisticated manner, with their different internal ambient conditions being retained, so that the substrate is free from contamination, thereby manufacturing high-quality semiconductor devices at high throughput. The apparatus includes a movable buffer chamber having a wafer carriage means within a transfer chamber which faces a process chamber, an evacuation means which evacuates of gas the buffer chamber, transfer chamber and process chamber independently, a gas feed means, and a control means.
摘要翻译： PCT No.PCT / JP95 / 00210 Sec。 371日期1997年8月14日 102（e）日期1997年8月14日PCT提交1995年2月15日PCT公布。公开号WO96 / 25760 PCT 日期1996年8月22日一种半导体器件制造装置，具有用于不同工艺的多个处理室，其中衬底以复杂的方式进出，同时保持其不同的内部环境条件，使得衬底没有污染，从而以高产量制造高品质半导体器件。该装置包括可移动缓冲室，其具有面向处理室的传送室内的晶片托架装置，独立地排出缓冲室，传送室和处理室的气体的抽气装置，气体供给装置和控制装置。

2. 发明授权

US5628828A Processing method and equipment for processing a semiconductor device having holder/carrier with flattened surface 失效
标题翻译：用于处理具有平坦表面的保持器/载体的半导体器件的处理方法和设备
公开(公告)号：US5628828A
公开(公告)日：1997-05-13
申请号：US397991
申请日：1995-03-03
申请人： Yoshio Kawamura , Shigeo Moriyama , Tatuharu Yamamoto , Fumihiko Uchida
发明人： Yoshio Kawamura , Shigeo Moriyama , Tatuharu Yamamoto , Fumihiko Uchida
IPC分类号： H01L21/677 , C23C16/44 , C23C16/458 , C23C16/54 , H01L21/00 , H01L21/02 , H01L21/027 , H01L21/304 , C23C16/00
CPC分类号： H01L21/67167 , C23C16/4412 , C23C16/4583 , C23C16/54 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/67748 , Y10S414/139
摘要： Process equipment and method for processing a semiconductor device comprising a buffer chamber, at least one process chamber connected to the buffer chamber through an opening portion, a holding/carrying unit disposed at a position facing the opening portion for holding and carrying a member to be processed such as a wafer, and a carrier unit disposed in the buffer chamber for transferring the member to be processed to and from the holding/carrying unit. The holding/carrying unit includes a flattened surface closely facing the opening portion for holding an atmosphere in the at least one process chamber independently from an atmosphere in the buffer chamber. The opening portion has a flattened surface closely facing the flattened surface of the holding/carrying unit.
摘要翻译：用于处理半导体器件的工艺设备和方法，包括缓冲室，通过开口部连接到缓冲室的至少一个处理室，设置在面向开口部分的位置处的保持/承载单元，用于保持和承载构件处理如晶片，以及设置在缓冲室中的载体单元，用于将待加工的构件传送到保持/携带单元。保持/携带单元包括紧密面向开口部分的平坦表面，用于独立于缓冲室中的气氛保持至少一个处理室中的气氛。开口部具有与保持/承载单元的平坦表面紧密相对的平坦表面。

3. 发明授权

US5411430A Scanning optical device and method for making a hybrid scanning lens used therefor 失效
标题翻译：用于制造用于其的混合扫描透镜的扫描光学装置和方法
公开(公告)号：US5411430A
公开(公告)日：1995-05-02
申请号：US950687
申请日：1992-09-25
申请人： Takashi Nishimura , Akira Arimoto , Yoshinori Miyamura , Yumiko Anzai , Yoshimasa Kondo , Fumihiko Uchida , Shigeo Moriyama
发明人： Takashi Nishimura , Akira Arimoto , Yoshinori Miyamura , Yumiko Anzai , Yoshimasa Kondo , Fumihiko Uchida , Shigeo Moriyama
IPC分类号： B23Q1/48 , B23Q1/54 , B24B13/06 , B41J2/47 , G02B26/12 , G05B19/18 , B24B49/00
CPC分类号： B23Q1/5406 , B23Q1/4852 , B24B13/06 , B41J2/471 , G02B26/125 , G05B19/184 , G05B2219/45157
摘要： The present invention provides a hybrid lens having an axially asymmetrical non-spherical shape, good mass productivity, and excellent shape precision surface precision as well as environment resistant property, and a method for fabricating same, as well as a method and a device for a laser printer using that hybrid lens. In particular, there are disclosed a method, by which, when an axially asymmetrical non-spherical convex lens is formed by the replica method, the shape thereof is transcribed with a high precision, as well as a method and a device for fabricating an axially asymmetrical non-spherical concave lens (female die) serving as an original for the transcription. In a device for fabricating a female die by direct grinding, the positions of a rotation axis of an object to be worked and a rotation axis of a grinding wheel are controlled and it has further a function of correcting mounting errors, when the object to be worked and the grinding wheel are mounted.
摘要翻译：本发明提供一种具有轴对称非球面形状，良好的质量生产率和优异的形状精度表面精度以及耐环境性能的混合透镜及其制造方法，以及用于激光打印机使用该混合镜头。特别地，公开了一种方法，当通过复制方法形成轴向不对称非球面凸透镜时，其形状被高精度地转录，以及用于制造轴向非球面凸透镜的方法和装置不对称非球面凹透镜（女模）用作转录的原件。在通过直接研磨制造阴模的装置中，控制被加工物的旋转轴的位置和砂轮的旋转轴的位置，并且还具有校正安装误差的功能，当要被加工的物体工作，砂轮安装。

4. 发明授权

US4739161A Fine displacement transducer employing plural optical fibers 失效
标题翻译：采用多根光纤的精细位移传感器
公开(公告)号：US4739161A
公开(公告)日：1988-04-19
申请号：US870814
申请日：1986-06-05
申请人： Shigeo Moriyama , Fumihiko Uchida
发明人： Shigeo Moriyama , Fumihiko Uchida
IPC分类号： G01B11/00 , G01B11/02 , G01C3/00 , G01C3/06 , G01C3/08 , H01J5/16
CPC分类号： G01B11/026
摘要： A fine displacement transducer, wherein either end of a first and a second optical fibers which are mutually adjacent are respectively provided in alignment with each other opposed to the reflection surface and the illuminating light is made incident from the one end of the first optical fiber and the light irradiated from the other end of the first optical fiber is made to illuminate its reflection surface, while the reflected light therefrom is received by the second optical fiber, so that the amount of displacement of the reflection surface relative to both end surfaces of the second optical fiber can be detected from the variation of intensity of the received light, and a measuring system wherein the reflected light from the reflection surface is received by either of the second or a separately provided third optical fiber to detect the intensity of received light for converting it into the electric signal.
摘要翻译：精细位移传感器，其中彼此相邻的第一和第二光纤的任一端分别设置成与反射表面相对准，并且照明光从第一光纤的一端入射，使从第一光纤的另一端照射的光照射其反射面，同时其反射光被第二光纤接收，使得反射面相对于第二光纤的两个端面的位移量可以从接收光的强度的变化来检测第二光纤，以及测量系统，其中来自反射表面的反射光由第二光纤或单独提供的第三光纤中的任一个接收，以检测接收光的强度将其转换为电信号。

5. 发明授权

US06612912B2 Method for fabricating semiconductor device and processing apparatus for processing semiconductor device 失效
标题翻译：半导体装置的制造方法以及半导体装置的处理装置
公开(公告)号：US06612912B2
公开(公告)日：2003-09-02
申请号：US09371003
申请日：1999-08-10
申请人： Kan Yasui , Souichi Katagiri , Shigeo Moriyama , Yoshio Kawamura , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato
发明人： Kan Yasui , Souichi Katagiri , Shigeo Moriyama , Yoshio Kawamura , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B1/04 , B24B37/042 , B24B53/12
摘要： A method for fabricating a semiconductor device includes grindstone surface activation treatment by means of a brush or ultrasonic wave carried out when a concave/convex pattern of a semiconductor wafer is planarized by polishing a semiconductor wafer held by a wafer holder by using a grindstone constituted of abrasive grains and material for holding the abrasive grains onto which the semiconductor wafer is pressed with relative motion. The semiconductor wafer is processed with high removal rate and the polishing thickness is controlled accurately.
摘要翻译：一种制造半导体器件的方法包括：当半导体晶片的凹凸图案通过使用由晶片保持器保持的半导体晶片进行平面化而进行的刷子或超声波的磨石表面激活处理，磨料颗粒和用于保持磨料颗粒的材料，半导体晶片被相对运动地压在其上。半导体晶片以高去除率进行处理，并且精确地控制抛光厚度。

6. 发明授权

US06524961B1 Semiconductor device fabricating method 有权
公开(公告)号：US06524961B1
公开(公告)日：2003-02-25
申请号：US09359760
申请日：1999-07-22
申请人： Souichi Katagiri , Kan Yasui , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato , Yoshio Kawamura , Shigeo Moriyama
发明人： Souichi Katagiri , Kan Yasui , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato , Yoshio Kawamura , Shigeo Moriyama
IPC分类号： H01L21461
CPC分类号： B24B37/245 , B24D3/32 , H01L21/31053 , H01L21/3212 , H01L21/76819 , H01L21/7684
摘要： A film formed on a surface of a wafer on which an integrated circuit is to be constructed can be planarized by using a fixed abrasive tool regardless of the width of elements of a pattern underlying the film. The fixed abrasive tool is liable to form scratches in the surface of the film. A planarizing process of the present invention employs a fixed abrasive tool containing substances harder than the film to be planarized in a content of 10 ppm or below and having a mean pore diameter of 0.2 &mgr;m or below.

7. 发明授权

US5609511A Polishing method 失效
标题翻译：抛光方法
公开(公告)号：US5609511A
公开(公告)日：1997-03-11
申请号：US421247
申请日：1995-04-13
申请人： Shigeo Moriyama , Yoshio Kawamura , Yoshio Homma , Kikuo Kusukawa , Takeshi Furusawa
发明人： Shigeo Moriyama , Yoshio Kawamura , Yoshio Homma , Kikuo Kusukawa , Takeshi Furusawa
IPC分类号： B23Q17/24 , B24B49/04 , B24B49/12 , B24D7/12 , H01L21/304 , B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B49/12 , B24D7/12
摘要： Disclosed is a method of polishing a thin film layer to be polished, which is formed on the surface of a substrate, by pressing the substrate on the surface of a polishing pad and relatively moving the substrate and the polishing pad, the method comprising the steps of: detecting the position of a front surface of the thin film layer to be polished using a first sensor and also detecting the position of a bottom surface of the thin film layer using a second sensor, on the way of the polishing; calculating the residual thickness of the thin film layer on the basis of the detected positions of the front and bottom surfaces of the thin film layer; and controlling the processing condition of the subsequent polishing on the basis of the calculated residual thickness of the thin film layer.
摘要翻译：本发明公开了一种通过将基板压在抛光垫的表面上并使基板和抛光垫相对移动而形成在基板表面上的抛光薄膜层的方法，该方法包括步骤使用第一传感器检测待研磨的薄膜层的前表面的位置，并且在抛光的同时使用第二传感器检测薄膜层的底面的位置; 基于检测到的薄膜层的前表面和底表面的位置计算薄膜层的剩余厚度; 并根据计算出的薄膜层的残留厚度来控制后续研磨的处理条件。

8. 发明授权

US4045141A Photoelectric microscope 失效
标题翻译：光电显微镜
公开(公告)号：US4045141A
公开(公告)日：1977-08-30
申请号：US695556
申请日：1976-06-14
申请人： Shigeo Moriyama , Yoshio Kawamura
发明人： Shigeo Moriyama , Yoshio Kawamura
IPC分类号： G01B9/04 , G01B11/02
CPC分类号： G01B9/04 , G01B11/02
摘要： Description is made of improvements in a photoelectric microscope which is employed for the measurement of a very small distance. According to this invention, an optical system for making point-symmetric images is disposed in an optical path of an objective of a photoelectric microscope so as to form on an identical focal plane a pair of (two) images of a reference line (or mark) on a test piece which are in the relation of point symmetry to each other, and the distance between the pair of (two) images is measured, whereby the deviating distance of the reference line (or mark) on the test piece from the optic axis of the objective is evaluated. The distance between the pair of images is evaluated by gauging the time difference between two detection signals which are obtained by scanning the pair of images at equal speeds with photoelectric detectors.
摘要翻译：描述用于测量非常小距离的光电显微镜的改进。根据本发明，用于制造点对称图像的光学系统设置在光电显微镜的物镜的光路中，以便在同一焦平面上形成参考线（或标记）的一对（两个）图像），并且测量一对（两个）图像之间的距离，由此测试片上的参考线（或标记）与光学元件的偏离距离评估目标轴。通过测量通过用光电检测器以等速扫描一对图像而获得的两个检测信号之间的时间差来评估该对图像之间的距离。

9. 发明授权

US4798470A Pattern printing method and apparatus 失效
标题翻译：图案印刷方法和装置
公开(公告)号：US4798470A
公开(公告)日：1989-01-17
申请号：US927939
申请日：1986-11-07
申请人： Shigeo Moriyama , Toshiei Kurosaki , Tsuneo Terasawa , Shinji Okazaki , Yoshio Kawamura
发明人： Shigeo Moriyama , Toshiei Kurosaki , Tsuneo Terasawa , Shinji Okazaki , Yoshio Kawamura
IPC分类号： G03F9/00 , G01B11/00
CPC分类号： G03F9/7026 , G03F9/7076 , G03F9/7084
摘要： A pattern printing method includes a step of printing a pattern on a wafer on the basis of a target mark provided on the surface of the wafer which is opposite to the surface thereof on which the pattern is to be printed. Also disclosed is a pattern printing apparatus which comprises detecting means for detecting a target mark provided on the surface of a wafer which is opposite to the surface thereof on which a pattern is to be printed, and pattern printing means for printing the pattern on the pattern printing surface of the wafer on the basis of mark position data obtained by the detecting means.
摘要翻译：图案印刷方法包括基于设置在与要印刷图案的表面相对的晶片表面上的目标标记在晶片上印刷图案的步骤。还公开了一种图案打印装置，其包括检测装置，用于检测设置在与其上要印刷图案的表面相对的晶片表面上的目标标记，以及用于在图案上印刷图案的图案印刷装置基于由检测装置获得的标记位置数据，晶片的印刷表面。

10. 发明授权

US4153341A Automatic focusing apparatus 失效
标题翻译：自动对焦装置
公开(公告)号：US4153341A
公开(公告)日：1979-05-08
申请号：US783141
申请日：1977-03-31
申请人： Yoshio Kawamura , Shigeo Moriyama
发明人： Yoshio Kawamura , Shigeo Moriyama
IPC分类号： G03B13/36 , G02B7/28 , G02B21/00 , G03B27/34 , G11B7/09 , H01L21/027 , H01L21/30 , H04N5/232 , G02B7/11
CPC分类号： G11B7/0914 , G02B7/28
摘要： This invention relates to an automatic focusing apparatus, in that a position of a substrate mounted on the base of the apparatus is detected as a pressure value by a first detecting means, such as an air micrometer, in that second detecting means, such as an air micrometer, are provided on a portion of the apparatus to determine a reference pressure, gas supplied into the second detecting means is derived from the same supply source as that of the first detecting means, and further, in that the base can be controlled and moved until the difference between the reference pressure and the detected pressure reaches a predetermined constant value, whereby the surface of the sample can be automatically positioned at a desired focusing position.
摘要翻译：本发明涉及一种自动聚焦装置，其特征在于，通过第一检测装置（例如气流千分尺）将安装在装置的基座上的基板的位置作为压力值检测为第二检测装置，例如空气千分表设置在设备的一部分上以确定参考压力，供应到第二检测装置中的气体源自与第一检测装置相同的供应源，并且还可以控制基座，移动直到参考压力和检测到的压力之间的差达到预定的恒定值，由此样品的表面可以自动地定位在期望的聚焦位置。

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