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    • 2. 发明申请
    • Uniform batch film deposition process and films so produced
    • 均匀分批膜沉积工艺和薄膜如此生产
    • US20070010072A1
    • 2007-01-11
    • US11482887
    • 2006-07-07
    • Robert BaileyTaiqing QiuCole PorterOlivier LaparraRobert ChathamMartin MogaardHelmuth Treichel
    • Robert BaileyTaiqing QiuCole PorterOlivier LaparraRobert ChathamMartin MogaardHelmuth Treichel
    • H01L21/20
    • C23C16/54C23C16/308C23C16/345C23C16/402C23C16/45504C23C16/45578H01L21/0214H01L21/02164H01L21/0217H01L21/02222H01L21/02271H01L21/02274H01L21/3145H01L21/31612H01L21/3185
    • A batch of wafer substrates is provided with each wafer substrate having a surface. Each surface is coated with a layer of material applied simultaneously to the surface of each of the batch of wafer substrates. The layer of material is applied to a thickness that varies less than four thickness percent across the surface and exclusive of an edge boundary and having a wafer-to-wafer thickness variation of less than three percent. The layer of material so applied is a silicon oxide, silicon nitride or silicon oxynitride with the layer of material being devoid of carbon and chlorine. Formation of silicon oxide or a silicon oxynitride requires the inclusion of a co-reactant. Silicon nitride is also formed with the inclusion of a nitrification co-reactant. A process for forming such a batch of wafer substrates involves feeding the precursor into a reactor containing a batch of wafer substrates and reacting the precursor at a wafer substrate temperature, total pressure, and precursor flow rate sufficient to create such a layer of material. The delivery of a precursor and co-reactant as needed through vertical tube injectors having multiple orifices with at least one orifice in registry with each of the batch of wafer substrates and exit slits within the reactor to create flow across the surface of each of the wafer substrates in the batch provides the within-wafer and wafer-to-wafer uniformity.
    • 一批晶片基板设置有每个晶片基板具有表面。 每个表面涂覆有同时施加到每批晶片衬底的表面的一层材料。 该材料层被施加到在整个表面上变化小于四个厚度百分比的厚度,而不是边缘边界,并且晶片到晶片的厚度变化小于3%。 如此施加的材料层是氧化硅,氮化硅或氮氧化硅,其中该材料层不含碳和氯。 氧化硅或氮氧化硅的形成需要包含共反应物。 氮化氮也通过包含硝化共反应物形成。 用于形成这样一批晶片衬底的方法包括将前体进料到含有一批晶片衬底的反应器中,并在足以产生这种材料层的晶片衬底温度,总压力和前体流速下使前体反应。 根据需要通过具有多个孔的垂直管注射器输送前体和共反应物,其中至少一个孔与反应器内的每批晶片基板和出口狭缝对齐,以产生跨过每个晶片的表面的流动 该批次中的衬底提供了晶片内和晶片与晶片之间的均匀性。
    • 6. 发明申请
    • Method and Apparatus for Cleaning a Substrate
    • 清洗基材的方法和装置
    • US20120111360A1
    • 2012-05-10
    • US12943868
    • 2010-11-10
    • Helmuth TreichelFlint ThorneRito Ligutom
    • Helmuth TreichelFlint ThorneRito Ligutom
    • B08B7/00A46B13/00
    • B08B1/02A46B13/001A46B2200/3086B08B1/04H01L21/67046H01L21/67219
    • An integrated cleaner for processing disks is provided. The integrated cleaner includes a pair of spaced apart scrubbers each having a plurality of spaced apart brushes disposed along a length of the scrubbers, the pair of spaced apart scrubbers oriented horizontally and configured to receive a vertically oriented disk therebetween. A track is disposed below a gap defined between the pair of spaced apart scrubbers. The track guides an edge of the disk as the disk travels between ends of the pair of spaced apart scrubbers. The plurality of spaced apart brushes includes a first and/or second pair of opposing brushes having a roughness that is greater than a second and/or third pair of brushes downstream from the first and/or second pair of brushes, respectively. The integrated cleaner includes an edge cleaner configured to exert a force along an edge of the vertically oriented disk during a portion of travel of the vertically oriented disk along the track. A method of cleaning a substrate is also provided.
    • 提供了一种用于处理磁盘的集成清洁器。 集成清洁器包括一对间隔开的洗涤器,每个洗涤器具有沿洗涤器长度设置的多个间隔开的刷子,一对间隔开的洗涤器水平地定向并且构造成在其间容纳垂直取向的盘。 轨道设置在限定在一对间隔开的洗涤器之间的间隙的下方。 当盘在两对间隔开的洗涤器的端部之间行进时,轨道引导盘的边缘。 多个间隔开的刷子包括第一和/或第二对相对的刷子,其具有大于分别从第一和/或第二对刷子下游的第二和/或第三对刷子的粗糙度。 集成清洁器包括边缘清洁器,其构造成在垂直定向的盘沿着轨道的行进的一部分期间沿着垂直取向的盘的边缘施加力。 还提供了清洁基板的方法。
    • 8. 发明申请
    • SUBSTRATE NEST WITH DRIP REMOVER
    • 基板NEST与DRIP REMOVER
    • US20110186088A1
    • 2011-08-04
    • US12697260
    • 2010-01-31
    • Kenneth C. MillerRito LigutomHelmuth TreichelFlint Thorne
    • Kenneth C. MillerRito LigutomHelmuth TreichelFlint Thorne
    • B08B3/00
    • H01L21/67057H01L21/67313
    • An apparatus for supporting a work piece is provided. The apparatus includes outer support rails having support slots for supporting the work piece, the outer support rails disposed on opposing sides of the apparatus between opposing end members of the apparatus. Inner support rails extend between the opposing end members of the apparatus. An inner surface of each of the inner support rails has vertically disposed extensions extending therefrom. The vertically disposed extensions are aligned in pairs along a length of the inner support rails. A moveable device is disposed between the pairs of vertically disposed extensions. The moveable device is buoyantly moveable so that as the work piece is lifted, the moveable device follows. A method for cleaning a work piece is also included.
    • 提供一种用于支撑工件的装置。 该装置包括具有用于支撑工件的支撑槽的外部支撑轨道,设置在该装置的相对端部构件的相对侧上的外部支撑轨道。 内部支撑轨道在装置的相对的端部构件之间延伸。 每个内部支撑轨道的内表面具有从其延伸的垂直设置的延伸部。 垂直设置的延伸部沿着内部支撑轨道的长度成对排列。 可移动装置设置在成对的垂直设置的延伸部之间。 可移动装置是可浮动的,因此当工件被提起时,移动装置跟随。 还包括用于清洁工件的方法。