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1. 发明授权

US06875091B2 Method and apparatus for conditioning a polishing pad with sonic energy 失效
标题翻译：用声波能量调理抛光垫的方法和装置
公开(公告)号：US06875091B2
公开(公告)日：2005-04-05
申请号：US09796955
申请日：2001-02-28
申请人： Allan M. Radman , Alan J. Jensen , Helmuth Treichel , Robert G. Boehm , Michael S. Lacy , Eric A. Dunton
发明人： Allan M. Radman , Alan J. Jensen , Helmuth Treichel , Robert G. Boehm , Michael S. Lacy , Eric A. Dunton
IPC分类号： B24B1/04 , B24B37/04 , B24B53/007 , B24B53/10 , B24B53/07
CPC分类号： B24B1/04 , B24B53/017 , B24B53/10
摘要： A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer. The method includes positioning a sonic energy generator above the polishing surface of the polishing pad, and applying sonic energy to the polishing surface of the polishing pad. The apparatus a sonic energy generator adapted to be positioned above the polishing surface, the sonic energy generator including a transducer, and a liquid carrier in flow communication with the transducer, wherein the transducer transmits sonic energy into the liquid carrier and the liquid carrier is applied to the polishing surface of the polishing belt.
摘要翻译：描述了一种用于调整抛光垫的方法和装置，其中抛光垫具有用于抛光半导体晶片的抛光表面。该方法包括将抛光垫的抛光表面上方的声能量发生器定位，并将抛光垫的抛光表面施加声能。所述设备适于定位在所述抛光表面上方，所述声能发生器包括换能器和与所述换能器流动连通的液体载体，其中所述换能器将声能传递到所述液体载体中，并且所述液体载体被施加到抛光带的抛光表面。

2. 发明授权

US06884156B2 Multi-layer polishing pad material for CMP 有权
标题翻译： CMP多层抛光垫材料
公开(公告)号：US06884156B2
公开(公告)日：2005-04-26
申请号：US10463680
申请日：2003-06-17
申请人： Abaneshwar Prasad , Roland K. Sevilla , Michael S. Lacy
发明人： Abaneshwar Prasad , Roland K. Sevilla , Michael S. Lacy
IPC分类号： B24B7/30 , B24B37/20 , B24D3/32 , B24D13/14 , B24D11/00
CPC分类号： B24B37/205 , B24D3/32
摘要： The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.
摘要翻译：本发明涉及一种用于化学机械抛光的多层抛光垫，其包括抛光层和底层，其中抛光层和底层在不使用粘合剂的情况下连接在一起。本发明还涉及一种包括光学透射多层抛光垫材料的抛光垫，其中抛光垫材料的层在不使用粘合剂的情况下连接在一起。

3. 发明授权

US06547651B1 Subaperture chemical mechanical planarization with polishing pad conditioning 有权
公开(公告)号：US06547651B1
公开(公告)日：2003-04-15
申请号：US09709972
申请日：2000-11-10
申请人： John M. Boyd , Michael S. Lacy , David G. Halley
发明人： John M. Boyd , Michael S. Lacy , David G. Halley
IPC分类号： B24B722
CPC分类号： B24B37/245 , B24B37/20 , B24B37/26 , B24D9/085
摘要： Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a platen assembly for holding an object having a target surface to be planarized. A polishing pad is configured to contact the object during planarization with a contact portion over a contact area which is smaller in area than the target surface. The polishing pad has a noncontact portion which is not in contact with the object during planarization. The polishing pad is movable relative to the object to move the noncontact portion in contact with the object and move the contact portion out of contact with the object. A conditioner is configured to condition the noncontact portion of the polishing pad. The noncontact portion of the polishing pad may be conditioned continuously during planarization of the object by the polishing pad. An abrasive may be delivered to the contact area between the polishing pad and the target surface of the object.

4. 发明授权

US06953515B2 Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection 失效
标题翻译：在抛光垫中提供信号端口用于光学端点检测的装置和方法
公开(公告)号：US06953515B2
公开(公告)日：2005-10-11
申请号：US10460502
申请日：2003-06-11
申请人： John M. Boyd , Michael S. Lacy
发明人： John M. Boyd , Michael S. Lacy
IPC分类号： B24B37/20 , B24B49/12 , B24D13/14 , B24B1/00
CPC分类号： B24B37/205 , B24B49/12
摘要： A method and apparatus for providing a substantially constant environment in the cavity surrounding the optical pathway during the chemical mechanical planarization (CMP) operation is provided. In one embodiment, a system for planarizing the surface of a substrate is provided. The system includes a platen configured to rotate about its center axis. The platen supports an optical view-port assembly for assisting in determining a thickness of a layer of the substrate. A polishing pad disposed over the platen is included. The polishing pad has an aperture overlying a window of the optical view-port assembly. A carrier for holding the substrate over the polishing pad is also included. A cavity defined between the surface of the substrate and the window is included. A fluid delivery system adapted to provide a stable environment in the cavity during a chemical mechanical planarization (CMP) operation is included.
摘要翻译：提供了一种用于在化学机械平面化（CMP）操作期间在围绕光学路径的空腔中提供基本上恒定的环境的方法和装置。在一个实施例中，提供了用于平坦化衬底的表面的系统。该系统包括构造成围绕其中心轴线旋转的压板。压板支撑用于辅助确定衬底层的厚度的光学视口组件。包括设置在压板上的抛光垫。抛光垫具有覆盖在光学视口组件的窗口上的孔。还包括用于将衬底保持在抛光垫上的载体。包括在基板的表面和窗口之间限定的空腔。包括适于在化学机械平面化（CMP）操作期间在空腔中提供稳定环境的流体输送系统。

5. 发明授权

US06495464B1 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool 失效
标题翻译：固定磨料基材的制备方法和装置，并用于集束CMP工具
公开(公告)号：US06495464B1
公开(公告)日：2002-12-17
申请号：US09609590
申请日：2000-06-30
申请人： John M. Boyd , Michael S. Lacy
发明人： John M. Boyd , Michael S. Lacy
IPC分类号： H01L21302
CPC分类号： B24D11/001 , B24B7/228
摘要： A method of creating and using a polishing substrate having a coating layer that includes providing a substrate having a predetermined pattern disposed on a surface of the substrate and coating the surface of the substrate with an abrasive to form a coated substrate conforming to the predetermined pattern is described. In addition, an apparatus enabling preparation and use of a fixed abrasive polishing member is described that includes a patterned substrate, an abrasive coating a surface of the patterned substrate and a vacuum deposition chamber in which the abrasive is applied to the surface of the substrate. In addition, rather than a fixed abrasive, non-abrasive material may be applied to the surface of the patterned substrate, in which case, a conventional slurry may be used in planarization of an applied semiconductor wafer.
摘要翻译：一种制造和使用具有涂层的抛光基板的方法，所述抛光基板包括提供具有设置在所述基板的表面上的预定图案的基板并用磨料涂覆所述基板的表面以形成符合所述预定图案的涂覆基板，描述。此外，描述了一种能够制备和使用固定研磨抛光构件的装置，其包括图案化衬底，图案化衬底的表面的磨料涂层和其中将磨料施加到衬底的表面的真空沉积室。此外，可以将非研磨材料施加到图案化衬底的表面上，而不是固定的研磨剂，在这种情况下，常规的浆料可用于所施加的半导体晶片的平坦化。

6. 发明授权

US06809031B1 Method for manufacturing a reclaimable test pattern wafer for CMP applications 失效
标题翻译：制造用于CMP应用的可回收测试图案晶片的方法
公开(公告)号：US06809031B1
公开(公告)日：2004-10-26
申请号：US09752610
申请日：2000-12-27
申请人： Michael S. Lacy
发明人： Michael S. Lacy
IPC分类号： H01L21302
CPC分类号： H01L22/34 , H01L21/31051
摘要： In a method for manufacturing a test pattern wafer, a silicon substrate is provided. A sacrificial oxide layer is deposited over the silicon substrate, and simulated transistor structure test features are fabricated into and on the sacrificial oxide layer. Chemical mechanical polishing characterization is performed using the test pattern wafer which provides data for the characterization of the chemical mechanical polishing. The sacrificial oxide layer is then stripped along with the simulated transistor structure test features, allowing the silicon substrate to be reclaimed and to be used in the fabrication of subsequent test pattern wafers.
摘要翻译：在制造测试图案晶片的方法中，提供硅衬底。在硅衬底上沉积牺牲氧化物层，并且将模拟的晶体管结构测试特征制造在牺牲氧化物层中和上。使用提供化学机械抛光表征的数据的测试图案晶片进行化学机械抛光表征。然后将牺牲氧化物层与模拟的晶体管结构测试特征一起剥离，允许回收硅衬底并用于后续测试图案晶片的制造。

7. 发明授权

US06609961B2 Chemical mechanical planarization belt assembly and method of assembly 失效
公开(公告)号：US06609961B2
公开(公告)日：2003-08-26
申请号：US09757452
申请日：2001-01-09
申请人： Michael S. Lacy , John M. Boyd
发明人： Michael S. Lacy , John M. Boyd
IPC分类号： B24B2100
CPC分类号： B24B37/04 , B24D11/02
摘要： A method of producing a chemical mechanical planarization (CMP) polishing belt structure is disclosed that includes forming a strip of substantially rigid material into a support belt having an interior surface and an exterior surface. At least a portion of the exterior surface of the support belt is altered to form a plurality of gripping members integral with the exterior surface of the support belt. An interior surface of a seamless CMP belt is applied to the exterior surface of the support belt such that the plurality of gripping members engage the interior surface of the seamless CMP belt in a non-slip grip.

8. 发明授权

US06599765B1 Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection 失效
标题翻译：在抛光垫中提供信号端口用于光学端点检测的装置和方法
公开(公告)号：US06599765B1
公开(公告)日：2003-07-29
申请号：US10016883
申请日：2001-12-12
申请人： John M. Boyd , Michael S. Lacy
发明人： John M. Boyd , Michael S. Lacy
IPC分类号： H01L2100
CPC分类号： B24B37/205 , B24B49/12
摘要： A method and apparatus for providing a substantially constant environment in the cavity surrounding the optical pathway during the chemical mechanical planarization (CMP) operation is provided. In one embodiment, a system for planarizing the surface of a substrate is provided. The system includes a platen configured to rotate about its center axis. The platen supports an optical view-port assembly for assisting in determining a thickness of a layer of the substrate. A polishing pad disposed over the platen is included. The polishing pad has an aperture overlying a window of the optical view-port assembly. A carrier for holding the substrate over the polishing pad is also included. A cavity defined between the surface of the substrate and the window is included. A fluid delivery system adapted to provide a stable environment in the cavity during a chemical mechanical planarization (CMP) operation is included.
摘要翻译：提供了一种用于在化学机械平面化（CMP）操作期间在围绕光学路径的空腔中提供基本上恒定的环境的方法和装置。在一个实施例中，提供了用于平坦化衬底的表面的系统。该系统包括构造成围绕其中心轴线旋转的压板。压板支撑用于辅助确定衬底层的厚度的光学视口组件。包括设置在压板上的抛光垫。抛光垫具有覆盖在光学视口组件的窗口上的孔。还包括用于将衬底保持在抛光垫上的载体。包括在基板的表面和窗口之间限定的空腔。包括适于在化学机械平面化（CMP）操作期间在空腔中提供稳定环境的流体输送系统。

9. 发明授权

US06554688B2 Method and apparatus for conditioning a polishing pad with sonic energy 失效
公开(公告)号：US06554688B2
公开(公告)日：2003-04-29
申请号：US09754702
申请日：2001-01-04
申请人： Michael S. Lacy
发明人： Michael S. Lacy
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B1/04 , B24B53/10
摘要： A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer, and a back surface opposed to the polishing surface. The method includes positioning a sonic energy generator adjacent to the back surface of the polishing pad, and generating sonic energy through the back surface of the polishing pad. The apparatus includes a sonic energy generator adapted to be positioned adjacent the back surface, the sonic energy generator including a transducer connected to a contact member, wherein the sonic energy generator is adapted to transmit sonic energy in a direction through the back surface and to the polishing surface of the polishing belt.

10. 发明授权

US07435161B2 Multi-layer polishing pad material for CMP 有权
标题翻译：用于CMP的多层抛光垫材料
公开(公告)号：US07435161B2
公开(公告)日：2008-10-14
申请号：US11113498
申请日：2005-04-25
申请人： Abaneshwar Prasad , Michael S. Lacy
发明人： Abaneshwar Prasad , Michael S. Lacy
IPC分类号： B24B1/00
CPC分类号： B24D3/32 , B24B37/205 , B24B37/22
摘要： The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, the polishing layer being joined to the bottom layer without the use of an adhesive; the polishing layer having an average surface roughness, Ra, that is greater than the Ra of the bottom layer.
摘要翻译：本发明涉及一种用于化学机械抛光的多层抛光垫，其包括多孔抛光层和多孔底层，其中底层与抛光层基本上共同延伸，抛光层连接到底层，而没有使用粘合剂; 抛光层的平均表面粗糙度Ra大于底层的Ra。

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