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    • 2. 发明申请
    • PROCESS AND APPARATUS FOR REMOVAL OF CONTAMINATING MATERIAL FROM SUBSTRATES
    • 从基板上去除污染材料的工艺和装置
    • US20120129344A1
    • 2012-05-24
    • US13263639
    • 2010-04-08
    • Helmuth TreichelDave BohlingJeffrey Farber
    • Helmuth TreichelDave BohlingJeffrey Farber
    • H01L21/306C11D7/60
    • C11D11/0047C11D7/3245
    • A process for removing contaminating metals from a substrate to improve electrical performance is provided. Polycationic metals are known to be particularly detrimental to the electrical properties of an insulator or semiconductor substrate. The process includes the exposure of the substrate to an aqueous solution of at least one compound of the formula: (I) where n in each occurrence is independently an integer value between 0 and 6, and X is independently in each occurrence H, NR4, Li, Na or K and at least one of X is NR4; where R in each occurrence is independently H or C1-C6 alkyl, to improve electrical performance of the substrate. A kit for preparing such a solution includes a 1-20 total weight percent aqueous concentrate of at least one compound of formula (I). The kit also provides instructions for the dilution of the concentrate to form the solution.
    • 提供了从基板去除污染金属以改善电性能的方法。 已知多阳离子金属对绝缘体或半导体衬底的电性能特别有害。 该方法包括将底物暴露于至少一种下式化合物的水溶液:(I)其中每次出现的n独立地为0至6之间的整数,X在每次出现时独立地为H,NR4, Li,Na或K,X中的至少一个为NR 4; 其中每次出现的R独立地为H或C 1 -C 6烷基,以改善基材的电性能。 用于制备这种溶液的试剂盒包括1-20重量%的至少一种式(I)化合物的总重量百分比含水浓缩物。 该试剂盒还提供稀释浓缩物以形成溶液的说明书。